Xiaotian Zhang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor package having integrated inductor, resistor an...
- Patent number 11,309,233
- Issue date Apr 19, 2022
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super-fast transient response (STR) AC/DC converter for high power...
- Patent number 11,258,270
- Issue date Feb 22, 2022
- Alpha and Omega Semiconductor (Cayman) LTD
- Pei-Lun Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package having enlarged gate pad and method of making...
- Patent number 11,222,858
- Issue date Jan 11, 2022
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making the same
- Patent number 11,069,604
- Issue date Jul 20, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD. GRAND
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super-fast transient response (STR) AC/DC converter for high power...
- Patent number 10,818,568
- Issue date Oct 27, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Pei-Lun Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Super-fast transient response (STR) AC/DC Converter for high power...
- Patent number 10,630,080
- Issue date Apr 21, 2020
- Alpha and Omega Semiconductor (Cayman) LTD
- Pei-Lun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating anode shorted field stop insulated gate bip...
- Patent number 10,522,666
- Issue date Dec 31, 2019
- Alpha and Omega Semiconductor Incorporated
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating anode shorted field stop insulated gate bip...
- Patent number 10,050,134
- Issue date Aug 14, 2018
- Alpha and Omega Semiconductor Incorporated
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and preparation method thereof
- Patent number 9,837,386
- Issue date Dec 5, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 9,653,424
- Issue date May 16, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating anode shorted field stop insulated gate bip...
- Patent number 9,478,646
- Issue date Oct 25, 2016
- Alpha and Omega Semiconductor Incorporated
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 9,437,587
- Issue date Sep 6, 2016
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and configuration for manufacturing flip chip contact (FCC)...
- Patent number 9,337,132
- Issue date May 10, 2016
- Alpha and Omega Semiconductor Incorporated
- Ming Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stacked multi-chip packaging structure
- Patent number 9,230,949
- Issue date Jan 5, 2016
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual chip package having leveling projections
- Patent number 9,165,866
- Issue date Oct 20, 2015
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip packaging structure and manufacturing method the...
- Patent number 9,006,870
- Issue date Apr 14, 2015
- Alpha and Omega Semiconductor Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip bottom source semiconductor device and preparati...
- Patent number 8,952,509
- Issue date Feb 10, 2015
- Alpha & Omega Semiconductor, Inc.
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 8,669,650
- Issue date Mar 11, 2014
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dual chip package and method of fabrication
- Patent number 8,581,376
- Issue date Nov 12, 2013
- Alpha and Omega Semiconductor Incorporated
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device package and fabrication method
- Patent number 8,563,360
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 8,455,303
- Issue date Jun 4, 2013
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die package for battery power management
- Patent number 8,344,519
- Issue date Jan 1, 2013
- Alpha and Omega Semiconductor Incorporated
- Jun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package with adhesive material pre-printed on the lea...
- Patent number 8,222,088
- Issue date Jul 17, 2012
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact inductive power electronics package
- Patent number 8,217,748
- Issue date Jul 10, 2012
- Alpha and Omega Semiconductor Inc.
- Tao Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame-based discrete power inductor
- Patent number 8,058,961
- Issue date Nov 15, 2011
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of discrete conductive layer in semiconductor device to re-rout...
- Patent number 8,049,315
- Issue date Nov 1, 2011
- Alpha & Omega Semiconductors, Ltd.
- Jun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Dual flat non-leaded semiconductor package
- Patent number 7,951,651
- Issue date May 31, 2011
- Alpha and Omega Semiconductor Incorporated
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die package for battery power management
- Patent number 7,898,092
- Issue date Mar 1, 2011
- Alpha & Omega Semiconductor,
- Jun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Use of discrete conductive layer in semiconductor device to re-rout...
- Patent number 7,884,454
- Issue date Feb 8, 2011
- Alpha and Omega Semiconductor, Ltd.
- Jun Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor power device package having a lead frame-based integr...
- Patent number 7,884,452
- Issue date Feb 8, 2011
- Alpha and Omega Semiconductor Incorporated
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...
- Publication number 20210398926
- Publication date Dec 23, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR, RESISTOR AN...
- Publication number 20210082793
- Publication date Mar 18, 2021
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR AND METHOD O...
- Publication number 20210082790
- Publication date Mar 18, 2021
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER-FAST TRANSIENT RESPONSE (STR) AC/DC CONVERTER FOR HIGH POWER...
- Publication number 20200412148
- Publication date Dec 31, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Pei-Lun Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194395
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200194347
- Publication date Jun 18, 2020
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING ANODE SHORTED FIELD STOP INSULATED GATE BIP...
- Publication number 20180204937
- Publication date Jul 19, 2018
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20170200705
- Publication date Jul 13, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHODS FOR FABRICATING ANODE SHORTED FIELD STOP INSULATED GATE BIP...
- Publication number 20160284797
- Publication date Sep 29, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...
- Publication number 20160126214
- Publication date May 5, 2016
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PACKAGE SYNCHRONOUS RECTIFIER
- Publication number 20160049876
- Publication date Feb 18, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Gilbert Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20150206868
- Publication date Jul 23, 2015
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING STACKED MULTI-CHIP PACKAGING STRUCTURE
- Publication number 20150179626
- Publication date Jun 25, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD
- Publication number 20150076676
- Publication date Mar 19, 2015
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20150035129
- Publication date Feb 5, 2015
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS
- Publication number 20140054758
- Publication date Feb 27, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...
- Publication number 20130130443
- Publication date May 23, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING ANODE SHORTED FIELD STOP INSULATED GATE BIP...
- Publication number 20130029461
- Publication date Jan 31, 2013
- ANUP BHALLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...
- Publication number 20120322207
- Publication date Dec 20, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20120248539
- Publication date Oct 4, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT
- Publication number 20110278709
- Publication date Nov 17, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DUAL CHIP PACKAGE AND METHOD OF FABRICATION
- Publication number 20110227207
- Publication date Sep 22, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Hamza Yilmaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame-based Discrete Power Inductor
- Publication number 20110121934
- Publication date May 26, 2011
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF DISCRETE CONDUCTIVE LAYER IN SEMICONDUCTOR DEVICE TO RE-ROUT...
- Publication number 20110108998
- Publication date May 12, 2011
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with adhesive material pre-printed on the lea...
- Publication number 20110068457
- Publication date Mar 24, 2011
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with adhesive material pre-printed on the lea...
- Publication number 20110070698
- Publication date Mar 24, 2011
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD
- Publication number 20100308454
- Publication date Dec 9, 2010
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DFN semiconductor package having reduced electrical resistance
- Publication number 20090258458
- Publication date Oct 15, 2009
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE
- Publication number 20090233403
- Publication date Sep 17, 2009
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Inductive Power Electronics Package
- Publication number 20090167477
- Publication date Jul 2, 2009
- Tao Feng
- H01 - BASIC ELECTRIC ELEMENTS

