Yangda Zhang

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 11,195,854
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 10,580,792
- Issue date Mar 3, 2020
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 10,083,984
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures and methods of forming integrated structures
- Patent number 9,773,805
- Issue date Sep 26, 2017
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20200176471
- Publication date Jun 4, 2020
- Micron Technology, Inc.
- Jie Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20180358378
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures and Methods of Forming Integrated Structures
- Publication number 20170365617
- Publication date Dec 21, 2017
- Jie Li
- H01 - BASIC ELECTRIC ELEMENTS