Yen-Hua Kuo

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Luzhu Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package substrates having pillars and related methods
- Patent number 8,866,311
- Issue date Oct 21, 2014
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrates having layered circuit segments, a...
- Patent number 8,686,568
- Issue date Apr 1, 2014
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATES HAVING PILLARS AND RELATED METHODS
- Publication number 20140084475
- Publication date Mar 27, 2014
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATES HAVING LAYERED CIRCUIT SEGMENTS AN...
- Publication number 20140084480
- Publication date Mar 27, 2014
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS