Yasuhiro Hirano

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition and resin-encapsulated semiconductor device
- Patent number 6,255,409
- Issue date Jul 3, 2001
- Sumitomo Chemical Co., Ltd.
- Yoshiki Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Granular coated fertilizer and method for producing the same
- Patent number 6,231,633
- Issue date May 15, 2001
- Sumitomo Chemical Company Limited
- Yasuhiro Hirano
- C05 - FERTILISERS MANUFACTURE THEREOF
Information Patent Grant
Epoxy resin composition and resin-encapsulated semiconductor device
- Patent number 6,190,786
- Issue date Feb 20, 2001
- Sumitomo Chemical Company, Ltd.
- Yasuhiro Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin, resin composition, and resin-encapsulated semiconducto...
- Patent number 5,939,473
- Issue date Aug 17, 1999
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Epoxy resin, resin composition, and resin-encapsulated semiconducto...
- Patent number 5,939,509
- Issue date Aug 17, 1999
- Sumitomo Chemical Company, Ltd.
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Epoxy resin stilbenes and process for producing the same by photois...
- Patent number 5,854,370
- Issue date Dec 29, 1998
- Sumitomo Chemical Company, Limited
- Akira Yokota
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Filler-containing resin composition suitable for injection molding...
- Patent number 5,780,145
- Issue date Jul 14, 1998
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,750,789
- Issue date May 12, 1998
- Sumitomo Chemical Company Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Filler-containing resin composition suitable for injection molding...
- Patent number 5,719,225
- Issue date Feb 17, 1998
- Sumitomo Chemical Company, Ltd.
- Yasuhiro Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin and process for producing the same
- Patent number 5,705,596
- Issue date Jan 6, 1998
- Sumitomo Chemical Company, Limited
- Akira Yokota
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,498,687
- Issue date Mar 12, 1996
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,444,165
- Issue date Aug 22, 1995
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Aromatic allyl amine thermosetting resin composition
- Patent number 5,329,047
- Issue date Jul 12, 1994
- Sumitomo Chemical Co., Ltd.
- Shigeki Naitoh
- B32 - LAYERED PRODUCTS
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,326,881
- Issue date Jul 5, 1994
- Sumitomo Chemical Company Ltd.
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Thermosetting resin composition and use thereof for an electronic part
- Patent number 5,252,687
- Issue date Oct 12, 1993
- Sumitomo Chemical Company, Limited
- Yutaka Shiomi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aromatic allyl amine thermosetting resin composition
- Patent number 5,109,087
- Issue date Apr 28, 1992
- Sumitomo Chemical Company, Limited
- Shigeki Naitoh
- B32 - LAYERED PRODUCTS

Yasuhiro Hirano

Person

Patents Grantslast 30 patents

Epoxy resin composition and resin-encapsulated semiconductor device

Granular coated fertilizer and method for producing the same

Epoxy resin composition and resin-encapsulated semiconductor device

Epoxy resin, resin composition, and resin-encapsulated semiconducto...

Epoxy resin, resin composition, and resin-encapsulated semiconducto...

Epoxy resin stilbenes and process for producing the same by photois...

Filler-containing resin composition suitable for injection molding...

Unsaturated imide compounds containing alicyclic structure, process...

Filler-containing resin composition suitable for injection molding...

Epoxy resin and process for producing the same

Unsaturated imide compounds containing alicyclic structure, process...

Unsaturated imide compounds containing alicyclic structure, process...

Aromatic allyl amine thermosetting resin composition

Unsaturated imide compounds containing alicyclic structure, process...

Thermosetting resin composition and use thereof for an electronic part

Aromatic allyl amine thermosetting resin composition