Xian J. Ning

Person

Mohegan Lake, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lithography alignment and overlay measurement marks formed by resis...
- Patent number 6,979,526
- Issue date Dec 27, 2005
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical MIMCap manufacturing method
- Patent number 6,960,365
- Issue date Nov 1, 2005
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM MTJ stack to conductive line alignment method
- Patent number 6,858,441
- Issue date Feb 22, 2005
- Infineon Technologies AG
- Joachim Nuetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material combinations for tunnel junction cap layer, tunnel junctio...
- Patent number 6,815,248
- Issue date Nov 9, 2004
- Infineon Technologies AG
- Rainer Leuschner
- G11 - INFORMATION STORAGE
Information Patent Grant
MIM capacitor structures and fabrication methods in dual-damascene...
- Patent number 6,794,262
- Issue date Sep 21, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design of lithography alignment and overlay measurement marks on CM...
- Patent number 6,780,775
- Issue date Aug 24, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for generating alignment marks for manufacturing MIM capacitors
- Patent number 6,750,115
- Issue date Jun 15, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a metal-insulator-metal capacitor using plate-thr...
- Patent number 6,723,600
- Issue date Apr 20, 2004
- International Business Machines Corporation
- Kwong H. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single RIE process for MIMcap top and bottom plates
- Patent number 6,713,395
- Issue date Mar 30, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a metal cap layer for preventing damascene...
- Patent number 6,709,874
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated circuit having embedded vertica...
- Patent number 6,706,588
- Issue date Mar 16, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned conductive line for cross-point magnetic memory integr...
- Patent number 6,692,898
- Issue date Feb 17, 2004
- Infineon Technologies AG
- Xian J. Ning
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked MIMCap between Cu dual damascene levels
- Patent number 6,677,635
- Issue date Jan 13, 2004
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plate-through hard mask for MRAM devices
- Patent number 6,635,496
- Issue date Oct 21, 2003
- Infineon Technologies, AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a metal-insulator-metal (MIM) capacitor
- Patent number 6,620,701
- Issue date Sep 16, 2003
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned cross-point MRAM device with aluminum metallization la...
- Patent number 6,611,453
- Issue date Aug 26, 2003
- Infineon Technologies AG
- Xian J. Ning
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-aligned double-sided vertical MIMcap
- Patent number 6,451,667
- Issue date Sep 17, 2002
- Infineon Technologies AG
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal hard mask for ILD RIE processing of semiconductor memory devi...
- Patent number 6,440,753
- Issue date Aug 27, 2002
- Infineon Technologies North America Corp.
- Xian J. Ning
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Dry process for cleaning residues/polymers after metal etch
- Patent number 6,184,134
- Issue date Feb 6, 2001
- Infineon Technologies North America Corp.
- Nirmal Chaudhary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene with bond pads
- Patent number 6,033,984
- Issue date Mar 7, 2000
- Siemens Aktiengesellschaft
- Rainer Florian Schnabel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting under-etched vias
- Patent number 5,903,343
- Issue date May 11, 1999
- Siemens Aktiengesellschaft
- Xian J. Ning
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Wafer surface cleaning apparatus and method
- Patent number 5,865,901
- Issue date Feb 2, 1999
- Siemens Aktiengesellschaft
- Xiaoming Yin
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR GENERATING ALIGNMENT MARKS FOR MANUFACTURING MIM CAPACITORS
- Publication number 20040102014
- Publication date May 27, 2004
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM capacitor structures and fabrication methods in dual-damascene...
- Publication number 20040056324
- Publication date Mar 25, 2004
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM MTJ stack to conductive line alignment method
- Publication number 20040043579
- Publication date Mar 4, 2004
- Joachim Nuetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lithography alignment and overlay measurement marks formed by resis...
- Publication number 20030224260
- Publication date Dec 4, 2003
- Infineon Technologies North America Corp.
- Xian J. Ning
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Material combinations for tunnel junction cap layer, tunnel junctio...
- Publication number 20030199104
- Publication date Oct 23, 2003
- Infineon Technologies North America Corp.
- Rainer Leuschner
- G11 - INFORMATION STORAGE
Information Patent Application
Vertical MIMCap manufacturing method
- Publication number 20030143322
- Publication date Jul 31, 2003
- Infineon Technologies North America Corp.
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked metal-insulator-metal capacitor structures in between inter...
- Publication number 20030113974
- Publication date Jun 19, 2003
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plate-through hard mask for MRAM devices
- Publication number 20030073251
- Publication date Apr 17, 2003
- Infineon Technologies North America Corp.
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical/horizontal MIMCap method
- Publication number 20030073282
- Publication date Apr 17, 2003
- Infineon Technologies North America Corp.
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIMCap with high dielectric constant insulator
- Publication number 20030006480
- Publication date Jan 9, 2003
- Jenny Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making stacked MIMCap between Cu dual-damascene levels
- Publication number 20020182794
- Publication date Dec 5, 2002
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single rie process for mimcap top and bottom plates
- Publication number 20020173159
- Publication date Nov 21, 2002
- Infineon Technologies North America Corp.
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a metal-insulator-metal capacitor using plate-thr...
- Publication number 20020153551
- Publication date Oct 24, 2002
- International Business Machines Corporation
- Kwong H. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HARD MASK FOR ILD RIE PROCESSING OF SEMICONDUCTOR MEMORY DEVI...
- Publication number 20020098676
- Publication date Jul 25, 2002
- Xian J. Ning
- B82 - NANO-TECHNOLOGY
Information Patent Application
A method of manufacturing a metal cap layer for preventing damascen...
- Publication number 20020096775
- Publication date Jul 25, 2002
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned cross-point MRAM device with aluminum metallization la...
- Publication number 20020097600
- Publication date Jul 25, 2002
- Xian J. Ning
- B82 - NANO-TECHNOLOGY
Information Patent Application
Design of lithography alignment and overlay measurement marks on CM...
- Publication number 20020098707
- Publication date Jul 25, 2002
- Infineon Technologies North America Corp.
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned conductive line for cross-point magnetic memory integr...
- Publication number 20020098281
- Publication date Jul 25, 2002
- Xian J. Ning
- B82 - NANO-TECHNOLOGY
Information Patent Application
Self-aligned double-sided vertical MIMcap
- Publication number 20020081814
- Publication date Jun 27, 2002
- Xian J. Ning
- H01 - BASIC ELECTRIC ELEMENTS

