Yao-Tsung Chuang

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structures with multiple threshold voltage offerings...
- Patent number 12,142,640
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Mei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer-on-substrate package with improved yield
- Patent number 12,068,300
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with through silicon vias, guard rings and methods of makin...
- Patent number 12,046,566
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including a copper edge seal ring structure and methods...
- Patent number 12,040,289
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of transistor gates
- Patent number 11,901,436
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Jui Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding substrate and display panel
- Patent number 11,772,363
- Issue date Oct 3, 2023
- Hannstar Display Corporation
- Yao-Chih Chuang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 11,728,262
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch display device including buffer layer for accuracy of touch s...
- Patent number 11,644,913
- Issue date May 9, 2023
- Hannstar Display Corporation
- Tzung-Hsien Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pixel array substrate and display device
- Patent number 11,513,400
- Issue date Nov 29, 2022
- Hannstar Display Corporation
- Mei-Ling Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with crack preventing structure
- Patent number 11,342,291
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical-shaped or tier-shaped pillar connections
- Patent number 11,315,896
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask and electronic device thereof
- Patent number 11,307,725
- Issue date Apr 19, 2022
- Hannstar Display Corporation
- Mei-Ling Chou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing flexible panel
- Patent number 11,291,112
- Issue date Mar 29, 2022
- Hannstar Display Corporation
- Yao-Chih Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data processing device and method
- Patent number 11,258,461
- Issue date Feb 22, 2022
- Realtek Semiconductor Corporation
- Yao-Chun Chuang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stress reduction apparatus and method
- Patent number 11,244,940
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Luminescent material and light emitting device and display device u...
- Patent number 11,205,742
- Issue date Dec 21, 2021
- CHIMEI CORPORATION
- Yuan-Ren Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,867,810
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of touch panel
- Patent number 10,824,255
- Issue date Nov 3, 2020
- Hannstar Display Corporation
- Chih-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch-sensitive keypad control device
- Patent number 10,804,897
- Issue date Oct 13, 2020
- Touchplus Information Corp.
- Shih-Hsien Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Elongated bump structures in package structure
- Patent number 10,784,223
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,748,785
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 10,692,848
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel, touch display device, and manufacturing method of touc...
- Patent number 10,528,161
- Issue date Jan 7, 2020
- Hannstar Display Corporation
- Chih-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bump on pad (BOP) bonding structure in semiconductor packaged device
- Patent number 10,515,917
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase touch-sensing electronic device
- Patent number 10,481,742
- Issue date Nov 19, 2019
- Touchplus Information Corp.
- Shih-Hsien Hu
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
DENDRITE MITIGATION OF PASSIVE COMPONENTS
- Publication number 20250038043
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
- Publication number 20240395666
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
- Publication number 20240395750
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Shen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH MULTIPLE THRESHOLD VOLTAGE OFFERINGS...
- Publication number 20240387639
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Mei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING STRUCTURE
- Publication number 20240379588
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD
- Publication number 20240355804
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...
- Publication number 20240332218
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20240332220
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...
- Publication number 20240332219
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRESHOLD VOLTAGE TUNING USING A MULTIPLE DIPOLE LOOP PROCESS FOR C...
- Publication number 20240321646
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Ho Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20240312857
- Publication date Sep 19, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Volumeless Threshold Voltage Tuning for Stacked Device Structures
- Publication number 20240290662
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Teng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INQUIRER-SIDE CIRCUIT SUPPORTING ASYMMETRY DATA MODE
- Publication number 20240195449
- Publication date Jun 13, 2024
- Realtek Semiconductor Corp.
- Yuan-Jih CHU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INQUIRER-SIDE CIRCUIT CAPABLE OF OPERATING IN ASYMMETRY DATA MODE
- Publication number 20240195450
- Publication date Jun 13, 2024
- Realtek Semiconductor Corp.
- Yuan-Jih CHU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FORMATION OF TRANSISTOR GATES
- Publication number 20240154024
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Jui CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240105654
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chita CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
- Publication number 20240071974
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
- Publication number 20240071998
- Publication date Feb 29, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE
- Publication number 20240063099
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bridge Die Having Different Surface Orientation Than Ic Dies Interc...
- Publication number 20240055354
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME
- Publication number 20240047321
- Publication date Feb 8, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Tien-Chung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
- Publication number 20240038649
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
- Publication number 20240038701
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING STEPPED SURFACES AND METHODS OF FORMING THE SAME
- Publication number 20240030076
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Yao-Tsung Chuang

Person

Patents Grantslast 30 patents

Semiconductor structures with multiple threshold voltage offerings...

Stress reduction apparatus and method

Metal plate corner structure on metal insulator metal

Chip-on-wafer-on-substrate package with improved yield

Devices with through silicon vias, guard rings and methods of makin...

Interposer including a copper edge seal ring structure and methods...

Semiconductor package and method of forming same

Formation of transistor gates

Semiconductor device and package assembly including the same

Electromagnetic shielding substrate and display panel

Metal plate corner structure on metal insulator metal

Touch display device including buffer layer for accuracy of touch s...

Pixel array substrate and display device

Semiconductor packages with crack preventing structure

Conical-shaped or tier-shaped pillar connections

Mask and electronic device thereof

Method for manufacturing flexible panel

Data processing device and method

Stress reduction apparatus and method

Luminescent material and light emitting device and display device u...

Bonded structures for package and substrate

Substrate pad structure

Manufacturing method of touch panel

Touch-sensitive keypad control device

Elongated bump structures in package structure

Substrate pad structure

Stress reduction apparatus and method

Touch panel, touch display device, and manufacturing method of touc...

Bump on pad (BOP) bonding structure in semiconductor packaged device

Multi-phase touch-sensing electronic device

Patents Applicationslast 30 patents

DENDRITE MITIGATION OF PASSIVE COMPONENTS

THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES

Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure

SEMICONDUCTOR STRUCTURES WITH MULTIPLE THRESHOLD VOLTAGE OFFERINGS...

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

GUARD RING STRUCTURE

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD

DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...

THRESHOLD VOLTAGE TUNING USING A MULTIPLE DIPOLE LOOP PROCESS FOR C...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME

Volumeless Threshold Voltage Tuning for Stacked Device Structures

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

INQUIRER-SIDE CIRCUIT SUPPORTING ASYMMETRY DATA MODE

INQUIRER-SIDE CIRCUIT CAPABLE OF OPERATING IN ASYMMETRY DATA MODE

FORMATION OF TRANSISTOR GATES

METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...

INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...

REDUCTION OF CRACKS IN REDISTRIBUTION STRUCTURE

Bridge Die Having Different Surface Orientation Than Ic Dies Interc...

INTEGRATED FAN-OUT PACKAGE AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION

FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER

INTERPOSER INCLUDING STEPPED SURFACES AND METHODS OF FORMING THE SAME