Yasumitsu Orii

Person

Higashi Ohmi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,115,692
- Issue date Oct 30, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure between a substrate and a semicondu...
- Patent number 9,941,230
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- G02 - OPTICS
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,698,119
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 9,586,281
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump on a substrate
- Patent number 9,520,375
- Issue date Dec 13, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a through electrode, and method f...
- Patent number 9,466,533
- Issue date Oct 11, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interfacial alloy layer for improving electromigration (EM) resista...
- Patent number 9,391,034
- Issue date Jul 12, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a through electrode, and method f...
- Patent number 9,373,545
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and mounting structure manufacturing method
- Patent number 9,099,315
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction in thickness of semiconductor component on substrate
- Patent number 7,682,936
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Toshihiko Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting method for semiconductor parts on circuit substrate
- Patent number 7,674,651
- Issue date Mar 9, 2010
- International Business Machines Corporation
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method of manufacturing the same
- Patent number 7,605,075
- Issue date Oct 20, 2009
- International Business Machines Corporation
- Shuichl Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 5,878,942
- Issue date Mar 9, 1999
- International Business Machines Corporation
- Yasushi Kodama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180374812
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180076165
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180076164
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180076163
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE
- Publication number 20170194277
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Keji Matsumodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
- Publication number 20170120361
- Publication date May 4, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Forming a Solder Bump on a Substrate
- Publication number 20160322319
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20160260681
- Publication date Sep 8, 2016
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...
- Publication number 20160099175
- Publication date Apr 7, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A SOLDER JOINT BETWEEN METAL LAYERS
- Publication number 20160066435
- Publication date Mar 3, 2016
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...
- Publication number 20160056129
- Publication date Feb 25, 2016
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER
- Publication number 20150279790
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER
- Publication number 20150279812
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER
- Publication number 20150249064
- Publication date Sep 3, 2015
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD
- Publication number 20150021777
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...
- Publication number 20140061889
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Hirokazu Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE
- Publication number 20080150135
- Publication date Jun 26, 2008
- Yukifumi Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reduction in Thickness of Semiconductor Component on Substrate
- Publication number 20080067653
- Publication date Mar 20, 2008
- International Business Machines Corporation
- Toshihiko Nishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20060226537
- Publication date Oct 12, 2006
- International Business Machines Corporation
- Shuichl Okabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yasumitsu Orii

Person

Patents Grantslast 30 patents

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Electrical connecting structure between a substrate and a semicondu...

Interfacial alloy layer for improving electromigration (EM) resista...

Forming a solder joint between metal layers

Method of forming a solder bump on a substrate

Semiconductor structure including a through electrode, and method f...

Interfacial alloy layer for improving electromigration (EM) resista...

Semiconductor structure including a through electrode, and method f...

Mounting structure and mounting structure manufacturing method

Reduction in thickness of semiconductor component on substrate

Mounting method for semiconductor parts on circuit substrate

Multilayer circuit board and method of manufacturing the same

Soldering method and soldering apparatus

Patents Applicationslast 30 patents

METHOD OF FORMING SOLDER BUMPS

METHOD OF FORMING SOLDER BUMPS

METHOD OF FORMING SOLDER BUMPS

METHOD OF FORMING SOLDER BUMPS

ELECTRICAL CONNECTING STRUCTURE

FORMING A SOLDER JOINT BETWEEN METAL LAYERS

Method of Forming a Solder Bump on a Substrate

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...

FORMING A SOLDER JOINT BETWEEN METAL LAYERS

SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...

PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER

PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER

PREVENTION OF WARPING DURING HANDLING OF CHIP-ON-WAFER

MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD

INTERFACIAL ALLOY LAYER FOR IMPROVING ELECTROMIGRATION (EM) RESISTA...

MOUNTING METHOD FOR SEMICONDUCTOR PARTS ON CIRCUIT SUBSTRATE

Reduction in Thickness of Semiconductor Component on Substrate

MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME