Yangming Liu

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosure fitting for electronic device
- Patent number 11,985,782
- Issue date May 14, 2024
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bump with multi-PI opening
- Patent number 11,978,713
- Issue date May 7, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-layer molding compound an...
- Patent number 11,961,778
- Issue date Apr 16, 2024
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including reinforced corner supports
- Patent number 11,393,735
- Issue date Jul 19, 2022
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including magnetic hold-down layer
- Patent number 11,177,242
- Issue date Nov 16, 2021
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including control switches to reduce pin capac...
- Patent number 11,177,239
- Issue date Nov 16, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation using a sacrificial bonding material...
- Patent number 10,854,573
- Issue date Dec 1, 2020
- SanDisk Technologies LLC
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertically integrated groups of semi...
- Patent number 10,236,276
- Issue date Mar 19, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT
- Publication number 20240304518
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE
- Publication number 20240249950
- Publication date Jul 25, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS
- Publication number 20230402361
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK
- Publication number 20230395446
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip Chip Bump With Multi-PI Opening
- Publication number 20230378112
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enclosure fitting for electronic device
- Publication number 20230328910
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Bo Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...
- Publication number 20230170312
- Publication date Jun 1, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Having Multi-Layer Molding Compound an...
- Publication number 20230101826
- Publication date Mar 30, 2023
- Western Digital Technologies, Inc.
- Shenghua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING A BALL GRID ARRAY WITH MULTIPLE...
- Publication number 20220406695
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Siqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER
- Publication number 20200411477
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION USING A SACRIFICIAL BONDING MATERIAL...
- Publication number 20200219842
- Publication date Jul 9, 2020
- SANDISK TECHNOLOGIES LLC
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING REINFORCED CORNER SUPPORTS
- Publication number 20200006184
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...
- Publication number 20190006320
- Publication date Jan 3, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMI...
- Publication number 20180294251
- Publication date Oct 11, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS

Yangming Liu

Person

Patents Grantslast 30 patents

Semiconductor device including a suspended reinforcing layer and me...

Enclosure fitting for electronic device

Flip chip bump with multi-PI opening

Semiconductor device package having multi-layer molding compound an...

Semiconductor device including reinforced corner supports

Semiconductor device including magnetic hold-down layer

Semiconductor device including control switches to reduce pin capac...

Semiconductor die singulation using a sacrificial bonding material...

Semiconductor device including vertically integrated groups of semi...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT

SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

MECHANICAL SUPPORT FOR A TALL OFFSET DIE STACK

Flip Chip Bump With Multi-PI Opening

Enclosure fitting for electronic device

SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...

Semiconductor Device Package Having Multi-Layer Molding Compound an...

SEMICONDUCTOR DEVICE PACKAGE HAVING A BALL GRID ARRAY WITH MULTIPLE...

SEMICONDUCTOR DEVICE INCLUDING MAGNETIC HOLD-DOWN LAYER

SEMICONDUCTOR DIE SINGULATION USING A SACRIFICIAL BONDING MATERIAL...

SEMICONDUCTOR DEVICE INCLUDING REINFORCED CORNER SUPPORTS

SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTEGRATED GROUPS OF SEMI...