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Ya-Ling Huang

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  • Kaohsiung City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BLUETOOTH TRANSMISSION INTEGRATED CIRCUIT AND ASSOCIATED METHOD
    • Publication number 20190007817
    • Publication date Jan 3, 2019
    • Realtek Semiconductor Corp.
    • Yu-Hsuan Liu
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SUBSTRATE STRIP AND COMPACT CAMERA MODULE UTILIZING THE SAME
    • Publication number 20070228492
    • Publication date Oct 4, 2007
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • She-Hong CHENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for die attaching
    • Publication number 20060121644
    • Publication date Jun 8, 2006
    • Accton Technology Corporation
    • Hung-Ta Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip package structure
    • Publication number 20050139974
    • Publication date Jun 30, 2005
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Ya-Ling Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip package structure
    • Publication number 20050140005
    • Publication date Jun 30, 2005
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Ya-Ling Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package
    • Publication number 20050139994
    • Publication date Jun 30, 2005
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Hung-Ta Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flip chip package structure
    • Publication number 20050029672
    • Publication date Feb 10, 2005
    • Hung-Ta Hsu
    • H01 - BASIC ELECTRIC ELEMENTS