Yeong Beom Ko

Person

Gwangju, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 12,033,910
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 11,508,712
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 11,094,645
- Issue date Aug 17, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Hee Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,031,370
- Issue date Jun 8, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 10,867,984
- Issue date Dec 15, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 10,784,178
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 10,410,993
- Issue date Sep 10, 2019
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,381,313
- Issue date Aug 13, 2019
- Amkor Technology, Inc.
- Hee Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 10,290,621
- Issue date May 14, 2019
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 10,134,687
- Issue date Nov 20, 2018
- Amkor Technology, Inc.
- Hee Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 10,056,349
- Issue date Aug 21, 2018
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 9,837,376
- Issue date Dec 5, 2017
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 9,741,701
- Issue date Aug 22, 2017
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor devi...
- Patent number 9,490,231
- Issue date Nov 8, 2016
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266321
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20230187432
- Publication date Jun 15, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210366871
- Publication date Nov 25, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20210175222
- Publication date Jun 10, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210020535
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200194402
- Publication date Jun 18, 2020
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20190371739
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Hee Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20190312021
- Publication date Oct 10, 2019
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20190189566
- Publication date Jun 20, 2019
- Amkor Technology, Inc.
- Hee Sung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20180374820
- Publication date Dec 27, 2018
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20180102342
- Publication date Apr 12, 2018
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20170373051
- Publication date Dec 28, 2017
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170162519
- Publication date Jun 8, 2017
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20170117249
- Publication date Apr 27, 2017
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160133601
- Publication date May 12, 2016
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20160056079
- Publication date Feb 25, 2016
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...
- Publication number 20160056055
- Publication date Feb 25, 2016
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS

Yeong Beom Ko

Person

Patents Grantslast 30 patents

Wafer-level stack chip package and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Method of manufacturing a package-on-package type semiconductor pac...

Semiconductor device and method of manufacturing a semiconductor de...

Semiconductor device and manufacturing method thereof

Method of manufacturing a package-on-package type semiconductor pac...

Wafer-level stack chip package and method of manufacturing the same

Manufacturing method of semiconductor device and semiconductor devi...

Semiconductor device and method of manufacturing a semiconductor de...

Method of manufacturing a package-on-package type semiconductor pac...

Semiconductor device and method of manufacturing a semiconductor de...

Manufacturing method of semiconductor device and semiconductor devi...

Manufacturing method of semiconductor device and semiconductor devi...

Method of manufacturing a package-on-package type semiconductor pac...

Manufacturing method of semiconductor device and semiconductor devi...

Patents Applicationslast 30 patents

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVI...