Yak Long Samuel Lim

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
Substrate Arrangement and a Method of Manufacturing a Substrate Arr...
- Publication number 20120126419
- Publication date May 24, 2012
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE
- Publication number 20110316117
- Publication date Dec 29, 2011
- Agency For Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS