Xiaojin WEI

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Containment heatsink for packaged battery cells
- Patent number 11,081,738
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Robert B. Schlak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe and vapor chamber heat dissipation
- Patent number 10,966,351
- Issue date Mar 30, 2021
- ELPIS TECHNOLOGIES INC.
- Xiaojin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery pack capacity optimization via self-regulation of cell temp...
- Patent number 10,903,534
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Noah Singer
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Cooled containment compartments for packaged battery cells
- Patent number 10,797,359
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Noah Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe and vapor chamber heat dissipation
- Patent number 10,575,440
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Xiaojin Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooled containment compartments for packaged battery cells
- Patent number 10,374,263
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Noah Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooled containment compartments for packaged battery cells
- Patent number 10,374,264
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Noah Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing electronic package with heat transfer element(s)
- Patent number 10,237,964
- Issue date Mar 19, 2019
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat pipe and vapor chamber heat dissipation
- Patent number 10,045,464
- Issue date Aug 7, 2018
- International Business Machines Corporation
- Xiaojin Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat pipe and vapor chamber heat dissipation
- Patent number 9,980,410
- Issue date May 22, 2018
- International Business Machines Corporation
- Xiaojin Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible coolant manifold—heat sink assembly
- Patent number 9,913,403
- Issue date Mar 6, 2018
- International Business Machines Corporations
- Francis R. Krug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Changeable, airflow venting cover assembly for an electronics rack
- Patent number 9,894,807
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Seth E. Bard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management in a multi-phase power system
- Patent number 9,639,105
- Issue date May 2, 2017
- International Business Machines Corporation
- Gary F. Goth
- G05 - CONTROLLING REGULATING
Information Patent Grant
Control of solid state memory device temperature using queue depth...
- Patent number 9,619,166
- Issue date Apr 11, 2017
- International Business Machines Corporation
- Craig A. Bickelman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal management in a multi-phase power system
- Patent number 9,606,562
- Issue date Mar 28, 2017
- International Business Machines Corporation
- Gary F. Goth
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electronic package with heat transfer element(s)
- Patent number 9,560,737
- Issue date Jan 31, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of solid state memory device temperature using queue depth...
- Patent number 9,501,069
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Craig A. Bickelman
- G05 - CONTROLLING REGULATING
Information Patent Grant
Flexible coolant manifold-heat sink assembly
- Patent number 9,504,184
- Issue date Nov 22, 2016
- International Business Machines Corporation
- Francis R. Krug
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of solid state memory device temperature using queue depth...
- Patent number 9,423,804
- Issue date Aug 23, 2016
- International Business Machines Corporation
- Craig A. Bickelman
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor package structures having liquid cooler integrated wi...
- Patent number 8,772,927
- Issue date Jul 8, 2014
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and package for circuit chip packaging
- Patent number 8,455,998
- Issue date Jun 4, 2013
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal management of 3-D stacked die packaging
- Patent number 8,299,608
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip accelerated failure indicator
- Patent number 8,274,301
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Kai D. Feng
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package structures having liquid coolers integrated w...
- Patent number 8,115,303
- Issue date Feb 14, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and package for circuit chip packaging
- Patent number 8,053,284
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric 3D cooling
- Patent number 8,030,113
- Issue date Oct 4, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Segmentation of a die stack for 3D packaging thermal management
- Patent number 7,928,562
- Issue date Apr 19, 2011
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric 3D cooling
- Patent number 7,893,529
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HEAT PIPE AND VAPOR CHAMBER HEAT DISSIPATION
- Publication number 20200084917
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Xiaojin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PACK CAPACITY OPTIMIZATION VIA SELF-REGULATION OF CELL TEMP...
- Publication number 20190372179
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Noah SINGER
- B60 - VEHICLES IN GENERAL
Information Patent Application
COOLED CONTAINMENT COMPARTMENTS FOR PACKAGED BATTERY CELLS
- Publication number 20190296402
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Noah Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLAST TUBING FOR PACKAGING BATTERY CELLS
- Publication number 20190280354
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Robert B. Schlak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAINMENT HEATSINK FOR PACKAGED BATTERY CELLS
- Publication number 20190280352
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Robert B. Schlak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED CONTAINMENT COMPARTMENTS FOR PACKAGED BATTERY CELLS
- Publication number 20190067750
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Noah Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED CONTAINMENT COMPARTMENTS FOR PACKAGED BATTERY CELLS
- Publication number 20190067749
- Publication date Feb 28, 2019
- International Business Machines Corporation
- Noah Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT PIPE AND VAPOR CHAMBER HEAT DISSIPATION
- Publication number 20180288902
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Xiaojin Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL OF SOLID STATE MEMORY DEVICE TEMPERATURE USING QUEUE DEPTH...
- Publication number 20160357475
- Publication date Dec 8, 2016
- International Business Machines Corporation
- Craig A. Bickelman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE COOLANT MANIFOLD - HEAT SINK ASSEMBLY
- Publication number 20160295741
- Publication date Oct 6, 2016
- International Business Machines Corporation
- Francis R. KRUG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)
- Publication number 20160262253
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Phillip D. ISAACS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)
- Publication number 20160262270
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Phillip D. ISAACS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE COOLANT MANIFOLD - HEAT SINK ASSEMBLY
- Publication number 20160242318
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Francis R. KRUG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHANGEABLE, AIRFLOW VENTING COVER ASSEMBLY FOR AN ELECTRONICS RACK
- Publication number 20160215999
- Publication date Jul 28, 2016
- International Business Machines Corporation
- Seth E. BARD
- F24 - HEATING RANGES VENTILATING
Information Patent Application
CONTROL OF SOLID STATE MEMORY DEVICE TEMPERATURE USING QUEUE DEPTH...
- Publication number 20160170421
- Publication date Jun 16, 2016
- International Business Machines Corporation
- Craig A. Bickelman
- G05 - CONTROLLING REGULATING
Information Patent Application
THERMAL MANAGEMENT IN A MULTI-PHASE POWER SYSTEM
- Publication number 20160141950
- Publication date May 19, 2016
- International Business Machines Corporation
- Gary F. Goth
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMAL MANAGEMENT IN A MULTI-PHASE POWER SYSTEM
- Publication number 20160139619
- Publication date May 19, 2016
- International Business Machines Corporation
- Gary F. Goth
- G05 - CONTROLLING REGULATING
Information Patent Application
CONTROL OF SOLID STATE MEMORY DEVICE TEMPERATURE USING QUEUE DEPTH...
- Publication number 20150261281
- Publication date Sep 17, 2015
- International Business Machines Corporation
- Craig A. Bickelman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structures Having Liquid Cooler Integrated wi...
- Publication number 20120049341
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING
- Publication number 20120018873
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING
- Publication number 20120007229
- Publication date Jan 12, 2012
- International Business Machines Corporation
- Gerald K. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Accelerated Failure Indicator
- Publication number 20110102005
- Publication date May 5, 2011
- International Business Machines Corporation
- Kai D. Feng
- G01 - MEASURING TESTING
Information Patent Application
Thermoelectric 3D Cooling
- Publication number 20110104846
- Publication date May 5, 2011
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING
- Publication number 20110037167
- Publication date Feb 17, 2011
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC 3D COOLING
- Publication number 20100176506
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Louis Lu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT
- Publication number 20100019377
- Publication date Jan 28, 2010
- International Business Machines Corporation
- Amilcar R. Arvelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Structures Having Liquid Coolers Integrated w...
- Publication number 20090283902
- Publication date Nov 19, 2009
- Raschid Jose Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL AREA SEMICONDUCTOR COOLING SYSTEM
- Publication number 20090179323
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Kai Di Feng
- H01 - BASIC ELECTRIC ELEMENTS

