Yanyan HUANG

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of eliminating surface stress of silicon wafer
- Patent number 7,524,235
- Issue date Apr 28, 2009
- Yuling Liu
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF CLEANING MULTILAYER COPPER WIRINGS IN ULTRA LARGE SCALE I...
- Publication number 20130118522
- Publication date May 16, 2013
- Hebei University of Technology
- Yuling LIU
- B08 - CLEANING
Information Patent Application
METHOD OF ELIMINATING SURFACE STRESS OF SILICON WAFER
- Publication number 20070298690
- Publication date Dec 27, 2007
- Yuling LIU
- B28 - WORKING CEMENT, CLAY, OR STONE