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Yasuhiko Kusama

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  • Nagano-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Electronic component built-in substrate and electronic device
    • Patent number 10,211,119
    • Issue date Feb 19, 2019
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko Kusama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,852,970
    • Issue date Dec 26, 2017
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,627,308
    • Issue date Apr 18, 2017
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate
    • Patent number 9,627,309
    • Issue date Apr 18, 2017
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate and method of making wiring substrate
    • Patent number 9,560,768
    • Issue date Jan 31, 2017
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko Kusama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring substrate and method of making wiring substrate
    • Patent number 9,497,863
    • Issue date Nov 15, 2016
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko Kusama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring board and method of manufacturing the same
    • Patent number 8,835,773
    • Issue date Sep 16, 2014
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing a wiring board
    • Patent number 8,222,532
    • Issue date Jul 17, 2012
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing a wiring board
    • Patent number 8,037,596
    • Issue date Oct 18, 2011
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE FIXING DEVICE
    • Publication number 20240071800
    • Publication date Feb 29, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko Kusama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
    • Publication number 20210175054
    • Publication date Jun 10, 2021
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko Kusama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND ELECTRONIC DEVICE
    • Publication number 20160353576
    • Publication date Dec 1, 2016
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko Kusama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20160322294
    • Publication date Nov 3, 2016
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20160322289
    • Publication date Nov 3, 2016
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20160322295
    • Publication date Nov 3, 2016
    • Shinko Electric Industries Co., Ltd.
    • Kazuhiro KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MAKING WIRING SUBSTRATE
    • Publication number 20150257275
    • Publication date Sep 10, 2015
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko KUSAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MAKING WIRING SUBSTRATE
    • Publication number 20150257274
    • Publication date Sep 10, 2015
    • Shinko Electric Industries Co., Ltd.
    • Yasuhiko KUSAMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20110253422
    • Publication date Oct 20, 2011
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20100252304
    • Publication date Oct 7, 2010
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20100101851
    • Publication date Apr 29, 2010
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLIP-CHIP SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20100090352
    • Publication date Apr 15, 2010
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
    • Publication number 20080283277
    • Publication date Nov 20, 2008
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20080251279
    • Publication date Oct 16, 2008
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20080223612
    • Publication date Sep 18, 2008
    • Shinko Electric Industries Co., Ltd.
    • Shigetsugu Muramatsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR