Xueren Zhang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 9,824,924
- Issue date Nov 21, 2017
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit device with shaped leads and method of forming t...
- Patent number 9,679,870
- Issue date Jun 13, 2017
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat dissipater
- Patent number 9,620,438
- Issue date Apr 11, 2017
- STMicroelectronics (Malta) Ltd.
- Roseanne Duca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package (WLCSP) having edge protection
- Patent number 9,576,912
- Issue date Feb 21, 2017
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) card having an IC module and reduced bond w...
- Patent number 9,449,912
- Issue date Sep 20, 2016
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an electronic device including two-step encapsulat...
- Patent number 9,379,034
- Issue date Jun 28, 2016
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount package for a semiconductor integrated device, relate...
- Patent number 9,257,372
- Issue date Feb 9, 2016
- STMicroelectronics (Mala) Ltd
- Roseanne Duca
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Piezo-resistive force sensor with bumps on membrane structure
- Patent number 8,800,391
- Issue date Aug 12, 2014
- STMicroelectronics Asia Pacific Pte, Ltd.
- Xueren Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Window clamp top plate for integrated circuit packaging
- Patent number 8,796,826
- Issue date Aug 5, 2014
- STMicroelectronics Pte Ltd
- Xueren Zhang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Offset of contact opening for copper pillars in flip chip packages
- Patent number 8,772,943
- Issue date Jul 8, 2014
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube-modified low-K materials
- Patent number 8,592,980
- Issue date Nov 26, 2013
- STMicroelectronics Asia Pacific Pte., Ltd.
- Shanzhong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
- Patent number 8,486,824
- Issue date Jul 16, 2013
- STMicroelectronics Asia Pacific Pte., Ltd.
- Tong Yan Tee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
- Patent number 8,217,518
- Issue date Jul 10, 2012
- STMicroelectronics Asia Pacific Pte., Ltd.
- Tong Yan Tee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20180040514
- Publication date Feb 8, 2018
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
- Publication number 20160293512
- Publication date Oct 6, 2016
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AN ELECTRONIC DEVICE INCLUDING TWO-STEP ENCAPSULAT...
- Publication number 20160190029
- Publication date Jun 30, 2016
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...
- Publication number 20160172262
- Publication date Jun 16, 2016
- STMicroelectronics Pte Ltd
- Yiyi MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH HEAT DISSIPATER
- Publication number 20150235929
- Publication date Aug 20, 2015
- STMicroelectronics (Malta) Ltd.
- Roseanne Duca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150084171
- Publication date Mar 26, 2015
- STMicroelectronics Pte Ltd
- Yiyi Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20140291812
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATE...
- Publication number 20140091443
- Publication date Apr 3, 2014
- STMicroelectronics Pte Ltd
- Roseanne Duca
- G01 - MEASURING TESTING
Information Patent Application
WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING
- Publication number 20130161806
- Publication date Jun 27, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Xueren ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES
- Publication number 20130147052
- Publication date Jun 13, 2013
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20130147024
- Publication date Jun 13, 2013
- STMicroelectronics Pte Ltd
- Kim-Yong GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE
- Publication number 20130093072
- Publication date Apr 18, 2013
- STMicroelectronics Pte Ltd
- Xueren Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION L...
- Publication number 20130012016
- Publication date Jan 10, 2013
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tong Yan Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Piezo-resistive force sensor with bumps on membrane structure
- Publication number 20080178691
- Publication date Jul 31, 2008
- STMicroelectronics Asia Pacific Pte. Ltd.
- Xueren Zhang
- G01 - MEASURING TESTING
Information Patent Application
Enhancing metal/low-K interconnect reliability using a protection l...
- Publication number 20070216032
- Publication date Sep 20, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Tong Yan Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carbon nanotube-modified low-K materials
- Publication number 20070210455
- Publication date Sep 13, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Shanzhong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Xueren Zhang

Person

Patents Grantslast 30 patents

Semiconductor packages having an electric device with a recess

Semiconductor packages having an electric device with a recess

Integrated circuit device with shaped leads and method of forming t...

Electronic device with heat dissipater

Wafer level chip scale package (WLCSP) having edge protection

Integrated circuit (IC) card having an IC module and reduced bond w...

Method of making an electronic device including two-step encapsulat...

Surface mount package for a semiconductor integrated device, relate...

Piezo-resistive force sensor with bumps on membrane structure

Window clamp top plate for integrated circuit packaging

Offset of contact opening for copper pillars in flip chip packages

Carbon nanotube-modified low-K materials

Enhancing metal/low-K interconnect reliability using a protection l...

Enhancing metal/low-K interconnect reliability using a protection l...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS

METHOD OF MAKING AN ELECTRONIC DEVICE INCLUDING TWO-STEP ENCAPSULAT...

INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...

ELECTRONIC DEVICE WITH HEAT DISSIPATER

NO-LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATE...

WINDOW CLAMP TOP PLATE FOR INTEGRATED CIRCUIT PACKAGING

OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES

BALANCED LEADFRAME PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE

ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION L...

Piezo-resistive force sensor with bumps on membrane structure

Enhancing metal/low-K interconnect reliability using a protection l...

Carbon nanotube-modified low-K materials