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Yasunori Narizuka
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Hiratsuka-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of semiconductor integrated circuit device
Patent number
8,357,933
Issue date
Jan 22, 2013
Renesas Electronics Corporation
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Grant
Method of manufacturing a semiconductor integrated circuit device a...
Patent number
8,206,997
Issue date
Jun 26, 2012
Renesas Electronics Corporation
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Grant
Method of manufacturing a semiconductor integrated circuit device a...
Patent number
8,062,911
Issue date
Nov 22, 2011
Renesas Electronics Corporation
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,901,958
Issue date
Mar 8, 2011
Renesas Electronics Corporation
Masayoshi Okamoto
G01 - MEASURING TESTING
Information
Patent Grant
Manufacturing method of semiconductor integrated circuit device
Patent number
7,776,626
Issue date
Aug 17, 2010
Renesas Technology Corp.
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Grant
Probe card, manufacturing method of probe card, semiconductor inspe...
Patent number
7,724,006
Issue date
May 25, 2010
Renesas Technology Corp.
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Grant
Probe cassette, semiconductor inspection apparatus and manufacturin...
Patent number
7,656,174
Issue date
Feb 2, 2010
Renesas Technology Corp.
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Grant
Manufacturing method of semiconductor integrated circuit device
Patent number
7,598,100
Issue date
Oct 6, 2009
Renesas Technology Corp.
Hideyuki Matsumoto
G01 - MEASURING TESTING
Information
Patent Grant
Method of manufacturing a semiconductor integrated circuit device
Patent number
7,537,943
Issue date
May 26, 2009
Renesas Technology Corp.
Akio Hasebe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor integrated circuit device
Patent number
7,534,629
Issue date
May 19, 2009
Renesas Technology Corp.
Teruo Shoji
G01 - MEASURING TESTING
Information
Patent Grant
Probe sheet adhesion holder, probe card, semiconductor test device,...
Patent number
7,423,439
Issue date
Sep 9, 2008
Renesas Technology Corp.
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Grant
Manufacturing method of semiconductor integrated circuit device
Patent number
7,407,823
Issue date
Aug 5, 2008
Renesas Technology Corp.
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,351,597
Issue date
Apr 1, 2008
Renesas Technology Corp.
Yuji Wada
G01 - MEASURING TESTING
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,235,413
Issue date
Jun 26, 2007
Renesas Technology Corp.
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Grant
Fabrication method of semiconductor integrated circuit device
Patent number
7,219,422
Issue date
May 22, 2007
Renesas Technology Corp.
Yuji Wada
G01 - MEASURING TESTING
Information
Patent Grant
Probe sheet, probe card, semiconductor test equipment and semicondu...
Patent number
7,049,837
Issue date
May 23, 2006
Renesas Technology Corp.
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Grant
Low-EMI electronic apparatus, low-EMI circuit board, and method of...
Patent number
6,707,682
Issue date
Mar 16, 2004
Hitachi, Ltd.
Yutaka Akiba
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low-EMI electronic apparatus, low-EMI circuit board, and method of...
Patent number
6,353,540
Issue date
Mar 5, 2002
Hitachi, Ltd.
Yutaka Akiba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring board having vent holes and method of making
Patent number
6,124,553
Issue date
Sep 26, 2000
Hitachi, Ltd.
Yasunori Narizuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and method of manufacturing the same
Patent number
5,958,600
Issue date
Sep 28, 1999
Hitachi, Ltd.
Hideo Sotokawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sputtering target
Patent number
5,320,729
Issue date
Jun 14, 1994
Hitachi, Ltd.
Yasunori Narizuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board provided with a heat bypass layer
Patent number
5,285,016
Issue date
Feb 8, 1994
Hitachi, Ltd.
Yasunori Narizuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film resistor and wiring board using the same
Patent number
5,235,313
Issue date
Aug 10, 1993
Hitachi, Ltd.
Yasunori Narizuka
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Electronic circuit device having thin film resistor and method for...
Patent number
5,218,335
Issue date
Jun 8, 1993
Hitachi, Ltd.
Asao Nakano
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Circuit substrate and thermal printing head using the same
Patent number
4,806,725
Issue date
Feb 21, 1989
Hitachi, Ltd.
Yasunori Narizuka
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Patents Applications
last 30 patents
Information
Patent Application
PROBE CARD AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIR...
