Yang Du

Person

Carlsbad, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-low power neuromorphic artificial intelligence computing acce...
- Patent number 11,733,766
- Issue date Aug 22, 2023
- QUALCOMM Incorporated
- Yu Pu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra-low power neuromorphic artificial intelligence computing acce...
- Patent number 11,609,623
- Issue date Mar 21, 2023
- QUALCOMM Incorporated
- Yu Pu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultra-low power neuromorphic artificial intelligence computing acce...
- Patent number 11,385,706
- Issue date Jul 12, 2022
- QUALCOMM Incorporated
- Yu Pu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hard macro having blockage sites, integrated circuit including same...
- Patent number 10,192,813
- Issue date Jan 29, 2019
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-processor core three-dimensional (3D) integrated circuits (IC...
- Patent number 10,176,147
- Issue date Jan 8, 2019
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power distribution networks for a three-dimensional (3D) integrated...
- Patent number 10,121,743
- Issue date Nov 6, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator (SOI) complementary metal oxide semiconductor...
- Patent number 10,062,680
- Issue date Aug 28, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene NMOS transistor using nitrogen dioxide chemical adsorption
- Patent number 10,038,060
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Yong Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection propagation for inter-logical block connections in integ...
- Patent number 9,929,733
- Issue date Mar 27, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microelectromechanical system (MEMS) bond release structure and met...
- Patent number 9,922,956
- Issue date Mar 20, 2018
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via (TSV) crack sensors for detecting TSV cracks in...
- Patent number 9,869,713
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondable device including a hydrophilic layer
- Patent number 9,773,741
- Issue date Sep 26, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power gate placement techniques in three-dimensional (3D) integrate...
- Patent number 9,754,923
- Issue date Sep 5, 2017
- QUALCOMM Incorporated
- Jing Xie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power delivery network (PDN) design for monolithic three-dimensiona...
- Patent number 9,741,691
- Issue date Aug 22, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process variation power control in three-dimensional (3D) integrate...
- Patent number 9,712,168
- Issue date Jul 18, 2017
- QUALCOMM Incorporated
- Giby Samson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Memory controller placement in a three-dimensional (3D) integrated...
- Patent number 9,626,311
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual power swing pipeline design with separation of combinational a...
- Patent number 9,628,077
- Issue date Apr 18, 2017
- Qualcomm Incorporated
- Jing Xie
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Complete system-on-chip (SOC) using monolithic three dimensional (3...
- Patent number 9,583,473
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) memory cell separation among 3D integrated c...
- Patent number 9,583,179
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory controller placement in a three-dimensional (3D) integrated...
- Patent number 9,569,380
- Issue date Feb 14, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-speed high-power semiconductor devices
- Patent number 9,543,383
- Issue date Jan 10, 2017
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3-D) integrated circuits (3DICS) with graphene s...
- Patent number 9,536,840
- Issue date Jan 3, 2017
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock tree synthesis for low cost pre-bond testing of 3D integrated...
- Patent number 9,508,615
- Issue date Nov 29, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intellectual property block design with folded blocks and duplicate...
- Patent number 9,483,598
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Complete system-on-chip (SOC) using monolithic three dimensional (3...
- Patent number 9,418,985
- Issue date Aug 16, 2016
- QUALCOMM Incorporated
- Yang Du
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Three dimensional (3D) integrated circuits (ICs) (3DICs) and relate...
- Patent number 9,343,369
- Issue date May 17, 2016
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock skew compensation with adaptive body biasing in three-dimensi...
- Patent number 9,256,246
- Issue date Feb 9, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cr...
- Patent number 9,213,358
- Issue date Dec 15, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Monolithic three dimensional integration of semiconductor integrate...
- Patent number 9,177,890
- Issue date Nov 3, 2015
- QUALCOMM Incorporated
- Yang Du
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Three-dimensional (3D) memory cell separation among 3D integrated c...
- Patent number 9,171,608
- Issue date Oct 27, 2015
