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Yeong-Ching Chao

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  • Tainan, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Package structure of image sensor device
    • Publication number 20070152148
    • Publication date Jul 5, 2007
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method for fabricating a plurality of elastic probes in a row
    • Publication number 20070069750
    • Publication date Mar 29, 2007
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yi-Chang Lee
    • G01 - MEASURING TESTING
  • Information Patent Application

    Method for fabricating a plurality of elastic probes in a row
    • Publication number 20070069749
    • Publication date Mar 29, 2007
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yi-Chang Lee
    • G01 - MEASURING TESTING
  • Information Patent Application

    Method for fabricating a plurality of elastic probes in a row
    • Publication number 20060267607
    • Publication date Nov 30, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yi-Chang Lee
    • G01 - MEASURING TESTING
  • Information Patent Application

    Image sensor module package
    • Publication number 20060231750
    • Publication date Oct 19, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar grid array package
    • Publication number 20060231941
    • Publication date Oct 19, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Hsiang-Ming Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of manufacturing an injector plate
    • Publication number 20060211273
    • Publication date Sep 21, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Jiun-Heng Wang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    MODULARIZED PROBE CARD FOR HIGH FREQUENCY PROBING
    • Publication number 20060125498
    • Publication date Jun 15, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • An-Hong Liu
    • G01 - MEASURING TESTING
  • Information Patent Application

    Modularized probe head
    • Publication number 20060125501
    • Publication date Jun 15, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • An-Hong Liu
    • G01 - MEASURING TESTING
  • Information Patent Application

    Multi-chip image sensor module
    • Publication number 20060087018
    • Publication date Apr 27, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor assembly and method for fabricating the same
    • Publication number 20060087022
    • Publication date Apr 27, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package structure of image sensor device
    • Publication number 20060086890
    • Publication date Apr 27, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Structure of image sensor package
    • Publication number 20060086899
    • Publication date Apr 27, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Image sensor package
    • Publication number 20060087017
    • Publication date Apr 27, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yeong-Ching Chao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device with a warped spring connector
    • Publication number 20060042834
    • Publication date Mar 2, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yi-Chang Lee
    • G01 - MEASURING TESTING
  • Information Patent Application

    Bump structure of an opto-electronic chip
    • Publication number 20060043538
    • Publication date Mar 2, 2006
    • ChipMOS Technologies (Bermuda) Ltd.
    • Yi-Chang Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Modularized probe head
    • Publication number 20050088190
    • Publication date Apr 28, 2005
    • S.J. Cheng
    • G01 - MEASURING TESTING