Xiaojin WEI

Person

Patents Grantslast 30 patents

Containment heatsink for packaged battery cells

Heat pipe and vapor chamber heat dissipation

Battery pack capacity optimization via self-regulation of cell temp...

Cooled containment compartments for packaged battery cells

Heat pipe and vapor chamber heat dissipation

Cooled containment compartments for packaged battery cells

Cooled containment compartments for packaged battery cells

Manufacturing electronic package with heat transfer element(s)

Heat pipe and vapor chamber heat dissipation

Heat pipe and vapor chamber heat dissipation

Flexible coolant manifold—heat sink assembly

Changeable, airflow venting cover assembly for an electronics rack

Thermal management in a multi-phase power system

Control of solid state memory device temperature using queue depth...

Thermal management in a multi-phase power system

Electronic package with heat transfer element(s)

Control of solid state memory device temperature using queue depth...

Flexible coolant manifold-heat sink assembly

Control of solid state memory device temperature using queue depth...

Semiconductor package structures having liquid cooler integrated wi...

Structures and methods to reduce maximum current density in a solde...

Method and package for circuit chip packaging

Structures and methods to reduce maximum current density in a solde...

Enhanced thermal management of 3-D stacked die packaging

On-chip accelerated failure indicator

Semiconductor package structures having liquid coolers integrated w...

Method and package for circuit chip packaging

Thermoelectric 3D cooling

Segmentation of a die stack for 3D packaging thermal management

Thermoelectric 3D cooling

Patents Applicationslast 30 patents

HEAT PIPE AND VAPOR CHAMBER HEAT DISSIPATION

BATTERY PACK CAPACITY OPTIMIZATION VIA SELF-REGULATION OF CELL TEMP...

COOLED CONTAINMENT COMPARTMENTS FOR PACKAGED BATTERY CELLS

BLAST TUBING FOR PACKAGING BATTERY CELLS

CONTAINMENT HEATSINK FOR PACKAGED BATTERY CELLS

COOLED CONTAINMENT COMPARTMENTS FOR PACKAGED BATTERY CELLS

COOLED CONTAINMENT COMPARTMENTS FOR PACKAGED BATTERY CELLS

HEAT PIPE AND VAPOR CHAMBER HEAT DISSIPATION

CONTROL OF SOLID STATE MEMORY DEVICE TEMPERATURE USING QUEUE DEPTH...

FLEXIBLE COOLANT MANIFOLD - HEAT SINK ASSEMBLY

ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)

ELECTRONIC PACKAGE WITH HEAT TRANSFER ELEMENT(S)

FLEXIBLE COOLANT MANIFOLD - HEAT SINK ASSEMBLY

CHANGEABLE, AIRFLOW VENTING COVER ASSEMBLY FOR AN ELECTRONICS RACK

CONTROL OF SOLID STATE MEMORY DEVICE TEMPERATURE USING QUEUE DEPTH...

THERMAL MANAGEMENT IN A MULTI-PHASE POWER SYSTEM

THERMAL MANAGEMENT IN A MULTI-PHASE POWER SYSTEM

CONTROL OF SOLID STATE MEMORY DEVICE TEMPERATURE USING QUEUE DEPTH...

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

Semiconductor Package Structures Having Liquid Cooler Integrated wi...

METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING

ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

On-Chip Accelerated Failure Indicator

Thermoelectric 3D Cooling

METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING

THERMOELECTRIC 3D COOLING

SEGMENTATION OF A DIE STACK FOR 3D PACKAGING THERMAL MANAGEMENT

Semiconductor Package Structures Having Liquid Coolers Integrated w...

LOCAL AREA SEMICONDUCTOR COOLING SYSTEM