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-LOW POWER NEUROMORPHIC ARTIFICIAL INTELLIGENCE COMPUTING ACCE...
- Publication number 20220308653
- Publication date Sep 29, 2022
- QUALCOMM Incorporated
- Yu PU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ULTRA-LOW POWER NEUROMORPHIC ARTIFICIAL INTELLIGENCE COMPUTING ACCE...
- Publication number 20190073585
- Publication date Mar 7, 2019
- QUALCOMM Incorporated
- Yu PU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20190027435
- Publication date Jan 24, 2019
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20180286800
- Publication date Oct 4, 2018
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PROCESSOR CORE THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20180260360
- Publication date Sep 13, 2018
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DYNAMICALLY CONTROLLING VOLTAGE PROVIDED TO THREE-DIMENSIONAL (3D)...
- Publication number 20180259581
- Publication date Sep 13, 2018
- QUALCOMM Incorporated
- Xia Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
GRAPHENE NMOS TRANSISTOR USING NITROGEN DIOXIDE CHEMICAL ADSORPTION
- Publication number 20170338311
- Publication date Nov 23, 2017
- QUALCOMM Incorporated
- Yong Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLETE SYSTEM-ON-CHIP (SOC) USING MONOLITHIC THREE DIMENSIONAL (3...
- Publication number 20160351553
- Publication date Dec 1, 2016
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONA...
- Publication number 20160322331
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL CONVERSION FLIP-FLOP CIRCUITS FOR MULTI-POWER DOMAIN IN...
- Publication number 20160285439
- Publication date Sep 29, 2016
- QUALCOMM Incorporated
- Jing XIE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CLOCK TREE DESIGN METHODS FOR ULTRA-WIDE VOLTAGE RANGE CIRCUITS
- Publication number 20160267214
- Publication date Sep 15, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL POWER SWING PIPELINE DESIGN WITH SEPARATION OF COMBINATIONAL A...
- Publication number 20160261269
- Publication date Sep 8, 2016
- QUALCOMM Incorporated
- Jing XIE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN...
- Publication number 20160258996
- Publication date Sep 8, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G01 - MEASURING TESTING
Information Patent Application
INTELLECTUAL PROPERTY BLOCK DESIGN WITH FOLDED BLOCKS AND DUPLICATE...
- Publication number 20160232271
- Publication date Aug 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK TREE SYNTHESIS FOR LOW COST PRE-BOND TESTING OF 3D INTEGRATED...
- Publication number 20160233134
- Publication date Aug 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS...
- Publication number 20160225741
- Publication date Aug 4, 2016
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CONTROLLER PLACEMENT IN A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20160217087
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND MET...
- Publication number 20160093591
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Je-Hsiung Jeffrey LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH QUALITY PHYSICAL DESIGN FOR MONOLITHIC THREE-DIMENSIONAL INTEG...
- Publication number 20160042110
- Publication date Feb 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...
- Publication number 20150333005
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS...
- Publication number 20150333056
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON-ON-INSULATOR (SOI) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR...
- Publication number 20150325563
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH IMPROVED THERMAL CONDUCTIVITY
- Publication number 20150311138
- Publication date Oct 29, 2015
- QUALCOMM Incorporated
- Yong Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED C...
- Publication number 20150302919
- Publication date Oct 22, 2015
- QUALCOMM Incorporated
- Jing Xie
- G11 - INFORMATION STORAGE
Information Patent Application
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...
- Publication number 20150145143
- Publication date May 28, 2015
- QUALCOMM Incorporated
- Kambiz Samadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ION REDUCED, ION CUT-FORMED THREE-DIMENSIONAL (3D) INTEGRATED CIRCU...
- Publication number 20150132922
- Publication date May 14, 2015
- QUALCOMM Incorporated
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) CR...
- Publication number 20150121327
- Publication date Apr 30, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs)...
- Publication number 20150109843
- Publication date Apr 23, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G11 - INFORMATION STORAGE
Information Patent Application
LASER ANNEALING METHODS FOR INTEGRATED CIRCUITS (ICs)
- Publication number 20150111341
- Publication date Apr 23, 2015
- QUALCOMM Incorporated
- Yong Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DESIGNING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...
- Publication number 20150112646
- Publication date Apr 23, 2015
- QUALCOMM Incorporated
- Pratyush Kamal
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Ultra-low power neuromorphic artificial intelligence computing acce...

