Yang Liu

Person

Ossining, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatically aiding individuals with developing auditory attention...
- Patent number 11,602,287
- Issue date Mar 14, 2023
- International Business Machines Corporation
- Stefania Axo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transferrable pillar structure for fanout package or interconnect b...
- Patent number 11,587,896
- Issue date Feb 21, 2023
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid delivery device with hydrophobic surface
- Patent number 11,534,585
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,411,272
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,362,382
- Issue date Jun 14, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Behavior-based interactive educational sessions
- Patent number 11,210,968
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 11,165,248
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed under bump metallurgy (UBM) interconnect bridge structure
- Patent number 11,139,269
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 11,133,670
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transdermal sensing probes and smart patch systems using same
- Patent number 10,638,945
- Issue date May 5, 2020
- International Business Machines Corporation
- Bing Dang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated self-coining probe
- Patent number 10,585,119
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 10,535,994
- Issue date Jan 14, 2020
- International Business Machines Corporation
- Qianwen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air gap metal tip electrostatic discharge protection
- Patent number 10,530,150
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid delivery device with hydrophobic surface
- Patent number 10,508,755
- Issue date Dec 17, 2019
- International Business Machines Corporation
- Yang Liu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Micro-battery using glass package
- Patent number 10,505,160
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test probe head for full wafer testing
- Patent number 10,330,701
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming surface protrusions on an article and the article...
- Patent number 10,132,836
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated self-coining probe
- Patent number 10,001,508
- Issue date Jun 19, 2018
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Grant
Air-core inductors and transformers
- Patent number 9,929,230
- Issue date Mar 27, 2018
- International Business Machines Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarity-tolerant reworkable interconnect with integrated testing
- Patent number 9,865,569
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarity-tolerant reworkable interconnect with integrated testing
- Patent number 9,391,040
- Issue date Jul 12, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap electrostatic discharge structure for high speed circuits
- Patent number 9,380,688
- Issue date Jun 28, 2016
- International Business Machines Corporation
- Kai D. Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming surface protrusions on an article and the article...
- Patent number 9,070,586
- Issue date Jun 30, 2015
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuously scalable width and height semiconductor fins
- Patent number 8,927,432
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Dechao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) test probe
- Patent number 8,525,168
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE
- Publication number 20230071285
- Publication date Mar 9, 2023
- International Business Machines Corporation
- YANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT B...
- Publication number 20220181286
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATICALLY AIDING INDIVIDUALS WITH DEVELOPING AUDITORY ATTENTION...
- Publication number 20210298647
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Stefania Axo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
- Publication number 20210233892
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEHAVIOR-BASED INTERACTIVE EDUCATIONAL SESSIONS
- Publication number 20200090542
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Lawrence A. Clevenger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20200059090
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Qianwen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20200059091
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Qianwen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COGNITIVE TOOL FOR TEACHING GENERLIZATION OF OBJECTS TO A PERSON
- Publication number 20200051447
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Krishna R. Tunga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE
- Publication number 20200032925
- Publication date Jan 30, 2020
- International Business Machines Corporation
- YANG LIU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE
- Publication number 20190024823
- Publication date Jan 24, 2019
- International Business Machines Corporation
- YANG LIU
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MICRO-BATTERY USING GLASS PACKAGE
- Publication number 20180375067
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...
- Publication number 20180348259
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED SELF-COINING PROBE
- Publication number 20180252747
- Publication date Sep 6, 2018
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20180212423
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Qianwen Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20180212424
- Publication date Jul 26, 2018
- International Business Machines Corporation
- Qianwen Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY
- Publication number 20180069202
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SELF-COINING PROBE
- Publication number 20170363659
- Publication date Dec 21, 2017
- International Business Machines Corporation
- Yang Liu
- G01 - MEASURING TESTING
Information Patent Application
SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY
- Publication number 20170324068
- Publication date Nov 9, 2017
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-CORE INDUCTORS AND TRANSFORMERS
- Publication number 20170263692
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME
- Publication number 20170175280
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Bing Dang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME
- Publication number 20170172445
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Bing Dang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING
- Publication number 20160240513
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING
- Publication number 20160111387
- Publication date Apr 21, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PROBE HEAD FOR FULL WAFER TESTING
- Publication number 20160084882
- Publication date Mar 24, 2016
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...
- Publication number 20150241476
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Bing Dang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONTINUOUSLY SCALABLE WIDTH AND HEIGHT SEMICONDUCTOR FINS
- Publication number 20150115365
- Publication date Apr 30, 2015
- International Business Machines Corporation
- Dechao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-ENHANCING SELECTIVE EPITAXIAL DEPOSITION OF EMBEDDED SOURCE...
- Publication number 20140264444
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Dechao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUSLY SCALABLE WIDTH AND HEIGHT SEMICONDUCTOR FINS
- Publication number 20130334602
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Dechao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) TEST PROBE
- Publication number 20130015440
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Bing Dang
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Direct bonded heterogeneous integration silicon bridge

