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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Thermoelectric semiconductor device and method of making same
Patent number
11,901,260
Issue date
Feb 13, 2024
Western Digital Technologies, Inc.
Jiandi Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip-chip package with reduced underfill area
Patent number
11,837,476
Issue date
Dec 5, 2023
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having thermally conductive pathways
Patent number
11,508,644
Issue date
Nov 22, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having thermally conductive layers for...
Patent number
11,488,883
Issue date
Nov 1, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Information
Patent Grant
Thermoelectric semiconductor device and method of making same
Patent number
11,444,001
Issue date
Sep 13, 2022
Western Digital Technologies, Inc.
Jiandi Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die and semiconductor package
Patent number
11,355,485
Issue date
Jun 7, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-module integrated interposer and semiconductor device formed...
Patent number
11,257,785
Issue date
Feb 22, 2022
Western Digital Technologies, Inc.
Cong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including control switches to reduce pin capac...
Patent number
11,177,239
Issue date
Nov 16, 2021
SanDisk Information Technology (Shanghai) Co., Ltd.
Shineng Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including high speed heterogeneous integrated...
Patent number
11,031,378
Issue date
Jun 8, 2021
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including through vias in molded columns
Patent number
10,872,856
Issue date
Dec 22, 2020
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device Package Die Stacking System and Method
Publication number
20230011439
Publication date
Jan 12, 2023
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Information
Patent Application
THERMOELECTRIC SEMICONDUCTOR DEVICE AND METHOD OF MAKING SAME
Publication number
20220415750
Publication date
Dec 29, 2022
Western Digital Technologies, Inc.
Jiandi Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...
Publication number
20220328374
Publication date
Oct 13, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE PATHWAYS
Publication number
20220216128
Publication date
Jul 7, 2022
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY CONDUCTIVE SILICONE COMPOSITION WITH HIGH ADHESION STR...
Publication number
20220154046
Publication date
May 19, 2022
Henkel AG & Co. KGaA
Anja Henckens
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE WITH REDUCED UNDERFILL AREA
Publication number
20210335628
Publication date
Oct 28, 2021
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING HIGH SPEED HETEROGENEOUS INTEGRATED...
Publication number
20200411479
Publication date
Dec 31, 2020
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND SEMICONDUCTOR PACKAGE
Publication number
20200411496
Publication date
Dec 31, 2020
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-MODULE INTEGRATED INTERPOSER AND SEMICONDUCTOR DEVICE FORMED...
Publication number
20200365554
Publication date
Nov 19, 2020
Western Digital Technologies, Inc.
Cong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS IN MOLDED COLUMNS
Publication number
20200006221
Publication date
Jan 2, 2020
Western Digital Technologies, Inc.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY
Publication number
20190189591
Publication date
Jun 20, 2019
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Yazhou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTROL SWITCHES TO REDUCE PIN CAPAC...
Publication number
20190006320
Publication date
Jan 3, 2019
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
Shineng Ma
H01 - BASIC ELECTRIC ELEMENTS