Xian J. Ning

Person

Patents Grantslast 30 patents

Lithography alignment and overlay measurement marks formed by resis...

Vertical MIMCap manufacturing method

MRAM MTJ stack to conductive line alignment method

Material combinations for tunnel junction cap layer, tunnel junctio...

MIM capacitor structures and fabrication methods in dual-damascene...

Design of lithography alignment and overlay measurement marks on CM...

Method for generating alignment marks for manufacturing MIM capacitors

Method for making a metal-insulator-metal capacitor using plate-thr...

Single RIE process for MIMcap top and bottom plates

Method of manufacturing a metal cap layer for preventing damascene...

Method of fabricating an integrated circuit having embedded vertica...

Self-aligned conductive line for cross-point magnetic memory integr...

Stacked MIMCap between Cu dual damascene levels

Plate-through hard mask for MRAM devices

Method of fabricating a metal-insulator-metal (MIM) capacitor

Self-aligned cross-point MRAM device with aluminum metallization la...

Self-aligned double-sided vertical MIMcap

Metal hard mask for ILD RIE processing of semiconductor memory devi...

Dry process for cleaning residues/polymers after metal etch

Dual damascene with bond pads

Method for detecting under-etched vias

Wafer surface cleaning apparatus and method

Patents Applicationslast 30 patents

METHOD FOR GENERATING ALIGNMENT MARKS FOR MANUFACTURING MIM CAPACITORS

MIM capacitor structures and fabrication methods in dual-damascene...

MRAM MTJ stack to conductive line alignment method

Lithography alignment and overlay measurement marks formed by resis...

Material combinations for tunnel junction cap layer, tunnel junctio...

Vertical MIMCap manufacturing method

Stacked metal-insulator-metal capacitor structures in between inter...

Plate-through hard mask for MRAM devices

Vertical/horizontal MIMCap method

MIMCap with high dielectric constant insulator

Method of making stacked MIMCap between Cu dual-damascene levels

Single rie process for mimcap top and bottom plates

Method for making a metal-insulator-metal capacitor using plate-thr...

METAL HARD MASK FOR ILD RIE PROCESSING OF SEMICONDUCTOR MEMORY DEVI...

A method of manufacturing a metal cap layer for preventing damascen...

Self-aligned cross-point MRAM device with aluminum metallization la...

Design of lithography alignment and overlay measurement marks on CM...

Self-aligned conductive line for cross-point magnetic memory integr...

Self-aligned double-sided vertical MIMcap