Automatically aiding individuals with developing auditory attention...

Transferrable pillar structure for fanout package or interconnect b...

Fluid delivery device with hydrophobic surface

Simplified hermetic packaging of a micro-battery

Simplified hermetic packaging of a micro-battery

Behavior-based interactive educational sessions

Air gap metal tip electrostatic discharge protection

Mixed under bump metallurgy (UBM) interconnect bridge structure

Air gap metal tip electrostatic discharge protection

Transdermal sensing probes and smart patch systems using same

Integrated self-coining probe

Air gap metal tip electrostatic discharge protection

Air gap metal tip electrostatic discharge protection

Fluid delivery device with hydrophobic surface

Micro-battery using glass package

Test probe head for full wafer testing

Method of forming surface protrusions on an article and the article...

Integrated self-coining probe

Air-core inductors and transformers

Planarity-tolerant reworkable interconnect with integrated testing

Planarity-tolerant reworkable interconnect with integrated testing

Air gap electrostatic discharge structure for high speed circuits

Method of forming surface protrusions on an article and the article...

Continuously scalable width and height semiconductor fins

Integrated circuit (IC) test probe

Patents Applicationslast 30 patents

FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

TRANSFERRABLE PILLAR STRUCTURE FOR FANOUT PACKAGE OR INTERCONNECT B...

AUTOMATICALLY AIDING INDIVIDUALS WITH DEVELOPING AUDITORY ATTENTION...

Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure

BEHAVIOR-BASED INTERACTIVE EDUCATIONAL SESSIONS

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION

COGNITIVE TOOL FOR TEACHING GENERLIZATION OF OBJECTS TO A PERSON

FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE

FLUID DELIVERY DEVICE WITH HYDROPHOBIC SURFACE

MICRO-BATTERY USING GLASS PACKAGE

METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...

INTEGRATED SELF-COINING PROBE

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION

AIR GAP METAL TIP ELECTROSTATIC DISCHARGE PROTECTION

SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY

INTEGRATED SELF-COINING PROBE

SIMPLIFIED HERMETIC PACKAGING OF A MICRO-BATTERY

AIR-CORE INDUCTORS AND TRANSFORMERS

TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME

TRANSDERMAL SENSING PROBES AND SMART PATCH SYSTEMS USING SAME

PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING

PLANARITY-TOLERANT REWORKABLE INTERCONNECT WITH INTEGRATED TESTING

TEST PROBE HEAD FOR FULL WAFER TESTING

METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE...

CONTINUOUSLY SCALABLE WIDTH AND HEIGHT SEMICONDUCTOR FINS

STRESS-ENHANCING SELECTIVE EPITAXIAL DEPOSITION OF EMBEDDED SOURCE...

CONTINUOUSLY SCALABLE WIDTH AND HEIGHT SEMICONDUCTOR FINS

INTEGRATED CIRCUIT (IC) TEST PROBE