Yasushi Yoshida

Person

Shiga-Ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plated substrate
- Patent number 12,297,542
- Issue date May 13, 2025
- Shibaura Institute of Technology
- Tomoji Ohishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for selectively coating electronic component with coating ma...
- Patent number 11,802,348
- Issue date Oct 31, 2023
- Murata Manufacturing Co., Ltd.
- Yasushi Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing chip type electronic parts including formin...
- Patent number 6,686,256
- Issue date Feb 3, 2004
- Murata Manufacturing Co, Ltd.
- Osamu Kanoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless copper plating bath, electroless copper plating method...
- Patent number 6,660,071
- Issue date Dec 9, 2003
- Murata Manufacturing Co., Ltd.
- Yasushi Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing chip type electronic parts
- Patent number 6,495,456
- Issue date Dec 17, 2002
- Murata Manufacturing Co., Ltd.
- Osamu Kanoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming electrode
- Patent number 6,358,390
- Issue date Mar 19, 2002
- Murata Manufacturing Co., Ltd.
- Yasushi Yoshida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing monolithic electronic parts
- Patent number 6,255,037
- Issue date Jul 3, 2001
- Murata Manufacturing Co., Ltd.
- Osamu Kanoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Activating catalytic solution for electroless plating and method fo...
- Patent number 5,989,787
- Issue date Nov 23, 1999
- Murata Manufacturing Co., Ltd.
- Osamu Kanoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Activating catalytic solution for electroless plating
- Patent number 5,746,809
- Issue date May 5, 1998
- Murata Manufacturing Co., Ltd.
- Osamu Kanoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THE...
- Publication number 20240212929
- Publication date Jun 27, 2024
- Murata Manufacturing Co., Ltd.
- Chiaki YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED SUBSTRATE
- Publication number 20220403524
- Publication date Dec 22, 2022
- SHIBAURA INSTITUTE OF TECHNOLOGY
- Tomoji OHISHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR SELECTIVELY COATING ELECTRONIC COMPONENT WITH COATING MA...
- Publication number 20190304684
- Publication date Oct 3, 2019
- Murata Manufacturing Co., Ltd.
- YASUSHI YOSHIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing chip type electronic parts
- Publication number 20020076926
- Publication date Jun 20, 2002
- Murata Manufacturing Co., Ltd.
- Osamu Kanoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless copper plating bath, electroless copper plating method...
- Publication number 20020011176
- Publication date Jan 31, 2002
- Murata Manufacturing Co., Ltd.
- Yasushi Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yasushi Yoshida

Person

Patents Grantslast 30 patents

Plated substrate

Method for selectively coating electronic component with coating ma...

Method of manufacturing chip type electronic parts including formin...

Electroless copper plating bath, electroless copper plating method...

Method of manufacturing chip type electronic parts

Method for forming electrode

Method for producing monolithic electronic parts

Activating catalytic solution for electroless plating and method fo...

Activating catalytic solution for electroless plating

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THE...

PLATED SUBSTRATE

METHOD FOR SELECTIVELY COATING ELECTRONIC COMPONENT WITH COATING MA...

Method of manufacturing chip type electronic parts

Electroless copper plating bath, electroless copper plating method...