Xi CEN

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for low resistivity and stress tungsten gap fill
- Patent number 12,094,773
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tungsten gapfill using molybdenum co-flow
- Patent number 12,014,956
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst enhanced molybdenum deposition and gap fill
- Patent number 11,859,277
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low resistivity and stress tungsten gap fill
- Patent number 11,798,845
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyst enhanced seamless ruthenium gap fill
- Patent number 11,680,312
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyst enhanced seamless ruthenium gap fill
- Patent number 11,401,602
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,380,536
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal gapfill
- Patent number 11,355,391
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL
- Publication number 20240282631
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS TUNGSTEN LAYER DEPOSITION
- Publication number 20240266215
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER
- Publication number 20240258109
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...
- Publication number 20240209500
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREA...
- Publication number 20240162089
- Publication date May 16, 2024
- Applied Materials, Inc.
- Dixiong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
- Publication number 20240047268
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Peiqi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH
- Publication number 20240014072
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL ENHANCEMENT WITH THERMAL ETCH
- Publication number 20230317458
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Kai WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20230290679
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN GAPFILL USING MOLYBDENUM CO-FLOW
- Publication number 20230109501
- Publication date Apr 6, 2023
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...
- Publication number 20230023235
- Publication date Jan 26, 2023
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Catalyst Enhanced Molybdenum Deposition And Gap Fill
- Publication number 20220372617
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES
- Publication number 20220359279
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST ENHANCED SEAMLESS RUTHENIUM GAP FILL
- Publication number 20220333232
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220336274
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20220325410
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL
- Publication number 20220270871
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
- Publication number 20220130724
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low Resistivity Tungsten Film And Method Of Manufacture
- Publication number 20220068709
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Feihu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Step Pre-Clean for Selective Metal Gap Fill
- Publication number 20210351032
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20210285102
- Publication date Sep 16, 2021
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST ENHANCED SEAMLESS RUTHENIUM GAP FILL
- Publication number 20210214842
- Publication date Jul 15, 2021
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING A METAL GAPFILL
- Publication number 20200303250
- Publication date Sep 24, 2020
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods for low resistivity and stress tungsten gap fill

Tungsten gapfill using molybdenum co-flow

Catalyst enhanced molybdenum deposition and gap fill

Methods and apparatus for low resistivity and stress tungsten gap fill

Multi-step pre-clean for selective metal gap fill

Catalyst enhanced seamless ruthenium gap fill

Catalyst enhanced seamless ruthenium gap fill

Multi-step pre-clean for selective metal gap fill

Method for forming a metal gapfill

Patents Applicationslast 30 patents

INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL

LOW STRESS TUNGSTEN LAYER DEPOSITION

METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER

PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...

SURFACE DEPASSIVATION WITH THERMAL ETCH AFTER NITROGEN RADICAL TREA...

METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES

NITROGEN PLASMA TREATMENT FOR BOTTOM-UP GROWTH

GAP FILL ENHANCEMENT WITH THERMAL ETCH

TUNGSTEN MOLYBDENUM STRUCTURES

TUNGSTEN GAPFILL USING MOLYBDENUM CO-FLOW

ENHANCED STRESS TUNING AND INTERFACIAL ADHESION FOR TUNGSTEN (W) GA...

Catalyst Enhanced Molybdenum Deposition And Gap Fill

METHODS OF FORMING VOID AND SEAM FREE METAL FEATURES

CATALYST ENHANCED SEAMLESS RUTHENIUM GAP FILL

METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

GAP FILL METHODS USING CATALYZED DEPOSITION

MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL

METHODS AND APPARATUS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL

Low Resistivity Tungsten Film And Method Of Manufacture

Multi-Step Pre-Clean for Selective Metal Gap Fill

GAP FILL METHODS USING CATALYZED DEPOSITION

CATALYST ENHANCED SEAMLESS RUTHENIUM GAP FILL

METHOD FOR FORMING A METAL GAPFILL