Xiaotian Zhang

Person

Patents Grantslast 30 patents

Power semiconductor package having integrated inductor, resistor an...

Super-fast transient response (STR) AC/DC converter for high power...

Semiconductor package having enlarged gate pad and method of making...

Semiconductor package and method of making the same

Super-fast transient response (STR) AC/DC converter for high power...

Super-fast transient response (STR) AC/DC Converter for high power...

Methods for fabricating anode shorted field stop insulated gate bip...

Methods for fabricating anode shorted field stop insulated gate bip...

Power device and preparation method thereof

Semiconductor package with adhesive material pre-printed on the lea...

Methods for fabricating anode shorted field stop insulated gate bip...

Flip chip semiconductor device

Methods and configuration for manufacturing flip chip contact (FCC)...

Method of making stacked multi-chip packaging structure

Stacked dual chip package having leveling projections

Stacked multi-chip packaging structure and manufacturing method the...

Stacked multi-chip bottom source semiconductor device and preparati...

Flip chip semiconductor device

Stacked dual chip package and method of fabrication

Power semiconductor device package and fabrication method

Semiconductor package with adhesive material pre-printed on the lea...

Stacked-die package for battery power management

Semiconductor package with adhesive material pre-printed on the lea...

Compact inductive power electronics package

Lead frame-based discrete power inductor

Use of discrete conductive layer in semiconductor device to re-rout...

Dual flat non-leaded semiconductor package

Stacked-die package for battery power management

Use of discrete conductive layer in semiconductor device to re-rout...

Semiconductor power device package having a lead frame-based integr...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING ENLARGED GATE PAD AND METHOD OF MAKING...

POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR, RESISTOR AN...

POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR AND METHOD O...

SUPER-FAST TRANSIENT RESPONSE (STR) AC/DC CONVERTER FOR HIGH POWER...

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

METHODS FOR FABRICATING ANODE SHORTED FIELD STOP INSULATED GATE BIP...

POWER DEVICE AND PREPARATION METHOD THEREOF

METHODS FOR FABRICATING ANODE SHORTED FIELD STOP INSULATED GATE BIP...

SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...

SINGLE PACKAGE SYNCHRONOUS RECTIFIER

FLIP CHIP SEMICONDUCTOR DEVICE

METHOD OF MAKING STACKED MULTI-CHIP PACKAGING STRUCTURE

POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD

STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD T...

STACKED DUAL CHIP PACKAGE HAVING LEVELING PROJECTIONS

METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...

METHODS FOR FABRICATING ANODE SHORTED FIELD STOP INSULATED GATE BIP...

SEMICONDUCTOR PACKAGE WITH ADHESIVE MATERIAL PRE-PRINTED ON THE LEA...

FLIP CHIP SEMICONDUCTOR DEVICE

STACKED-DIE PACKAGE FOR BATTERY POWER MANAGEMENT

STACKED DUAL CHIP PACKAGE AND METHOD OF FABRICATION

Lead Frame-based Discrete Power Inductor

USE OF DISCRETE CONDUCTIVE LAYER IN SEMICONDUCTOR DEVICE TO RE-ROUT...

Semiconductor package with adhesive material pre-printed on the lea...

Semiconductor package with adhesive material pre-printed on the lea...

POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHOD

DFN semiconductor package having reduced electrical resistance

DUAL FLAT NON-LEADED SEMICONDUCTOR PACKAGE

Compact Inductive Power Electronics Package