Yasuharu Ichinose

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Patents Grantslast 30 patents

Information Patent Grant
Diode package having an anode and a cathode formed on one surface o...
- Patent number 7,023,027
- Issue date Apr 4, 2006
- Renesas Technology Corp.
- Toshiya Teramae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Schottky diode with bump electrodes
- Patent number 6,605,854
- Issue date Aug 12, 2003
- Hitachi, Ltd.
- Hiroyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20060079027
- Publication date Apr 13, 2006
- Renesas Technology Corporation
- Kohei Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20050009298
- Publication date Jan 13, 2005
- Shuichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, manufacturing method of semiconductor package
- Publication number 20030094621
- Publication date May 22, 2003
- Toshiya Teramae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the semiconductor...
- Publication number 20020102804
- Publication date Aug 1, 2002
- Hitachi, Ltd.
- Hiroyuki Nagase
- H01 - BASIC ELECTRIC ELEMENTS