Yasuhiro Endo

Person

Tsukuba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper foil and method for producing same
- Patent number 12,091,766
- Issue date Sep 17, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil and method for manufacturing same
- Patent number 11,952,675
- Issue date Apr 9, 2024
- NIPPON DENKAI, LTD.
- Toshio Kawasaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing a roughening-treated copper foil
- Patent number 6,497,806
- Issue date Dec 24, 2002
- Nippon Denkai, Ltd.
- Yasuhiro Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing copper foil for fine wiring
- Patent number 6,495,022
- Issue date Dec 17, 2002
- Nippon Denkai, Ltd.
- Yasuhiro Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aryl ester compound, its production process, epoxy resin compositio...
- Patent number 6,469,109
- Issue date Oct 22, 2002
- Sumitomo Chemical Company, Limited
- Youichi Ueda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Ester compound and thermosetting resin composition using the same
- Patent number 6,270,899
- Issue date Aug 7, 2001
- Sumitomo Chemical Company, Limited
- Yasuhiro Endo
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Cyanite composition and copper-clad laminate using the composition
- Patent number 6,037,438
- Issue date Mar 14, 2000
- Sumitomo Chemical Company, Limited
- Yasuhiro Endo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper-clad laminate with prepreg of epoxy resin and aryl ester
- Patent number 5,916,683
- Issue date Jun 29, 1999
- Sumitomo Chemical Company, Ltd.
- Youichi Ueda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,750,789
- Issue date May 12, 1998
- Sumitomo Chemical Company Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Esterified resorcinol-carbonyl compound condensates and epoxy resin...
- Patent number 5,726,257
- Issue date Mar 10, 1998
- Sumitomo Chemical Company, Ltd.
- Youichi Ueda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Copper clad laminate, multilayer printed circuit board and their pr...
- Patent number 5,569,545
- Issue date Oct 29, 1996
- Nippon Denkai Ltd.
- Hitoshi Yokono
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cyanate resin composition and copper-clad laminate
- Patent number 5,563,237
- Issue date Oct 8, 1996
- Sumitomo Chemical Company, Limited
- Yasuhiro Endo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,498,687
- Issue date Mar 12, 1996
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,444,165
- Issue date Aug 22, 1995
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyamino oligomers and polymaleimide compounds
- Patent number 5,399,715
- Issue date Mar 21, 1995
- Sumitomo Chemical Company, Limited
- Shigeki Naitoh
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,326,881
- Issue date Jul 5, 1994
- Sumitomo Chemical Company Ltd.
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED COPPER FOIL
- Publication number 20240308183
- Publication date Sep 19, 2024
- NIPPON DENKAI, LTD.
- Yasuhiro ENDO
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME
- Publication number 20230043755
- Publication date Feb 9, 2023
- NIPPON DENKAI, LTD.
- Toshio KAWASAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING SAME
- Publication number 20220112618
- Publication date Apr 14, 2022
- NIPPON DENKAI, LTD.
- Toshio KAWASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PRODUCING A ROUGHENING-TREATED COPPER FOIL
- Publication number 20020182433
- Publication date Dec 5, 2002
- Yasuhiro Endo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of producing copper foil for fine wiring
- Publication number 20020053517
- Publication date May 9, 2002
- Yasuhiro Endo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NOVEL ARYL ESTER COMPOUND, ITS PRODUCTION PROCESS , EPOXY RESIN COM...
- Publication number 20020010288
- Publication date Jan 24, 2002
- YOUICHI UEDA
- C07 - ORGANIC CHEMISTRY

Yasuhiro Endo

Person

Patents Grantslast 30 patents

Electrolytic copper foil and method for producing same

Surface-treated copper foil and method for manufacturing same

Method of producing a roughening-treated copper foil

Method of producing copper foil for fine wiring

Aryl ester compound, its production process, epoxy resin compositio...

Ester compound and thermosetting resin composition using the same

Cyanite composition and copper-clad laminate using the composition

Copper-clad laminate with prepreg of epoxy resin and aryl ester

Unsaturated imide compounds containing alicyclic structure, process...

Esterified resorcinol-carbonyl compound condensates and epoxy resin...

Copper clad laminate, multilayer printed circuit board and their pr...

Cyanate resin composition and copper-clad laminate

Unsaturated imide compounds containing alicyclic structure, process...

Unsaturated imide compounds containing alicyclic structure, process...

Polyamino oligomers and polymaleimide compounds

Unsaturated imide compounds containing alicyclic structure, process...

Patents Applicationslast 30 patents

SURFACE-TREATED COPPER FOIL

SURFACE-TREATED COPPER FOIL AND METHOD FOR MANUFACTURING SAME

ELECTROLYTIC COPPER FOIL AND METHOD FOR PRODUCING SAME

METHOD OF PRODUCING A ROUGHENING-TREATED COPPER FOIL

Method of producing copper foil for fine wiring

NOVEL ARYL ESTER COMPOUND, ITS PRODUCTION PROCESS , EPOXY RESIN COM...