Publication number
20110281380
Publication date
Nov 17, 2011
Renesas Electronics Corporation
Yasunori NARIZUKA
G01 - MEASURING TESTING
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20110175634
Publication date
Jul 21, 2011
Masayoshi Okamoto
G01 - MEASURING TESTING
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20110136272
Publication date
Jun 9, 2011
Masayoshi Okamoto
G01 - MEASURING TESTING
Information
Patent Application
THIN FILM PROBE SHEET AND SEMICONDUCTOR CHIP INSPECTION SYSTEM
Publication number
20110014727
Publication date
Jan 20, 2011
Akira Yabushita
G01 - MEASURING TESTING
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20100304510
Publication date
Dec 2, 2010
Masayoshi Okamoto
G01 - MEASURING TESTING
Information
Patent Application
THIN-FILM PROBE SHEET AND METHOD OF MANUFACTURING THE SAME, PROBE C...
Publication number
20100301884
Publication date
Dec 2, 2010
Etsuko Takane
G01 - MEASURING TESTING
Information
Patent Application
MANUFACTORING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20100277192
Publication date
Nov 4, 2010
Renesas Technology Corp.
Akio HASEBE
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
Publication number
20100279502
Publication date
Nov 4, 2010
RENESAS TECHNOLOGY CORP.
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Application
PROBE CARD, MANUFACTURING METHOD OF PROBE CARD, SEMICONDUCTOR INSPE...
Publication number
20090212798
Publication date
Aug 27, 2009
Susumu KASUKABE
G01 - MEASURING TESTING
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20090130785
Publication date
May 21, 2009
Hideyuki Matsumoto
G01 - MEASURING TESTING
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20090017565
Publication date
Jan 15, 2009
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
Publication number
20080160657
Publication date
Jul 3, 2008
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20080096295
Publication date
Apr 24, 2008
Akio HASEBE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transmission Circuit, Connecting Sheet, Probe Sheet, Probe Card, Se...
Publication number
20080029763
Publication date
Feb 7, 2008
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20080020498
Publication date
Jan 24, 2008
Masayoshi Okamoto
G01 - MEASURING TESTING
Information
Patent Application
Probe Cassette, Semiconductor Inspection Apparatus And Manufacturin...
Publication number
20070279074
Publication date
Dec 6, 2007
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20070218572
Publication date
Sep 20, 2007
Yuji Wada
G01 - MEASURING TESTING
Information
Patent Application
FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20070207559
Publication date
Sep 6, 2007
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Application
Probe sheet adhesion holder, probe card, semiconductor test device,...
Publication number
20070103178
Publication date
May 10, 2007
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Application
Manufacturing method of semiconductor integrated circuit device
Publication number
20060286715
Publication date
Dec 21, 2006
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Application
Manufacturing method of semiconductor integrated circuit device
Publication number
20060281222
Publication date
Dec 14, 2006
Teruo Shoji
G01 - MEASURING TESTING
Information
Patent Application
Thin film probe sheet and semiconductor chip inspection system
Publication number
20060094162
Publication date
May 4, 2006
Akira Yabushita
G01 - MEASURING TESTING
Information
Patent Application
Wiring board and method for producing same
Publication number
20060091553
Publication date
May 4, 2006
Hitachi, Ltd
Yasunori Narizuka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting apparatus, semiconductor chip inspecting apparatus, and...
Publication number
20060043593
Publication date
Mar 2, 2006
Terutaka Mori
G01 - MEASURING TESTING
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20050095734
Publication date
May 5, 2005
Akio Hasebe
G01 - MEASURING TESTING
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20050093565
Publication date
May 5, 2005
Masayoshi Okamoto
G01 - MEASURING TESTING
Information
Patent Application
Wiring board and method for producing same
Publication number
20040201105
Publication date
Oct 14, 2004
Hitachi, Ltd
Yasunori Narizuka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Fabrication method of semiconductor integrated circuit device
Publication number
20040183556
Publication date
Sep 23, 2004
Yuji Wada
G01 - MEASURING TESTING
Information
Patent Application
Probe sheet, probe card, semiconductor test equipment and semicondu...
Publication number
20040070413
Publication date
Apr 15, 2004
Susumu Kasukabe
G01 - MEASURING TESTING
Information
Patent Application
Wiring board and its production method, semiconductor device and it...
Publication number
20030104183
Publication date
Jun 5, 2003
Yasunori Narizuka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR