Yasuji Kaneshima

Person

Mie-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of mounting a semiconductor wafer with a support board on a...
- Patent number 9,142,441
- Issue date Sep 22, 2015
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work bonding and supporting method and work bonding and supporting...
- Patent number 8,281,838
- Issue date Oct 9, 2012
- Nitto Denko Corporation
- Yasuji Kaneshima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for cutting protective tape of semiconductor wafer and prote...
- Patent number 8,109,185
- Issue date Feb 7, 2012
- Nitto Denko Corporation
- Masayuki Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Work bonding and supporting method and work bonding and supporting...
- Patent number 8,110,058
- Issue date Feb 7, 2012
- Nitto Denko Corporation
- Yasuji Kaneshima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for cutting protective tape of semiconductor wafer and appar...
- Patent number 8,042,441
- Issue date Oct 25, 2011
- Nitto Denko Corporation
- Yasuji Kaneshima
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Releasing method and releasing apparatus of work having adhesive tape
- Patent number 7,987,888
- Issue date Aug 2, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Protective tape joining apparatus
- Patent number 7,987,886
- Issue date Aug 2, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Apparatus for cutting the protective tape of semiconductor wafer
- Patent number 7,896,050
- Issue date Mar 1, 2011
- Nitto Denko Corporation
- Masayuki Yamamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Apparatus for joining a separating adhesive tape
- Patent number 7,849,900
- Issue date Dec 14, 2010
- Nitto Denko Corporation
- Saburo Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Releasing method and releasing apparatus of work having adhesive tape
- Patent number 7,406,759
- Issue date Aug 5, 2008
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE TAPE CUTTING METHOD AND ADHESIVE TAPE CUTTING APPARATUS
- Publication number 20140238207
- Publication date Aug 28, 2014
- Nitto Denko Corporation
- Yasuji Kaneshima
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTIN...
- Publication number 20140113413
- Publication date Apr 24, 2014
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORK BONDING AND SUPPORTING METHOD AND WORK BONDING AND SUPPORTING...
- Publication number 20120097338
- Publication date Apr 26, 2012
- NITTO DENKO CORPORATION
- Yasuji Kaneshima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PROTECTIVE TAPE JOINING APPARATUS
- Publication number 20090272496
- Publication date Nov 5, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTE...
- Publication number 20090133551
- Publication date May 28, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME
- Publication number 20090095418
- Publication date Apr 16, 2009
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE
- Publication number 20080230183
- Publication date Sep 25, 2008
- NITTO DENKO CORPORATION
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for cutting protective tape of semiconductor wafer and appar...
- Publication number 20080184855
- Publication date Aug 7, 2008
- Masayuki Yamamoto
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method for cutting protective tape of semiconductor wafer and appar...
- Publication number 20080113492
- Publication date May 15, 2008
- Yasuji Kaneshima
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Work bonding and supporting method and work bonding and supporting...
- Publication number 20070181245
- Publication date Aug 9, 2007
- Nitto Denko Corporation
- Yasuji Kaneshima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Releasing method and releasing apparatus of work having adhesive tape
- Publication number 20070034331
- Publication date Feb 15, 2007
- Nitto Denko Corporation
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Protective tape separating method and apparatus using the same
- Publication number 20060219359
- Publication date Oct 5, 2006
- NITTO DENKO CORPORATION
- Saburo Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Releasing method and releasing apparatus of work having adhesive tape
- Publication number 20050067097
- Publication date Mar 31, 2005
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS

Yasuji Kaneshima

Person

Patents Grantslast 30 patents

Method of mounting a semiconductor wafer with a support board on a...

Work bonding and supporting method and work bonding and supporting...

Method for cutting protective tape of semiconductor wafer and prote...

Work bonding and supporting method and work bonding and supporting...

Method for cutting protective tape of semiconductor wafer and appar...

Releasing method and releasing apparatus of work having adhesive tape

Protective tape joining apparatus

Apparatus for cutting the protective tape of semiconductor wafer

Apparatus for joining a separating adhesive tape

Releasing method and releasing apparatus of work having adhesive tape

Patents Applicationslast 30 patents

ADHESIVE TAPE CUTTING METHOD AND ADHESIVE TAPE CUTTING APPARATUS

SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTIN...

WORK BONDING AND SUPPORTING METHOD AND WORK BONDING AND SUPPORTING...

PROTECTIVE TAPE JOINING APPARATUS

METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTE...

ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME

RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE

Method for cutting protective tape of semiconductor wafer and appar...

Method for cutting protective tape of semiconductor wafer and appar...

Work bonding and supporting method and work bonding and supporting...

Releasing method and releasing apparatus of work having adhesive tape

Protective tape separating method and apparatus using the same

Releasing method and releasing apparatus of work having adhesive tape