Yanwen Bai

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging-level chip and chip module packaged with magnetic cover,...
- Patent number 11,769,708
- Issue date Sep 26, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board
- Patent number 11,706,878
- Issue date Jul 18, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable non-volatile storage card
- Patent number 11,308,380
- Issue date Apr 19, 2022
- INNOGRIT TECHNOLOGIES CO., LTD.
- Abhilash Mathew
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including control switches to reduce pin capac...
- Patent number 11,177,239
- Issue date Nov 16, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solid-State Drive with Detachable Capacitor Housing Portion
- Publication number 20230359253
- Publication date Nov 9, 2023
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING-LEVEL CHIP AND CHIP MODULE PACKAGED WITH MAGNETIC COVER,...
- Publication number 20220270951
- Publication date Aug 25, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Circuit Board
- Publication number 20220217851
- Publication date Jul 7, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY WITH THERMAL COATING IN CONTACT WITH EXPOSED METAL...
- Publication number 20220068749
- Publication date Mar 3, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MICROSTRIP WITH OPEN SLOT FOR HIGH SPEED SIGNAL TRACES
- Publication number 20210392742
- Publication date Dec 16, 2021
- INNOGRIT TECHNOLOGIES CO., LTD
- Shiann-Ming LIOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...
- Publication number 20190006320
- Publication date Jan 3, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Shineng Ma
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Packaging-level chip and chip module packaged with magnetic cover,...

Multilayer circuit board

Removable non-volatile storage card

Semiconductor device including control switches to reduce pin capac...

Patents Applicationslast 30 patents

Solid-State Drive with Detachable Capacitor Housing Portion

PACKAGING-LEVEL CHIP AND CHIP MODULE PACKAGED WITH MAGNETIC COVER,...

Multilayer Circuit Board

CIRCUIT ASSEMBLY WITH THERMAL COATING IN CONTACT WITH EXPOSED METAL...

EMBEDDED MICROSTRIP WITH OPEN SLOT FOR HIGH SPEED SIGNAL TRACES

SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...