Yen-Chang Hu

Person

Tai-Chung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level embedded heat spreader
- Patent number 11,101,192
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 10,700,025
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level embedded heat spreader
- Patent number 10,177,073
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D die stacking structure with fine pitches
- Patent number 10,157,884
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging with interposer frame
- Patent number 9,991,190
- Issue date Jun 5, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage reduction and adhesion improvement of semiconductor die pac...
- Patent number 9,799,620
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level embedded heat spreader
- Patent number 9,735,087
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and packaging methods
- Patent number 9,418,969
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D die stacking structure with fine pitches
- Patent number 9,379,078
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 9,368,460
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 9,165,887
- Issue date Oct 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage reduction and adhesion improvement of semiconductor die pac...
- Patent number 9,087,832
- Issue date Jul 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral electrical connection of package on package
- Patent number 9,070,667
- Issue date Jun 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and packaging methods
- Patent number 9,035,461
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package on package devices with reversed...
- Patent number 8,922,005
- Issue date Dec 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package comprising bulk metal
- Patent number 8,866,285
- Issue date Oct 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-Package structures having buffer dams and method for for...
- Patent number 8,816,507
- Issue date Aug 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20200328169
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask
- Publication number 20200289860
- Publication date Sep 17, 2020
- HO TAN TRAN COMPANY LTD.
- Yen Jung Hu
- A41 - WEARING APPAREL
Information Patent Application
Wafer Level Embedded Heat Spreader
- Publication number 20190148264
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING A SEMICONDUCTOR DIE
- Publication number 20180286787
- Publication date Oct 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Embedded Heat Spreader
- Publication number 20170301608
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Die Stacking Structure with Fine Pitches
- Publication number 20160307876
- Publication date Oct 20, 2016
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Reduction and Adhesion Improvement of Semiconductor Die Pac...
- Publication number 20150303158
- Publication date Oct 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Packaging Methods
- Publication number 20150243636
- Publication date Aug 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Die Stacking Structure with Fine Pitches
- Publication number 20150123268
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Package on Package Devices with Reversed...
- Publication number 20150072476
- Publication date Mar 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS
- Publication number 20140335662
- Publication date Nov 13, 2014
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20140264930
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Reduction and Adhesion Improvement of Semiconductor Die Pac...
- Publication number 20140252647
- Publication date Sep 11, 2014
- Yu-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peripheral Electrical Connection of Package on Package
- Publication number 20140239507
- Publication date Aug 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Packaging Methods
- Publication number 20140210099
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods
- Publication number 20140127857
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- B32 - LAYERED PRODUCTS
Information Patent Application
Wafer Level Embedded Heat Spreader
- Publication number 20140077394
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20140070422
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Comprising Bulk Metal
- Publication number 20140061937
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE FREQUENCY MICROWAVE DEVICE AND METHOD FOR RECTIFYING WAFER...
- Publication number 20140042152
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS AND METHODS FOR FO...
- Publication number 20140027901
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING WITH INTERPOSER FRAME
- Publication number 20130307140
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Package on Package Devices with Reversed...
- Publication number 20130270682
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS

Yen-Chang Hu

Person

Patents Grantslast 30 patents

Fan-out interconnect structure and method for forming same

Wafer level embedded heat spreader

Fan-out interconnect structure and method for forming same

Wafer level embedded heat spreader

3D die stacking structure with fine pitches

Packaging with interposer frame

Warpage reduction and adhesion improvement of semiconductor die pac...

Wafer level embedded heat spreader

Packaged semiconductor devices and packaging methods

3D die stacking structure with fine pitches

Fan-out interconnect structure and method for forming same

Semiconductor device with discrete blocks

Warpage reduction and adhesion improvement of semiconductor die pac...

Peripheral electrical connection of package on package

Packaged semiconductor devices and packaging methods

Methods and apparatus for package on package devices with reversed...

Fan-out package comprising bulk metal

Package-on-Package structures having buffer dams and method for for...

Patents Applicationslast 30 patents

Fan-Out Interconnect Structure and Method for Forming Same

Mask

Wafer Level Embedded Heat Spreader

METHOD OF PACKAGING A SEMICONDUCTOR DIE

Wafer Level Embedded Heat Spreader

3D Die Stacking Structure with Fine Pitches

Warpage Reduction and Adhesion Improvement of Semiconductor Die Pac...

Packaged Semiconductor Devices and Packaging Methods

3D Die Stacking Structure with Fine Pitches

Methods and Apparatus for Package on Package Devices with Reversed...

METHODS FOR FORMING PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS

Fan-Out Interconnect Structure and Method for Forming Same

Warpage Reduction and Adhesion Improvement of Semiconductor Die Pac...

Peripheral Electrical Connection of Package on Package

Packaged Semiconductor Devices and Packaging Methods

Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods

Wafer Level Embedded Heat Spreader

Semiconductor Device with Discrete Blocks

Fan-Out Package Comprising Bulk Metal

VARIABLE FREQUENCY MICROWAVE DEVICE AND METHOD FOR RECTIFYING WAFER...

PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS AND METHODS FOR FO...

PACKAGING WITH INTERPOSER FRAME

Methods and Apparatus for Package on Package Devices with Reversed...