Yat Kit Tsui

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Locally enhanced direct liquid cooling system for high power applic...
- Patent number 9,713,284
- Issue date Jul 18, 2017
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Ziyang Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Wafer-level device packaging
- Patent number 9,117,715
- Issue date Aug 25, 2015
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost backside illuminated CMOS image sensor package with high i...
- Patent number 8,823,126
- Issue date Sep 2, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Dan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming through-silicon-vias for multi-wafer integrated circuits
- Patent number 8,754,507
- Issue date Jun 17, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Bin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and method of via forming and method of via filling
- Patent number 8,232,626
- Issue date Jul 31, 2012
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Locally Enhanced Direct Liquid Cooling System for High Power Applic...
- Publication number 20170020027
- Publication date Jan 19, 2017
- Hong Kong Applied Science and Technology Research Institute Co. Ltd.
- Ziyang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL DEVICE PACKAGING
- Publication number 20140021596
- Publication date Jan 23, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST BACKSIDE ILLUMINATED CMOS IMAGE SENSOR PACKAGE WITH HIGH I...
- Publication number 20130292787
- Publication date Nov 7, 2013
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Dan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING THROUGH-SILICON-VIAS FOR MULTI-WAFER INTEGRATED CIRCUITS
- Publication number 20120181698
- Publication date Jul 19, 2012
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Bin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND METHOD OF VIA FORMING AND METHOD OF VIA FILLING
- Publication number 20110304026
- Publication date Dec 15, 2011
- Yat Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS