Xavier Francois Brun

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additively manufactured structures for heat dissipation from integr...
- Patent number 12,080,620
- Issue date Sep 3, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures for underfill containment
- Patent number 12,002,727
- Issue date Jun 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,817,390
- Issue date Nov 14, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level passive heat spreader interposer to enable improved the...
- Patent number 11,804,470
- Issue date Oct 31, 2023
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,756,860
- Issue date Sep 12, 2023
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metallization (BSM) on stacked die packages and external s...
- Patent number 11,705,417
- Issue date Jul 18, 2023
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,640,942
- Issue date May 2, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,302,643
- Issue date Apr 12, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation apparatus, separation system, and separation method
- Patent number 10,071,544
- Issue date Sep 11, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation method, computer storage medium, and separation system
- Patent number 10,008,419
- Issue date Jun 26, 2018
- Tokyo Electron Limited
- Shinji Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation method, separation apparatus, and separation system
- Patent number 9,956,755
- Issue date May 1, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling device, peeling system and peeling method
- Patent number 9,919,509
- Issue date Mar 20, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation apparatus, separation system, and separation method
- Patent number 9,827,756
- Issue date Nov 28, 2017
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener tape for electronic assembly
- Patent number 9,793,151
- Issue date Oct 17, 2017
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures to mitigate contamination on a back side of a semiconduc...
- Patent number 9,698,108
- Issue date Jul 4, 2017
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conveyance apparatus and substrate peeling system
- Patent number 9,679,798
- Issue date Jun 13, 2017
- Tokyo Electron Limited
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stiffener tape for electronic assembly that includes wafer or panel
- Patent number 9,620,404
- Issue date Apr 11, 2017
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted handling of highly warped substrates post temporary b...
- Patent number 9,437,468
- Issue date Sep 6, 2016
- Intel Corporation
- Xavier F. Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laser ablation tape for solder interconnect formation
- Patent number 8,969,134
- Issue date Mar 3, 2015
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE
- Publication number 20240395567
- Publication date Nov 28, 2024
- Intel Corporation
- Jonas G. Croissant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRU...
- Publication number 20240332353
- Publication date Oct 3, 2024
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20240234245
- Publication date Jul 11, 2024
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT LAYER FOR BUMP CHIP ATTACH
- Publication number 20240178097
- Publication date May 30, 2024
- Intel Corporation
- Frederick Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
- Publication number 20240153837
- Publication date May 9, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING
- Publication number 20240113073
- Publication date Apr 4, 2024
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
- Publication number 20240063147
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240061194
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- G02 - OPTICS
Information Patent Application
INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMP...
- Publication number 20240063071
- Publication date Feb 22, 2024
- Intel Corporation
- Jeffery Bielefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...
- Publication number 20240063076
- Publication date Feb 22, 2024
- Intel Corporation
- Mohammad Enamul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063179
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS
- Publication number 20240063136
- Publication date Feb 22, 2024
- Intel Corporation
- Haris Khan Niazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
- Publication number 20240063142
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20240030142
- Publication date Jan 25, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR MINIMAL UNDERFILL KEEP-OUT ZONES
- Publication number 20240006312
- Publication date Jan 4, 2024
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE FILM WITH OVERHANG FOR DIE SIDEWALL PROTECTION
- Publication number 20230317546
- Publication date Oct 5, 2023
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...
- Publication number 20230317549
- Publication date Oct 5, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH EDGE RING ANCHORING
- Publication number 20230307341
- Publication date Sep 28, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES
- Publication number 20230271445
- Publication date Aug 31, 2023
- Intel Corporation
- Feras Eid
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HYBRID BONDED STACKED MEMORY WITH TSV AS CHIPLET FOR PACKAGE STRUCTURE
- Publication number 20230207475
- Publication date Jun 29, 2023
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECT...
- Publication number 20230197664
- Publication date Jun 22, 2023
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20230197679
- Publication date Jun 22, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20230134770
- Publication date May 4, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS

Xavier Francois Brun

Person

Patents Grantslast 30 patents

Additively manufactured structures for heat dissipation from integr...

Thermally enhanced silicon back end layers for improved thermal per...

Barrier structures for underfill containment

Semiconductor device stack-up with bulk substrate material to mitig...

Microelectronic component having molded regions with through-mold vias

Wafer level passive heat spreader interposer to enable improved the...

Semiconductor device stack-up with bulk substrate material to mitig...

Backside metallization (BSM) on stacked die packages and external s...

Microelectronic component having molded regions with through-mold vias

Microelectronic component having molded regions with through-mold vias

Separation apparatus, separation system, and separation method

Separation method, computer storage medium, and separation system

Separation method, separation apparatus, and separation system

Peeling device, peeling system and peeling method

Separation apparatus, separation system, and separation method

Stiffener tape for electronic assembly

Structures to mitigate contamination on a back side of a semiconduc...

Substrate conveyance apparatus and substrate peeling system

Solder-on-die using water-soluble resist system and method

Stiffener tape for electronic assembly that includes wafer or panel

Heat assisted handling of highly warped substrates post temporary b...

Laser ablation tape for solder interconnect formation

Patents Applicationslast 30 patents

ON DIE FLEXURE CONTROL DEVICE AND METHOD

SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRU...

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

PERMANENT LAYER FOR BUMP CHIP ATTACH

BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING

SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...

QUASI-MONOLITHIC DIE ARCHITECTURES

PHOTONIC QUASI-MONOLITHIC DIE ARCHITECTURES

INORGANIC MATERIAL DEPOSITION FOR INTER-DIE FILL IN MULTI-CHIP COMP...

INTEGRATED CONFORMAL THERMAL HEAT SPREADER FOR MULTICHIP COMPOSITE...

QUASI-MONOLITHIC DIE ARCHITECTURES

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...

INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS

DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

BARRIER FOR MINIMAL UNDERFILL KEEP-OUT ZONES

DIE BACKSIDE FILM WITH OVERHANG FOR DIE SIDEWALL PROTECTION

POROUS MESH STRUCTURES FOR THE THERMAL MANAGEMENT OF INTEGRATED CIR...

PACKAGING ARCHITECTURE WITH EDGE RING ANCHORING

REUSABLE COMPOSITE STENCIL FOR SPRAY PROCESSES

HYBRID BONDED STACKED MEMORY WITH TSV AS CHIPLET FOR PACKAGE STRUCTURE

SOLID COMPONENT COUPLED TO DIES IN MULTI-CHIP PACKAGE USING DIELECT...

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS