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Ya Wen WU

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  • Kaohsiung City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    3D MEMORY MULTI-STACK CONNECTION METHOD
    • Publication number 20230422512
    • Publication date Dec 28, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-En Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3D MEMORY MULTI-STACK CONNECTION METHOD
    • Publication number 20220352207
    • Publication date Nov 3, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chia-En Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LED PACKAGE AND MANUFACTURING METHOD THEREOF
    • Publication number 20160064629
    • Publication date Mar 3, 2016
    • ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    • CHUNG-MIN CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT ASSEMBLY AND INTEGRATED CIRCUIT PACKAGING STRUCTURE
    • Publication number 20160005674
    • Publication date Jan 7, 2016
    • RICHTEK TECHNOLOGY CORP.
    • Ya Tzu WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LED MODULE
    • Publication number 20150060935
    • Publication date Mar 5, 2015
    • ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    • CHUNG-MIN CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LED MODULE
    • Publication number 20150062930
    • Publication date Mar 5, 2015
    • ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    • CHUNG-MIN CHANG
    • F21 - LIGHTING
  • Information Patent Application

    LIGHT EMITTING DIODE ILLUMINATION DEVICE
    • Publication number 20150028755
    • Publication date Jan 29, 2015
    • ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    • CHUNG-MIN CHANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT EMITTING DEVICE AND METHOD FOR MIXING LIGHT THEREOF
    • Publication number 20140177216
    • Publication date Jun 26, 2014
    • ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    • CHUNG-MIN CHANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING
    • Publication number 20130207098
    • Publication date Aug 15, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tung-Ti YEH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER AND METHOD OF PROCESSING WAFER
    • Publication number 20130154060
    • Publication date Jun 20, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tung-Ti YEH
    • H01 - BASIC ELECTRIC ELEMENTS