Yangyang Sun

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression flip chip bump for high performance and fine pitch
- Patent number 12,113,038
- Issue date Oct 8, 2024
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising interconnect structures having an inne...
- Patent number 11,676,922
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip device
- Patent number 11,417,622
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repurposed seed layer for high frequency noise control and electros...
- Patent number 11,380,613
- Issue date Jul 5, 2022
- QUALCOMM Incorporated
- Yue Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density and reliable vertical natural capacitors
- Patent number 10,325,979
- Issue date Jun 18, 2019
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages with photoimageab...
- Patent number 9,362,143
- Issue date Jun 7, 2016
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit constructions having through substrate vias and...
- Patent number 9,123,700
- Issue date Sep 1, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising a dielectric material having a...
- Patent number 8,872,356
- Issue date Oct 28, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor structure
- Patent number 8,569,167
- Issue date Oct 29, 2013
- Micron Technology, Inc.
- Jaspreet S. Ghandi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
- Publication number 20250087611
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES
- Publication number 20250062285
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...
- Publication number 20240421119
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
- Publication number 20240387429
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE
- Publication number 20240371806
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING ELONGATED PADS
- Publication number 20240297129
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...
- Publication number 20240243056
- Publication date Jul 18, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS
- Publication number 20240006361
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZA...
- Publication number 20230369230
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURE...
- Publication number 20230369234
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH...
- Publication number 20230299048
- Publication date Sep 21, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES
- Publication number 20220320026
- Publication date Oct 6, 2022
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...
- Publication number 20220149005
- Publication date May 12, 2022
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPURPOSED SEED LAYER FOR HIGH FREQUENCY NOISE CONTROL AND ELECTROS...
- Publication number 20210375742
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION FLIP CHIP BUMP
- Publication number 20210210449
- Publication date Jul 8, 2021
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...
- Publication number 20210125951
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP DEVICE
- Publication number 20210118834
- Publication date Apr 22, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY AND RELIABLE VERTICAL NATURAL CAPACITORS
- Publication number 20190206984
- Publication date Jul 4, 2019
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR
- Publication number 20140124877
- Publication date May 8, 2014
- QUALCOMM Incorporated
- Yangyang Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES
- Publication number 20140042618
- Publication date Feb 13, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions and Methods of Forming Semiconductor Co...
- Publication number 20130313710
- Publication date Nov 28, 2013
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...
- Publication number 20130299986
- Publication date Nov 14, 2013
- Micron Technology, Inc.
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS

Yangyang Sun

Person

Patents Grantslast 30 patents

Thermal compression flip chip bump for high performance and fine pitch

Package comprising spacers between integrated devices

Integrated device comprising interconnect structures having an inne...

Flip-chip flexible under bump metallization size

Flip-chip device

Repurposed seed layer for high frequency noise control and electros...

High density and reliable vertical natural capacitors

Methods for forming semiconductor device packages with photoimageab...

Integrated circuit constructions having through substrate vias and...

Semiconductor structures comprising a dielectric material having a...

Methods for forming a semiconductor structure

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

STACKED INTEGRATED CIRCUIT DEVICES

FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND R...

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...

FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE

INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT

INTEGRATED DEVICE COMPRISING ELONGATED PADS

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (...

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN METALLIZA...

PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURE...

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH...

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTE...

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

REPURPOSED SEED LAYER FOR HIGH FREQUENCY NOISE CONTROL AND ELECTROS...

THERMAL COMPRESSION FLIP CHIP BUMP

INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...

FLIP-CHIP DEVICE

HIGH DENSITY AND RELIABLE VERTICAL NATURAL CAPACITORS

CONDUCTIVE INTERCONNECT INCLUDING AN INORGANIC COLLAR

METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES

Semiconductor Constructions and Methods of Forming Semiconductor Co...

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES WITH PHOTOIMAGEAB...