Yasuo Miyadera

Person

Shimodate, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,781,896
- Issue date Aug 24, 2010
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting electrodes, surface-treated wiring board and...
- Patent number 7,771,559
- Issue date Aug 10, 2010
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electrodes, surface-treated wiring board and...
- Patent number 7,528,488
- Issue date May 5, 2009
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,387,914
- Issue date Jun 17, 2008
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting electrodes, surface-treated wiring board and...
- Patent number 7,258,918
- Issue date Aug 21, 2007
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,078,094
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,057,265
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,012,320
- Issue date Mar 14, 2006
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,855,579
- Issue date Feb 15, 2005
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,825,249
- Issue date Nov 30, 2004
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,717,242
- Issue date Apr 6, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,099,678
- Issue date Aug 8, 2000
- Hitachi Chemical Company Ltd.
- Akio Kotato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid-crystal alignment film
- Patent number 6,001,277
- Issue date Dec 14, 1999
- Hitachi Chemical Company, Ltd.
- Kunihiro Ichimura
- G02 - OPTICS
Information Patent Grant
Environment purifying material
- Patent number 5,997,829
- Issue date Dec 7, 1999
- Hitachi Chemical Company, Ltd.
- Yoshika Sekine
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Electrically conductive bonding films
- Patent number 5,667,899
- Issue date Sep 16, 1997
- Hitachi Chemical Co. Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimides and thermosetting resin compositions containing the same
- Patent number 5,608,013
- Issue date Mar 4, 1997
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrically conductive bonding films
- Patent number 5,605,763
- Issue date Feb 25, 1997
- Hitachi Chemical Company Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alignment film for liquid crystal, liquid crystal-sandwiched panel,...
- Patent number 5,571,579
- Issue date Nov 5, 1996
- Hitachi Chemical Company, Ltd.
- Toshihiko Kato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for surface treatment of polyimide resin molded articles
- Patent number 5,527,621
- Issue date Jun 18, 1996
- Hitachi Chemical Co., Ltd.
- Hidekazu Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyimides, thermosetting resin compositions containing the polyimi...
- Patent number 5,510,425
- Issue date Apr 23, 1996
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimides, thermosetting resin compositions containing the polyimi...
- Patent number 5,508,357
- Issue date Apr 16, 1996
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorine-containing polyimides and precursors thereof
- Patent number 5,401,878
- Issue date Mar 28, 1995
- Hitachi Chemical Company, Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluorine-containing polyimides and precursors thereof
- Patent number 5,270,438
- Issue date Dec 14, 1993
- Hitachi Chemical Company, Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Alkenyl-fluorine-containing aromatic polyamide
- Patent number 5,243,019
- Issue date Sep 7, 1993
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Processes for preparation of polyimide-isoindroquinazolinedione and...
- Patent number 5,115,089
- Issue date May 19, 1992
- Hitachi Chemical Co., Ltd.
- Masatoshi Yoshida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Amino-protected dopa derivative and production thereof
- Patent number 5,098,999
- Issue date Mar 24, 1992
- Hitachi Chemical Company
- Yasuo Yamamoto
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Heat curable resin composition
- Patent number 4,985,509
- Issue date Jan 15, 1991
- Hitachi, Ltd.
- Hidekazu Matuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition for a copper-clad laminate
- Patent number 4,833,204
- Issue date May 23, 1989
- Hitachi Chemical Company, Ltd.
- Masami Yusa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...
- Patent number 4,707,316
- Issue date Nov 17, 1987
- Hitachi Chemical Company, Ltd.
- Atsushi Fujioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...
- Patent number 4,598,115
- Issue date Jul 1, 1986
- Hitachi Chemical Company, Ltd.
- Atsushi Fujioka
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20080290529
- Publication date Nov 27, 2008
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connecting electrodes, surface-treated wiring board and...
- Publication number 20060260744
- Publication date Nov 23, 2006
- Isao Tsukagoshi
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for connecting electrodes, surface-treated wiring board and...
- Publication number 20060263599
- Publication date Nov 23, 2006
- Isao Tsukagoshi
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20060180903
- Publication date Aug 17, 2006
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20040253770
- Publication date Dec 16, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for connecting electrodes, surface-treated wiring board and...
- Publication number 20030178138
- Publication date Sep 25, 2003
- Isao Tsukagoshi
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20030160337
- Publication date Aug 28, 2003
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010035533
- Publication date Nov 1, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010016384
- Publication date Aug 23, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010009780
- Publication date Jul 26, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS

Yasuo Miyadera

Person

Patents Grantslast 30 patents

Semiconductor device and process for fabrication thereof

Method for connecting electrodes, surface-treated wiring board and...

Method for connecting electrodes, surface-treated wiring board and...

Semiconductor device and process for fabrication thereof

Method for connecting electrodes, surface-treated wiring board and...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Liquid-crystal alignment film

Environment purifying material

Electrically conductive bonding films

Polyimides and thermosetting resin compositions containing the same

Electrically conductive bonding films

Alignment film for liquid crystal, liquid crystal-sandwiched panel,...

Method for surface treatment of polyimide resin molded articles

Polyimides, thermosetting resin compositions containing the polyimi...

Polyimides, thermosetting resin compositions containing the polyimi...

Fluorine-containing polyimides and precursors thereof

Fluorine-containing polyimides and precursors thereof

Alkenyl-fluorine-containing aromatic polyamide

Processes for preparation of polyimide-isoindroquinazolinedione and...

Amino-protected dopa derivative and production thereof

Heat curable resin composition

Epoxy resin composition for a copper-clad laminate

Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...

Polyamino-bis-maleimide prepolymer, method for manufacture thereof,...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Method for connecting electrodes, surface-treated wiring board and...

Method for connecting electrodes, surface-treated wiring board and...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Semiconductor device and process for fabrication thereof

Method for connecting electrodes, surface-treated wiring board and...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof