Yen-Yi Wu

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of wafer recycling
- Patent number 10,373,818
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor package and method of making a sem...
- Patent number 7,642,133
- Issue date Jan 5, 2010
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package and method of making the same
- Patent number 7,635,917
- Issue date Dec 22, 2009
- Advanced Semiconductor Engineering, Inc.
- Ching-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FAULT DIAGNOSIS IN COMMUNICATION NETWORK
- Publication number 20220366212
- Publication date Nov 17, 2022
- National Yang Ming Chiao Tung University
- Ta-Sung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF WAFER RECYCLING
- Publication number 20190237321
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20140312496
- Publication date Oct 23, 2014
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME
- Publication number 20080164595
- Publication date Jul 10, 2008
- Advanced Semiconductor Engineering, Inc.
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20080142957
- Publication date Jun 19, 2008
- Advanced Semiconductor Engineering, Inc.
- Ching-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor package and method of making a sem...
- Publication number 20080076208
- Publication date Mar 27, 2008
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor device
- Publication number 20080073769
- Publication date Mar 27, 2008
- Yen-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of wafer recycling

Method of making a semiconductor package and method of making a sem...

Three-dimensional package and method of making the same

Patents Applicationslast 30 patents

METHOD FOR FAULT DIAGNOSIS IN COMMUNICATION NETWORK

METHOD OF WAFER RECYCLING

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

STACKABLE SEMICONDUCTOR PACKAGE AND THE METHOD FOR MAKING THE SAME

THREE-DIMENSIONAL PACKAGE AND METHOD OF MAKING THE SAME

Method of making a semiconductor package and method of making a sem...

Semiconductor package and semiconductor device