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Yan-Yi Wu

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  • Shanghai, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of fabricating chip package structure
    • Patent number 8,105,881
    • Issue date Jan 31, 2012
    • ChipMOS Technologies (Bermuda) Ltd.
    • Jie-Hung Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of fabricating chip package
    • Patent number 8,088,650
    • Issue date Jan 3, 2012
    • Chipmos Technologies (Bermuda) Ltd.
    • Yong-Chao Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of fabricating chip package structure
    • Patent number 7,741,149
    • Issue date Jun 22, 2010
    • Chipmos Technologies (Bermuda) Ltd.
    • Yong-Chao Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package structure
    • Patent number 7,683,462
    • Issue date Mar 23, 2010
    • ChipMOS Technologies (Bermuda) Ltd.
    • Jie-Hung Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package structure
    • Patent number 7,361,984
    • Issue date Apr 22, 2008
    • ChipMOS Technologies (Shanghai) Ltd.
    • Yan-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF FABRICATING CHIP PACKAGE
    • Publication number 20090280603
    • Publication date Nov 12, 2009
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Yong-Chao Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING CHIP PACKAGE STRUCTURE
    • Publication number 20090197374
    • Publication date Aug 6, 2009
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Yong-Chao Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20080224284
    • Publication date Sep 18, 2008
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Yan-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20080224277
    • Publication date Sep 18, 2008
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Yong-Chao Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20080191324
    • Publication date Aug 14, 2008
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Yong-Chao Qiao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING CHIP PACKAGE STRUCTURE
    • Publication number 20080188039
    • Publication date Aug 7, 2008
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Jie-Hung Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20080185697
    • Publication date Aug 7, 2008
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Jie-Hung Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20080157304
    • Publication date Jul 3, 2008
    • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
    • Jie-Hung Chiou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20080093719
    • Publication date Apr 24, 2008
    • CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
    • Yan-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20080017958
    • Publication date Jan 24, 2008
    • CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
    • Yan-Yi Wu
    • H01 - BASIC ELECTRIC ELEMENTS