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Electroless deposition apparatus
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Publication number 20050199489
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Publication date Sep 15, 2005
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APPLIED MATERIALS, INC.
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Joseph J. Stevens
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Two position anneal chamber
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Publication number 20040209414
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Publication date Oct 21, 2004
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APPLIED MATERIALS, INC.
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Yeuk-Fai Edwin Mok
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H01 - BASIC ELECTRIC ELEMENTS
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Multi-chemistry plating system
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Publication number 20040016637
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Publication date Jan 29, 2004
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APPLIED MATERIALS, INC.
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Michael X. Yang
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A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
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Electroless deposition apparatus
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Publication number 20030141018
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Publication date Jul 31, 2003
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APPLIED MATERIALS, INC.
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Joseph J. Stevens
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Electroless plating system
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Publication number 20030118732
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Publication date Jun 26, 2003
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Joseph J. Stevens
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Wafer chuck with plunger
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Publication number 20030034617
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Publication date Feb 20, 2003
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APPLIED MATERIALS, INC.
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Bernardo Donoso
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H01 - BASIC ELECTRIC ELEMENTS
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