Ultra-low power neuromorphic artificial intelligence computing acce...

Ultra-low power neuromorphic artificial intelligence computing acce...

Hard macro having blockage sites, integrated circuit including same...

Multi-processor core three-dimensional (3D) integrated circuits (IC...

Power distribution networks for a three-dimensional (3D) integrated...

Silicon-on-insulator (SOI) complementary metal oxide semiconductor...

Graphene NMOS transistor using nitrogen dioxide chemical adsorption

Connection propagation for inter-logical block connections in integ...

Microelectromechanical system (MEMS) bond release structure and met...

Through-silicon via (TSV) crack sensors for detecting TSV cracks in...

Bondable device including a hydrophilic layer

Power gate placement techniques in three-dimensional (3D) integrate...

Power delivery network (PDN) design for monolithic three-dimensiona...

Process variation power control in three-dimensional (3D) integrate...

Memory controller placement in a three-dimensional (3D) integrated...

Dual power swing pipeline design with separation of combinational a...

Complete system-on-chip (SOC) using monolithic three dimensional (3...

Three-dimensional (3D) memory cell separation among 3D integrated c...

Memory controller placement in a three-dimensional (3D) integrated...

High-speed high-power semiconductor devices

Three-dimensional (3-D) integrated circuits (3DICS) with graphene s...

Clock tree synthesis for low cost pre-bond testing of 3D integrated...

Intellectual property block design with folded blocks and duplicate...

Complete system-on-chip (SOC) using monolithic three dimensional (3...

Three dimensional (3D) integrated circuits (ICs) (3DICs) and relate...

Clock skew compensation with adaptive body biasing in three-dimensi...

Monolithic three dimensional (3D) integrated circuit (IC) (3DIC) cr...

Monolithic three dimensional integration of semiconductor integrate...

Three-dimensional (3D) memory cell separation among 3D integrated c...

Patents Applicationslast 30 patents

ULTRA-LOW POWER NEUROMORPHIC ARTIFICIAL INTELLIGENCE COMPUTING ACCE...

ULTRA-LOW POWER NEUROMORPHIC ARTIFICIAL INTELLIGENCE COMPUTING ACCE...

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...

POWER DISTRIBUTION NETWORKS FOR A THREE-DIMENSIONAL (3D) INTEGRATED...

MULTI-PROCESSOR CORE THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...

DYNAMICALLY CONTROLLING VOLTAGE PROVIDED TO THREE-DIMENSIONAL (3D)...

GRAPHENE NMOS TRANSISTOR USING NITROGEN DIOXIDE CHEMICAL ADSORPTION

COMPLETE SYSTEM-ON-CHIP (SOC) USING MONOLITHIC THREE DIMENSIONAL (3...

POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONA...

MULTI-LEVEL CONVERSION FLIP-FLOP CIRCUITS FOR MULTI-POWER DOMAIN IN...

CLOCK TREE DESIGN METHODS FOR ULTRA-WIDE VOLTAGE RANGE CIRCUITS

DUAL POWER SWING PIPELINE DESIGN WITH SEPARATION OF COMBINATIONAL A...

THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN...

INTELLECTUAL PROPERTY BLOCK DESIGN WITH FOLDED BLOCKS AND DUPLICATE...

CLOCK TREE SYNTHESIS FOR LOW COST PRE-BOND TESTING OF 3D INTEGRATED...

METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS...

MEMORY CONTROLLER PLACEMENT IN A THREE-DIMENSIONAL (3D) INTEGRATED...

MICROELECTROMECHANICAL SYSTEM (MEMS) BOND RELEASE STRUCTURE AND MET...

HIGH QUALITY PHYSICAL DESIGN FOR MONOLITHIC THREE-DIMENSIONAL INTEG...

PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...

METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS...

SILICON-ON-INSULATOR (SOI) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR...

TRANSISTORS WITH IMPROVED THERMAL CONDUCTIVITY

THREE-DIMENSIONAL (3D) MEMORY CELL SEPARATION AMONG 3D INTEGRATED C...

PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC TH...

ION REDUCED, ION CUT-FORMED THREE-DIMENSIONAL (3D) INTEGRATED CIRCU...

MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) CR...

MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs)...

LASER ANNEALING METHODS FOR INTEGRATED CIRCUITS (ICs)

METHODS OF DESIGNING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (IC...