Yeon Seop Yu

Person

Sungnam, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded printed circuit board
- Patent number 9,386,701
- Issue date Jul 5, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeon Seop Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACT...
- Publication number 20160234941
- Publication date Aug 11, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Seong-Ryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...
- Publication number 20160219713
- Publication date Jul 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Tae-Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE A...
- Publication number 20160212856
- Publication date Jul 21, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING...
- Publication number 20150366066
- Publication date Dec 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Tae-Seong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE A...
- Publication number 20150049445
- Publication date Feb 19, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20140151100
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yeon Seop YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yeon Seop Yu

Person

Patents Grantslast 30 patents

Electronic component embedded printed circuit board

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACT...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF M...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE A...

SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE A...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD