Xiao Liu

Person

Rolla, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multifunctional materials for temporary bonding
- Patent number 12,024,594
- Issue date Jul 2, 2024
- Brewer Science, Inc.
- Luke M. Prenger
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laser-releasable bonding materials for 3-D IC applications
- Patent number 11,610,801
- Issue date Mar 21, 2023
- Brewer Science, Inc.
- Luke Prenger
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Laser-releasable bonding materials for 3-D IC applications
- Patent number 10,968,348
- Issue date Apr 6, 2021
- Brewer Science, Inc.
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimides as laser release materials for 3-D IC applications
- Patent number 9,827,740
- Issue date Nov 28, 2017
- Brewer Science Inc.
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20240222259
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
- Publication number 20230187257
- Publication date Jun 15, 2023
- Brewer Science, Inc.
- Luke Prenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF M...
- Publication number 20220262755
- Publication date Aug 18, 2022
- Brewer Science, Inc.
- Chia-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS
- Publication number 20220127496
- Publication date Apr 28, 2022
- Brewer Science, Inc.
- Rama Puligadda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT BONDING AND PATTERNING MATERIAL
- Publication number 20220049095
- Publication date Feb 17, 2022
- Brewer Science, Inc.
- Xiao Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING
- Publication number 20210332188
- Publication date Oct 28, 2021
- Brewer Science, Inc.
- Luke M. Prenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT BONDING AND PATTERNING MATERIAL
- Publication number 20210033975
- Publication date Feb 4, 2021
- Brewer Science, Inc.
- Reihaneh Sejoubsari
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
- Publication number 20200234993
- Publication date Jul 23, 2020
- Brewer Science, Inc.
- Luke Prenger
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
- Publication number 20190194453
- Publication date Jun 27, 2019
- Brewer Science, Inc.
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS
- Publication number 20160023436
- Publication date Jan 28, 2016
- BREWER SCIENCE INC.
- Xiao Liu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Person

Patents Grantslast 30 patents

Multifunctional materials for temporary bonding

Laser-releasable bonding materials for 3-D IC applications

Laser-releasable bonding materials for 3-D IC applications

Polyimides as laser release materials for 3-D IC applications

Patents Applicationslast 30 patents

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS

TEMPORARY BONDING AND DEBONDING PROCESS TO PREVENT DEFORMATION OF M...

PHOTONIC DEBONDING FOR WAFER-LEVEL PACKAGING APPLICATIONS

PERMANENT BONDING AND PATTERNING MATERIAL

MULTIFUNCTIONAL MATERIALS FOR TEMPORARY BONDING

PERMANENT BONDING AND PATTERNING MATERIAL

LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS

LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS

POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS