Yasuo Yamagishi

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and method for fabricating the same
- Patent number 7,678,695
- Issue date Mar 16, 2010
- Fujitsu Limited
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component-mounted board
- Patent number 7,595,228
- Issue date Sep 29, 2009
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor system-in-package
- Patent number 7,557,014
- Issue date Jul 7, 2009
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card and testing method of semiconductor chip, capacitor and...
- Patent number 7,449,900
- Issue date Nov 11, 2008
- Fujitsu Limited
- Yasuo Yamagishi
- G01 - MEASURING TESTING
Information Patent Grant
Optical waveguide structure and optical module
- Patent number 7,359,594
- Issue date Apr 15, 2008
- Fujitsu Limited
- Motoyuki Nishizawa
- G02 - OPTICS
Information Patent Grant
Conductive particles, conductive composition, electronic device, an...
- Patent number 7,351,361
- Issue date Apr 1, 2008
- Fujitsu Limited
- Kozo Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for fabricating the same
- Patent number 7,211,899
- Issue date May 1, 2007
- Fujitsu Limited
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor system-in-package
- Patent number 7,176,556
- Issue date Feb 13, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device
- Patent number 7,149,372
- Issue date Dec 12, 2006
- Fujitsu Limited
- Tsuyoshi Aoki
- G02 - OPTICS
Information Patent Grant
Circuit substrate and method for fabricating the same
- Patent number 7,139,176
- Issue date Nov 21, 2006
- Fujitsu Limited
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe card and testing method of semiconductor chip, capacitor and...
- Patent number 7,102,367
- Issue date Sep 5, 2006
- Fujitsu Limited
- Yasuo Yamagishi
- G01 - MEASURING TESTING
Information Patent Grant
Method for production of optical module and optical module
- Patent number 7,097,366
- Issue date Aug 29, 2006
- Fujitsu Limited
- Tsuyoshi Aoki
- G02 - OPTICS
Information Patent Grant
Optical transmission device with optical waveguide coupled to optic...
- Patent number 7,099,534
- Issue date Aug 29, 2006
- Fujitsu Limited
- Masayuki Kato
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Optical device
- Patent number 7,043,098
- Issue date May 9, 2006
- Fujitsu Limited
- Tsuyoshi Aoki
Information Patent Grant
Conductive particles, conductive composition, electronic device, an...
- Patent number 7,025,906
- Issue date Apr 11, 2006
- Fujitsu Limited
- Kozo Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical deflector and optical switch
- Patent number 6,947,625
- Issue date Sep 20, 2005
- Fujitsu Limited
- Motoyuki Nishizawa
- G02 - OPTICS
Information Patent Grant
Thin film multi-layer wiring substrate having a coaxial wiring stru...
- Patent number 6,943,447
- Issue date Sep 13, 2005
- Fujitsu Limited
- Yoshikatsu Ishizuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with capacitor
- Patent number 6,894,396
- Issue date May 17, 2005
- Fujitsu Limited
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical deflector and optical switch
- Patent number 6,879,739
- Issue date Apr 12, 2005
- Fujitsu Limited
- Motoyuki Nishizawa
- G02 - OPTICS
Information Patent Grant
Multilayer printed wiring board
- Patent number 6,846,549
- Issue date Jan 25, 2005
- Fujitsu Limited
- Motoaki Tani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode connection method, electrode surface activation apparatus...
- Patent number 6,806,118
- Issue date Oct 19, 2004
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film circuit substrate
- Patent number 6,768,205
- Issue date Jul 27, 2004
- Fujitsu Limited
- Osamu Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for designing printed-circuit board
- Patent number 6,662,345
- Issue date Dec 9, 2003
- Fujitsu Limited
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder paste and electronic device
- Patent number 6,596,094
- Issue date Jul 22, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps, semiconductor device, and solder paste
- Patent number 6,580,169
- Issue date Jun 17, 2003
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,528,346
- Issue date Mar 4, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps, semiconductor device, and solder paste
- Patent number 6,518,163
- Issue date Feb 11, 2003
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical deflecting element, optical switch module, light signal swi...
- Patent number 6,504,966
- Issue date Jan 7, 2003
- Fujitsu Limited
- Masayuki Kato
- G02 - OPTICS
Information Patent Grant
Method for forming solder bumps
- Patent number 6,319,810
- Issue date Nov 20, 2001
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Defluxing agent cleaning method and cleaning apparatus
- Patent number 6,140,286
- Issue date Oct 31, 2000
- Fujitsu Limited
- Keiji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PASTE AND ELECTRONIC PART
- Publication number 20160066421
- Publication date Mar 3, 2016
- FUJITSU LIMITED
- Kazuhiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate and method for fabricating the same
- Publication number 20070155174
- Publication date Jul 5, 2007
- FIJITSU LIMITED
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor system-in-package
- Publication number 20070065981
- Publication date Mar 22, 2007
- FUJITSU LIMITED
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Probe card and testing method of semiconductor chip, capacitor and...
- Publication number 20060255817
- Publication date Nov 16, 2006
- FUJITSU LIMITED
- Yasuo Yamagishi
- G01 - MEASURING TESTING
Information Patent Application
Method for manufacturing electronic component-mounted board
- Publication number 20060051895
- Publication date Mar 9, 2006
- FUJITSU LIMITED
- Tomoyuki Abe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Conductive particles, conductive composition, electronic device, an...
- Publication number 20060012460
- Publication date Jan 19, 2006
- FUJITSU LIMITED
- Kozo Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with capacitor
- Publication number 20050179128
- Publication date Aug 18, 2005
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical deflector and optical switch
- Publication number 20050123228
- Publication date Jun 9, 2005
- FUJITSU LIMITED
- Motoyuki Nishizawa
- G02 - OPTICS
Information Patent Application
Method for production of optical module and optical module
- Publication number 20050069274
- Publication date Mar 31, 2005
- FUJITSU LIMITED
- Tsuyoshi Aoki
- G02 - OPTICS
Information Patent Application
Optical waveguide structure and optical module
- Publication number 20050058399
- Publication date Mar 17, 2005
- FUJITSU LIMITED
- Motoyuki Nishizawa
- G02 - OPTICS
Information Patent Application
Probe card and testing method of semiconductor chip, capacitor and...
- Publication number 20040239349
- Publication date Dec 2, 2004
- FUJITSU LIMITED
- Yasuo Yamagishi
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device
- Publication number 20040012085
- Publication date Jan 22, 2004
- FUJITSU LIMITED
- Takeshi Shioga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin film multi-layer wiring substrate and method for manufacturing...
- Publication number 20040009666
- Publication date Jan 15, 2004
- FUJITSU LIMITED
- Yoshikatsu Ishizuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrode connection method, electrode surface activation apparatus...
- Publication number 20030148593
- Publication date Aug 7, 2003
- FUJITSU LIMITED
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate and method for fabricating the same
- Publication number 20030137056
- Publication date Jul 24, 2003
- FUJITSU LIMITED
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate and method for fabricating the same
- Publication number 20030116857
- Publication date Jun 26, 2003
- FUJITSU LIMITED
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical device
- Publication number 20030118262
- Publication date Jun 26, 2003
- FUJITSU LIMITED
- Tsuyoshi Aoki
- G02 - OPTICS
Information Patent Application
Semiconductor system-in-package
- Publication number 20030080400
- Publication date May 1, 2003
- FUJITSU LIMITED
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device, and solder paste
- Publication number 20030082897
- Publication date May 1, 2003
- FUJITSU LIMITED
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical deflector and optical switch
- Publication number 20030059148
- Publication date Mar 27, 2003
- FUJITSU LIMITED
- Motoyuki Nishizawa
- G02 - OPTICS
Information Patent Application
Thin-film circuit substrate and manufacturing method thereof, and a...
- Publication number 20030045085
- Publication date Mar 6, 2003
- FUJITSU LIMITED
- Osamu Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical transmission device with optical waveguide coupled to optic...
- Publication number 20020197010
- Publication date Dec 26, 2002
- FUJITSU LIMITED
- Masayuki Kato
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Multilayer printed wiring board
- Publication number 20020182958
- Publication date Dec 5, 2002
- FUJITSU LIMITED
- Motoaki Tani
- B32 - LAYERED PRODUCTS
Information Patent Application
Conductive particles, conductive composition, electronic device, an...
- Publication number 20020175316
- Publication date Nov 28, 2002
- FUJITSU LIMITED
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for designing printed-circuit board
- Publication number 20020144228
- Publication date Oct 3, 2002
- FUJITSU LIMITED
- Hiroki Uchida
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Optical deflecting element, optical switch module, light signal swi...
- Publication number 20020114556
- Publication date Aug 22, 2002
- Masayuki Kato
- G02 - OPTICS
Information Patent Application
Solder paste and electronic device
- Publication number 20020102432
- Publication date Aug 1, 2002
- FUJITSU LIMITED
- Masayuki Ochiai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Solder alloy, a circuit substrate, a semiconductor device and a met...
- Publication number 20010028109
- Publication date Oct 11, 2001
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-forming method using two plates and electronic device
- Publication number 20010018263
- Publication date Aug 30, 2001
- Masayuki Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming bumps, semiconductor device, and solder paste
- Publication number 20010008310
- Publication date Jul 19, 2001
- FUJITSU LIMITED
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS

