Yaojian Lin

Person

Jiangyin, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SIP package structure
- Patent number 12,249,582
- Issue date Mar 11, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for manufacturing the same
- Patent number 12,148,681
- Issue date Nov 19, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated package structure
- Patent number 12,074,116
- Issue date Aug 27, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-substrate antenna package structure and method for manufacturi...
- Patent number 11,978,694
- Issue date May 7, 2024
- JCET GROUP CO., LTD.
- Shuo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a plurality of chips attached to a lead fr...
- Patent number 11,854,949
- Issue date Dec 26, 2023
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dual-sided interconnect...
- Patent number 11,569,136
- Issue date Jan 31, 2023
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an embedded conductive layer for power/...
- Patent number 11,488,838
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 11,488,932
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 11,469,191
- Issue date Oct 11, 2022
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming MEMS package
- Patent number 11,319,207
- Issue date May 3, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming openings through insulat...
- Patent number 11,127,666
- Issue date Sep 21, 2021
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 11,024,561
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded conductive laye...
- Patent number 10,741,416
- Issue date Aug 11, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming MEMS package
- Patent number 10,730,745
- Issue date Aug 4, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 10,707,150
- Issue date Jul 7, 2020
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 10,662,056
- Issue date May 26, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 10,658,330
- Issue date May 19, 2020
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 10,636,753
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating 3D package with shor...
- Patent number 10,629,531
- Issue date Apr 21, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect substrate f...
- Patent number 10,607,946
- Issue date Mar 31, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building up a fan-out RDL structure with fine pitch line...
- Patent number 10,504,845
- Issue date Dec 10, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming build-up interconnect st...
- Patent number 10,304,817
- Issue date May 28, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
- Publication number 20250149454
- Publication date May 8, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125289
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- KaiChong CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...
- Publication number 20250087545
- Publication date Mar 13, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062298
- Publication date Feb 20, 2025
- JCET Group Co., Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062215
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Danfeng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Integrating eWLB with E-bar Stru...
- Publication number 20250038101
- Publication date Jan 30, 2025
- STATS ChipPAC Pte Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Fan-Out Semiconductor P...
- Publication number 20240379479
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Providing FOUP or Cassette Supporting Structur...
- Publication number 20240332051
- Publication date Oct 3, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING ST...
- Publication number 20240162267
- Publication date May 16, 2024
- JCET GROUP CO., LTD.
- Jianyong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128142
- Publication date Apr 18, 2024
- JCET GROUP CO., LTD.
- Shuo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
- Publication number 20240105630
- Publication date Mar 28, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates
- Publication number 20240096807
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240079759
- Publication date Mar 7, 2024
- STATS ChipPAC Pte Ltd.
- PeiEe Linda CHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Hybrid Substrate with Un...
- Publication number 20240071885
- Publication date Feb 29, 2024
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411826
- Publication date Dec 21, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335882
- Publication date Oct 19, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282599
- Publication date Sep 7, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275039
- Publication date Aug 31, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187366
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187363
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187422
- Publication date Jun 15, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE
- Publication number 20230178517
- Publication date Jun 8, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dual-Sided Interconnect...
- Publication number 20230096463
- Publication date Mar 30, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Split RDL Connection Between Die and UBM
- Publication number 20230056780
- Publication date Feb 23, 2023
- STATS ChipPAC Pte Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20230015504
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230005811
- Publication date Jan 5, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS

Yaojian Lin

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming microelectromechanical s...

Package structure and method for forming same

SIP package structure

Fan-out package structure and method for manufacturing the same

Split RDL connection between die and UBM

Antenna in embedded wafer-level ball-grid array package

Semiconductor device and method to minimize stress on stack via

Integrated package structure

Dual-substrate antenna package structure and method for manufacturi...

Package structure having a plurality of chips attached to a lead fr...

Semiconductor device and method of forming interposer with opening...

Semiconductor device and method of forming dual-sided interconnect...

Semiconductor device having an embedded conductive layer for power/...

Semiconductor device and method of using a standardized carrier to...

Antenna in embedded wafer-level ball-grid array package

Semiconductor device and method of forming microelectromechanical s...

Semiconductor device and method of forming MEMS package

Semiconductor device and method of forming openings through insulat...

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of forming embedded conductive laye...

Semiconductor device and method of forming MEMS package

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of forming microelectromechanical s...

Semiconductor device and method of using a standardized carrier to...

Antenna in embedded wafer-level ball-grid array package

Semiconductor device and method of fabricating 3D package with shor...

Semiconductor device and method of forming interconnect substrate f...

Method for building up a fan-out RDL structure with fine pitch line...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of forming build-up interconnect st...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making a Molded IPD-CoW

Semiconductor Device and Methods of Making and Using Pre-Molded Bri...

Semiconductor Device and Method of Forming Fan-Out Package Structur...

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

Semiconductor Device and Method of Integrating eWLB with E-bar Stru...

Semiconductor Device and Method of Making a Fan-Out Semiconductor P...

System and Method of Providing FOUP or Cassette Supporting Structur...

MICROMINIATURE IMAGE ACQUISITION AND PROCESSING SYSTEM PACKAGING ST...

DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Stacking Hybrid Substrates with...

Semiconductor Device and Method of Stacking Hybrid Substrates

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming Hybrid Substrate with Un...

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FAN-OUT PACKAGE STRUCTURE

Semiconductor Device and Method of Forming Dual-Sided Interconnect...

Split RDL Connection Between Die and UBM

Semiconductor Device and Method of Using a Standardized Carrier to...

FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME