Yasuo Nagaoka

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Annaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,173,521
- Issue date May 8, 2012
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing direct bonded wafer and direct bonded wafer
- Patent number 7,521,334
- Issue date Apr 21, 2009
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POLISHING GERMANIUM WAFER
- Publication number 20170216992
- Publication date Aug 3, 2017
- Shin-Etsu Handotai Co., Ltd.
- Yasuo NAGAOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR-WAFER CLEANING TANK AND METHOD OF MANUFACTURING BONDE...
- Publication number 20160336188
- Publication date Nov 17, 2016
- Shin-Etsu Handotai Co., Ltd.
- Yasuo NAGAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20100120223
- Publication date May 13, 2010
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method of SOI Wafer and SOI Wafer Manufactured by Thi...
- Publication number 20090117706
- Publication date May 7, 2009
- Shin-Etsu Handotai Co., Ltd.
- Yasutsugu Soeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Direct Bonded Wafer and Direct Bonded Wafer
- Publication number 20080102603
- Publication date May 1, 2008
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS