TREA

Yasumasa Morishima

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Patents Grantslast 30 patents

  • Information Patent Grant

    Thermoplastic composite material and formed body
    • Patent number 11,203,673
    • Issue date Dec 21, 2021
    • Furukawa Electric Co., Ltd.
    • Motoko Yoshizaki
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Grant

    Current collector, electrode, secondary battery and capacitor
    • Patent number 9,741,498
    • Issue date Aug 22, 2017
    • Furukawa Electric Co., Ltd.
    • Takahiro Iida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing tape
    • Patent number 9,324,593
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer processing tape
    • Patent number 9,324,592
    • Issue date Apr 26, 2016
    • Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer-adhering adhesive tape
    • Patent number 8,722,184
    • Issue date May 13, 2014
    • The Furukawa Electric Co., Ltd.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Wafer-processing tape and method of producing the same
    • Patent number 8,545,979
    • Issue date Oct 1, 2013
    • The Furukawa Electric Co., Ltd.
    • Kenji Kita
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Method of producing a semiconductor device, and wafer-processing tape
    • Patent number 8,043,698
    • Issue date Oct 25, 2011
    • The Furukawa Electric Co., Ltd.
    • Yasumasa Morishima
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Semiconductor wafer processing tape
    • Patent number D628170
    • Issue date Nov 30, 2010
    • The Furukawa Electric Company
    • Hiromitsu Maruyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor wafer processing tape
    • Patent number D621803
    • Issue date Aug 17, 2010
    • The Furukawa Electric Co., Ltd.
    • Hiromitsu Maruyama
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Dicing/die bonding sheet
    • Patent number 7,517,724
    • Issue date Apr 14, 2009
    • Hitachi Chemical Company, Ltd.
    • Keiichi Hatakeyama
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents