Ya-Yu HSIEH

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure
- Patent number 11,011,444
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor and semiconductor structure
- Patent number 9,076,784
- Issue date Jul 7, 2015
- United Microelectronics Corp.
- Min-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor and process thereof
- Patent number 8,975,666
- Issue date Mar 10, 2015
- United Microelectronics Corp.
- Ya-Hsueh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and process thereof
- Patent number 8,836,049
- Issue date Sep 16, 2014
- United Microelectronics Corp.
- Min-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through-silicon via
- Patent number 8,828,745
- Issue date Sep 9, 2014
- United Microelectronics Corp.
- Wei-Che Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process
- Patent number 8,765,588
- Issue date Jul 1, 2014
- United Microelectronics Corp.
- Pong-Wey Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization method applied in process of manufacturing semiconduc...
- Patent number 8,759,219
- Issue date Jun 24, 2014
- United Microelectronics Corp.
- Ya-Hsueh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die attaching
- Patent number 7,498,202
- Issue date Mar 3, 2009
- Advanced Semiconductor Engineering, Inc.
- Hung-Ta Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210272866
- Publication date Sep 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210050273
- Publication date Feb 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...
- Publication number 20190214323
- Publication date Jul 11, 2019
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...
- Publication number 20170141007
- Publication date May 18, 2017
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF GROWING TWO-DIMENSIONAL CRYSTALS
- Publication number 20160265104
- Publication date Sep 15, 2016
- National Chung Cheng University
- YA-PING HSIEH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRAPHENE THIN FILM WITH FOLDED CONFIGURATION, THERMOELECTRIC DEVICE...
- Publication number 20150188017
- Publication date Jul 2, 2015
- Industrial Technology Research Institute
- Kuang-Yao Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TRANSISTOR AND SEMICONDUCTOR STRUCTURE
- Publication number 20140346616
- Publication date Nov 27, 2014
- Min-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS TRANSISTOR AND PROCESS THEREOF
- Publication number 20140054654
- Publication date Feb 27, 2014
- Ya-Hsueh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
- Publication number 20130334690
- Publication date Dec 19, 2013
- Min-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESS
- Publication number 20130078792
- Publication date Mar 28, 2013
- Pong-Wey Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THROUGH-SILICON VIA
- Publication number 20130011938
- Publication date Jan 10, 2013
- United Microelectronics Corp.
- Wei-Che TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD APPLIED IN PROCESS OF MANUFACTURING SEMICONDUC...
- Publication number 20120187563
- Publication date Jul 26, 2012
- United Microelectronics Corp.
- Ya-Hsueh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THE...
- Publication number 20120098043
- Publication date Apr 26, 2012
- Ya-Hsueh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
- Publication number 20070045863
- Publication date Mar 1, 2007
- Ya-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for die attaching
- Publication number 20060121644
- Publication date Jun 8, 2006
- Accton Technology Corporation
- Hung-Ta Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Ya-Yu HSIEH

Person

Patents Grantslast 30 patents

Semiconductor package structure

Transistor and semiconductor structure

MOS transistor and process thereof

Semiconductor structure and process thereof

Method for manufacturing through-silicon via

Semiconductor process

Planarization method applied in process of manufacturing semiconduc...

Method for die attaching

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...

FILLER COMPOSITIONS AND UNDERFILL COMPOSITIONS AND MOLDING COMPOUND...

METHOD OF GROWING TWO-DIMENSIONAL CRYSTALS

GRAPHENE THIN FILM WITH FOLDED CONFIGURATION, THERMOELECTRIC DEVICE...

TRANSISTOR AND SEMICONDUCTOR STRUCTURE

MOS TRANSISTOR AND PROCESS THEREOF

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

SEMICONDUCTOR PROCESS

METHOD FOR MANUFACTURING THROUGH-SILICON VIA

PLANARIZATION METHOD APPLIED IN PROCESS OF MANUFACTURING SEMICONDUC...

SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THE...

PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Method for die attaching