Yan-Tso Tsai

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device and method
- Patent number 12,166,078
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 12,107,086
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective dual silicide formation
- Patent number 12,087,642
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,046,510
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, and sem...
- Patent number 11,948,920
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with stacked silicide regions
- Patent number 11,810,826
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective dual silicide formation
- Patent number 11,676,868
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with a silicide region
- Patent number 11,411,094
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving circuit layout for manufacturability
- Patent number 11,392,745
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 11,348,839
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device and method
- Patent number 11,335,774
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 11,289,482
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,177,172
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of silicide contacts in semiconductor devices
- Patent number 11,081,563
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 11,031,286
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor devices
- Patent number 10,867,831
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving circuit layout for manufacturability
- Patent number 10,853,552
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for bonding semiconductor devices
- Patent number 10,748,803
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrated circuit patterning
- Patent number 10,727,061
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact with a silicide region
- Patent number 10,535,748
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 10,515,963
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 10,483,164
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving circuit layout for manufacturability
- Patent number 10,282,504
- Issue date May 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for bonding semiconductor devices
- Patent number 10,269,611
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 10,269,799
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrated circuit patterning
- Patent number 9,941,125
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 9,812,451
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming low resistance contacts
- Patent number 9,520,327
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wen Nieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming low resistance contacts
- Patent number 9,165,838
- Issue date Oct 20, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wen Nieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME
- Publication number 20250070045
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Implantation
- Publication number 20250062136
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250063783
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250062204
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Modulation Through Implantation and the Structures Thereof
- Publication number 20250062247
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Chih Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Features For Reducing Non-Bond and Methods of Forming the Same
- Publication number 20250006677
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240405023
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DUAL SILICIDE FORMATION
- Publication number 20240387288
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240332076
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240321694
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...
- Publication number 20240274461
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING DEVICE, DIE BONDING METHOD AND VACUUM CONTROL METHOD FO...
- Publication number 20240170320
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Zuo TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411496
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME
- Publication number 20230402278
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230387316
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Devices with Multiple Silicid...
- Publication number 20230369130
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Work-Function Metal in Transistors and Method Forming Same
- Publication number 20230282729
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DUAL SILICIDE FORMATION
- Publication number 20230260847
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND SEM...
- Publication number 20230063851
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DUAL SILICIDE FORMATION
- Publication number 20230054633
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact with a Silicide Region
- Publication number 20220367667
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Devices with Multiple Silicid...
- Publication number 20220293474
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20220278199
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field Effect Transistor Contact with Reduced Contact Resistance
- Publication number 20220216204
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20210296168
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210118994
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Ming Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Circuit Layout for Manufacturability
- Publication number 20210089697
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Method of Manufacturing
- Publication number 20210035868
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Bonding Semiconductor Devices
- Publication number 20200373185
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Zuo Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Contact with a Silicide Region
- Publication number 20200152763
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Yan-Tso Tsai

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor devices with multiple silicid...

Contact structure for semiconductor device and method

Field effect transistor contact with reduced contact resistance

Selective dual silicide formation

Conductive feature formation and structure

Semiconductor device and method for manufacturing the same, and sem...

Semiconductor devices with stacked silicide regions

Selective dual silicide formation

Contact with a silicide region

Method for improving circuit layout for manufacturability

Method of manufacturing semiconductor devices with multiple silicid...

Contact structure for semiconductor device and method

Field effect transistor contact with reduced contact resistance

Semiconductor structure

Formation of silicide contacts in semiconductor devices

Conductive feature formation and structure

Method and apparatus for bonding semiconductor devices

Method for improving circuit layout for manufacturability

Method and apparatus for bonding semiconductor devices

Method for integrated circuit patterning

Method of forming a contact with a silicide region

Field effect transistor contact with reduced contact resistance

Semiconductor structure and method for manufacturing the same

Method for improving circuit layout for manufacturability

Method and apparatus for bonding semiconductor devices

Field effect transistor contact with reduced contact resistance

Method for integrated circuit patterning

Field effect transistor contact with reduced contact resistance

Methods of forming low resistance contacts

Methods of forming low resistance contacts

Patents Applicationslast 30 patents

PACKAGED DEVICE WITH AIR GAP AND METHODS OF FORMING SAME

Packages with Implantation

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD

INTEGRATED CIRCUIT PACKAGE AND METHOD

Warpage Modulation Through Implantation and the Structures Thereof

Bond Features For Reducing Non-Bond and Methods of Forming the Same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SELECTIVE DUAL SILICIDE FORMATION

CONDUCTIVE FEATURE FORMATION AND STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...

DIE BONDING DEVICE, DIE BONDING METHOD AND VACUUM CONTROL METHOD FO...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of Manufacturing Semiconductor Devices with Multiple Silicid...

Work-Function Metal in Transistors and Method Forming Same

SELECTIVE DUAL SILICIDE FORMATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND SEM...

SELECTIVE DUAL SILICIDE FORMATION

Contact with a Silicide Region

Method of Manufacturing Semiconductor Devices with Multiple Silicid...

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD

Field Effect Transistor Contact with Reduced Contact Resistance

Conductive Feature Formation and Structure

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE AND METHOD

Method for Improving Circuit Layout for Manufacturability

Semiconductor Device and Method of Manufacturing

Method and Apparatus for Bonding Semiconductor Devices

Method of Forming a Contact with a Silicide Region