Yasuo Yamagishi

Person

Patents Grantslast 30 patents

Circuit substrate and method for fabricating the same

Method for manufacturing electronic component-mounted board

Semiconductor system-in-package

Probe card and testing method of semiconductor chip, capacitor and...

Optical waveguide structure and optical module

Conductive particles, conductive composition, electronic device, an...

Circuit substrate and method for fabricating the same

Semiconductor system-in-package

Optical device

Circuit substrate and method for fabricating the same

Probe card and testing method of semiconductor chip, capacitor and...

Method for production of optical module and optical module

Optical transmission device with optical waveguide coupled to optic...

Optical device

Conductive particles, conductive composition, electronic device, an...

Optical deflector and optical switch

Thin film multi-layer wiring substrate having a coaxial wiring stru...

Semiconductor device with capacitor

Optical deflector and optical switch

Multilayer printed wiring board

Electrode connection method, electrode surface activation apparatus...

Thin-film circuit substrate

Method and apparatus for designing printed-circuit board

Solder paste and electronic device

Method for forming bumps, semiconductor device, and solder paste

Bump-forming method using two plates and electronic device

Method for forming bumps, semiconductor device, and solder paste

Optical deflecting element, optical switch module, light signal swi...

Method for forming solder bumps

Defluxing agent cleaning method and cleaning apparatus

Patents Applicationslast 30 patents

SOLDER PASTE AND ELECTRONIC PART

Circuit substrate and method for fabricating the same

Semiconductor system-in-package

Probe card and testing method of semiconductor chip, capacitor and...

Method for manufacturing electronic component-mounted board

Conductive particles, conductive composition, electronic device, an...

Semiconductor device with capacitor

Optical deflector and optical switch

Method for production of optical module and optical module

Optical waveguide structure and optical module

Probe card and testing method of semiconductor chip, capacitor and...

Semiconductor device

Thin film multi-layer wiring substrate and method for manufacturing...

Electrode connection method, electrode surface activation apparatus...

Circuit substrate and method for fabricating the same

Circuit substrate and method for fabricating the same

Optical device

Semiconductor system-in-package

Method for forming bumps, semiconductor device, and solder paste

Optical deflector and optical switch

Thin-film circuit substrate and manufacturing method thereof, and a...

Optical transmission device with optical waveguide coupled to optic...

Multilayer printed wiring board

Conductive particles, conductive composition, electronic device, an...

Method and apparatus for designing printed-circuit board

Optical deflecting element, optical switch module, light signal swi...

Solder paste and electronic device

Solder alloy, a circuit substrate, a semiconductor device and a met...

Bump-forming method using two plates and electronic device

Method for forming bumps, semiconductor device, and solder paste