Xiaomei BU

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Reliable interconnect for semiconductor device
- Patent number 9,054,107
- Issue date Jun 9, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect for semiconductor device
- Patent number 8,598,031
- Issue date Dec 3, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grain boundary blocking for stress migration and electromigration i...
- Patent number 7,989,338
- Issue date Aug 2, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined copper plating method to improve gap fill
- Patent number 7,585,768
- Issue date Sep 8, 2009
- Chartered Semiconductor Manufacturing, Ltd.
- Xiaomei Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with protective moat
- Patent number 7,224,060
- Issue date May 29, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of liner air gap formation
- Patent number 7,094,669
- Issue date Aug 22, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Xiaomei Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form Cu/OSG dual damascene structure for high performance...
- Patent number 6,913,994
- Issue date Jul 5, 2005
- Agency for Science, Technology and Research
- Qiang Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20140084486
- Publication date Mar 27, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Fan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20110074039
- Publication date Mar 31, 2011
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Fan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Combined copper plating method to improve gap fill
- Publication number 20070293039
- Publication date Dec 20, 2007
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Xiaomei Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain boundary blocking for stress migration and electromigration i...
- Publication number 20060286797
- Publication date Dec 21, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method of liner air gap formation
- Publication number 20060030128
- Publication date Feb 9, 2006
- Xiaomei Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with protective moat
- Publication number 20050167824
- Publication date Aug 4, 2005
- Chartered Semiconductor Manufacturing LTD.
- Fan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form Cu/OSG dual damascene structure for high performance...
- Publication number 20040203223
- Publication date Oct 14, 2004
- Institute of Microelectronics
- Qiang Guo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Reliable interconnect for semiconductor device

Reliable interconnect for semiconductor device

Grain boundary blocking for stress migration and electromigration i...

Combined copper plating method to improve gap fill

Integrated circuit with protective moat

Structure and method of liner air gap formation

Method to form Cu/OSG dual damascene structure for high performance...

Patents Applicationslast 30 patents

RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE

RELIABLE INTERCONNECT FOR SEMICONDUCTOR DEVICE

Combined copper plating method to improve gap fill

Grain boundary blocking for stress migration and electromigration i...

Structure and method of liner air gap formation

Integrated circuit with protective moat

Method to form Cu/OSG dual damascene structure for high performance...