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Patents Grants
last 30 patents
Information
Patent Grant
Dual-substrate antenna package structure and method for manufacturi...
Patent number
11,978,694
Issue date
May 7, 2024
JCET GROUP CO., LTD.
Shuo Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure having a plurality of chips attached to a lead fr...
Patent number
11,854,949
Issue date
Dec 26, 2023
JCET GROUP CO., LTD.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming dual-sided interconnect...
Patent number
11,569,136
Issue date
Jan 31, 2023
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having an embedded conductive layer for power/...
Patent number
11,488,838
Issue date
Nov 1, 2022
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of using a standardized carrier to...
Patent number
11,488,932
Issue date
Nov 1, 2022
STATS ChipPAC Pte. Ltd.
Byung Joon Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna in embedded wafer-level ball-grid array package
Patent number
11,469,191
Issue date
Oct 11, 2022
STATS ChipPAC Pte. Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
11,370,655
Issue date
Jun 28, 2022
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming MEMS package
Patent number
11,319,207
Issue date
May 3, 2022
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming openings through insulat...
Patent number
11,127,666
Issue date
Sep 21, 2021
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
Patent number
11,024,561
Issue date
Jun 1, 2021
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming embedded conductive laye...
Patent number
10,741,416
Issue date
Aug 11, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming MEMS package
Patent number
10,730,745
Issue date
Aug 4, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
Patent number
10,707,150
Issue date
Jul 7, 2020
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
10,662,056
Issue date
May 26, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device and method of using a standardized carrier to...
Patent number
10,658,330
Issue date
May 19, 2020
STATS ChipPAC Pte. Ltd.
Byung Joon Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna in embedded wafer-level ball-grid array package
Patent number
10,636,753
Issue date
Apr 28, 2020
STATS ChipPAC Pte. Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating 3D package with shor...
Patent number
10,629,531
Issue date
Apr 21, 2020
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interconnect substrate f...
Patent number
10,607,946
Issue date
Mar 31, 2020
JCET Semiconductor (Shaoxing) Co., Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for building up a fan-out RDL structure with fine pitch line...
Patent number
10,504,845
Issue date
Dec 10, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a vertical interconnect...
Patent number
10,475,779
Issue date
Nov 12, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming build-up interconnect st...
Patent number
10,304,817
Issue date
May 28, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming PoP semiconductor device...
Patent number
10,297,519
Issue date
May 21, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
Patent number
10,297,556
Issue date
May 21, 2019
STATS ChipPAC Pte. Ltd.
Kian Meng Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making embedded wafer level chip...
Patent number
10,242,887
Issue date
Mar 26, 2019
STATS ChipPAC Pte. Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna in embedded wafer-level ball-grid array package
Patent number
10,211,171
Issue date
Feb 19, 2019
STATS ChipPAC Pte. Ltd.
Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of controlling warpage in reconstit...
Patent number
10,163,747
Issue date
Dec 25, 2018
STATS ChipPAC Pte. Ltd.
Kian Meng Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided semiconductor package and dual-mold method of making same
Patent number
10,115,672
Issue date
Oct 30, 2018
STATS ChipPAC Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming low profile fan-out pack...
Patent number
9,978,665
Issue date
May 22, 2018
STATS ChipPAC Pte. Ltd.
Pandi C. Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240128142
Publication date
Apr 18, 2024
JCET GROUP CO., LTD.
Shuo Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
Publication number
20240105630
Publication date
Mar 28, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates
Publication number
20240096807
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20240079759
Publication date
Mar 7, 2024
STATS ChipPAC Pte Ltd.
PeiEe Linda CHUA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Hybrid Substrate with Un...
Publication number
20240071885
Publication date
Feb 29, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
Publication number
20240057256
Publication date
Feb 15, 2024
JCET GROUP CO., LTD.
Yaojian LIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230411826
Publication date
Dec 21, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230335882
Publication date
Oct 19, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230282599
Publication date
Sep 7, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230275039
Publication date
Aug 31, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230187366
Publication date
Jun 15, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230187363
Publication date
Jun 15, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230187422
Publication date
Jun 15, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE
Publication number
20230178517
Publication date
Jun 8, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Dual-Sided Interconnect...
Publication number
20230096463
Publication date
Mar 30, 2023
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Split RDL Connection Between Die and UBM
Publication number
20230056780
Publication date
Feb 23, 2023
STATS ChipPAC Pte Ltd.
Jian Zuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
Publication number
20230015504
Publication date
Jan 19, 2023
STATS ChipPAC Pte Ltd.
Byung Joon Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230005811
Publication date
Jan 5, 2023
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
Publication number
20220399254
Publication date
Dec 15, 2022
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL-SUBSTRATE ANTENNA PACKAGE STRUCTURE AND METHOD FOR MANUFACTURI...
Publication number
20220392831
Publication date
Dec 8, 2022
JCET GROUP CO., LTD.
SHUO LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
Publication number
20220375886
Publication date
Nov 24, 2022
STATS ChipPAC Pte Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
Publication number
20220289560
Publication date
Sep 15, 2022
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
INTEGRATED PACKAGE STRUCTURE
Publication number
20220223541
Publication date
Jul 14, 2022
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP PACKAGE STRUCTURE
Publication number
20220223539
Publication date
Jul 14, 2022
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND PACKAGE METHOD FOR CAVITY DEVICE GROUP
Publication number
20220223574
Publication date
Jul 14, 2022
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
Publication number
20220208667
Publication date
Jun 30, 2022
JCET GROUP CO., LTD.
YAOJIAN LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
Publication number
20200402855
Publication date
Dec 24, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
Publication number
20200399117
Publication date
Dec 24, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Semiconductor Device and Method of Forming Embedded Conductive Laye...
Publication number
20200335358
Publication date
Oct 22, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming MEMS Package
Publication number
20200325014
Publication date
Oct 15, 2020
STATS ChipPAC Pte Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY