Yanghua He

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Richardson, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing pad having improved groove pattern
- Patent number 8,002,611
- Issue date Aug 23, 2011
- Texas Instruments Incorporated
- Yanghua He
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemical mechanical planarization of a metal layer locat...
- Patent number 7,871,931
- Issue date Jan 18, 2011
- Texas Instruments Incorporated
- Anthony DiCarlo
- G02 - OPTICS
Information Patent Grant
Edge-sealed pad for CMP process
- Patent number 6,913,527
- Issue date Jul 5, 2005
- Texas Instruments Incorporated
- Yanghua He
- B24 - GRINDING POLISHING
Information Patent Grant
Edge-sealed pad for CMP process
- Patent number 6,783,437
- Issue date Aug 31, 2004
- Texas Instruments Incorporated
- Yanghua He
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD HAVING IMPROVED GROOVE PATTERN
- Publication number 20080160890
- Publication date Jul 3, 2008
- Yanghua He
- B24 - GRINDING POLISHING
Information Patent Application
Method for chemical mechanical planarization of a metal layer locat...
- Publication number 20070066063
- Publication date Mar 22, 2007
- Texas Instruments Inc.
- Anthony DiCarlo
- G02 - OPTICS
Information Patent Application
Detecting endpoint using luminescence in the fabrication of a micro...
- Publication number 20070042509
- Publication date Feb 22, 2007
- Texas Instruments Inc.
- Jingqiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge-sealed pad for CMP process
- Publication number 20050003738
- Publication date Jan 6, 2005
- Yanghua He
- B24 - GRINDING POLISHING
Information Patent Application
Edge-contact ring for a wafer pedestal
- Publication number 20040099375
- Publication date May 27, 2004
- Yanghua He
- B24 - GRINDING POLISHING