Yeur-Luen Tu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 12,165,911
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective polysilicon growth for deep trench polysilicon isolation...
- Patent number 12,148,756
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having stacked metal oxide films as fixed charge film
- Patent number 12,080,738
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered polysilicon and oxygen-doped polysilicon design for R...
- Patent number 12,074,036
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of metal-free SOI wafer
- Patent number 12,040,221
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact for ion through-substrate via
- Patent number 11,929,379
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,916,091
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual facing BSI image sensors with wafer level stacking
- Patent number 11,894,408
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,855,159
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and method
- Patent number 11,855,109
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,830,764
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor scheme for optical and electrical improvement
- Patent number 11,705,470
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator wafer having a composite insulator layer
- Patent number 11,676,969
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with low defect count and method for manufactur...
- Patent number 11,610,808
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside illuminated photo-sensitive device with gradated buffer layer
- Patent number 11,611,005
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective polysilicon growth for deep trench polysilicon isolation...
- Patent number 11,594,597
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 11,545,513
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor-on-insulator (SOI) substrate
- Patent number 11,495,489
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor with a symmetrical capacitor insulator structure
- Patent number 11,430,729
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial semiconductor liner for enhancing uniformity of a charged...
- Patent number 11,404,465
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ru-Liang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact for ion through-substrate via
- Patent number 11,398,516
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wafer bonding
- Patent number 11,348,790
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,315,972
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method and apparatus with curved surfaces
- Patent number 11,276,587
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 11,270,978
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,264,469
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of metal-free SOI wafer
- Patent number 11,232,974
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of optimizing film deposition process in semiconductor fabri...
- Patent number 11,232,946
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rei-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate having dielectric struct...
- Patent number 11,232,975
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387578
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...
- Publication number 20240379684
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF METAL-FREE SOI WAFER
- Publication number 20240347377
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING
- Publication number 20240178263
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA
- Publication number 20240170524
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20230377948
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT
- Publication number 20230299105
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER
- Publication number 20230275097
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Liang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE
- Publication number 20220359273
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...
- Publication number 20220352308
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Publication number 20220352065
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...
- Publication number 20220328538
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ru-Liang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA
- Publication number 20220310691
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220310449
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER BONDING
- Publication number 20220285156
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YEONG-JYH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES
- Publication number 20220238662
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Integrated Circuit and Methods of Forming the Same
- Publication number 20220208607
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsun-Chung Kuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Buffer Layer(s) on a Stacked Structure Having a Via
- Publication number 20220189928
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF METAL-FREE SOI WAFER
- Publication number 20220139769
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRI...
- Publication number 20220139695
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rei-Lin CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Embedded Gettering in a Silicon On Insulat...
- Publication number 20220122849
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pu-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Device and Method
- Publication number 20220102396
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chang Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20220102397
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE
- Publication number 20220084935
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsing-Lien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED POLYSILICON AND OXYGEN-DOPED POLYSILICON DESIGN FOR R...
- Publication number 20220059364
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...
- Publication number 20210391362
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ru-Liang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210375962
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305131
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Facing BSI Image Sensors With Wafer Level Stacking
- Publication number 20210305292
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Yeur-Luen Tu

Person

Patents Grantslast 30 patents

Method for forming a semiconductor-on-insulator (SOI) substrate

Selective polysilicon growth for deep trench polysilicon isolation...

Image sensor having stacked metal oxide films as fixed charge film

Multi-layered polysilicon and oxygen-doped polysilicon design for R...

Fabrication method of metal-free SOI wafer

Buffer layer(s) on a stacked structure having a via

Conductive contact for ion through-substrate via

BSI image sensor and method of forming same

Dual facing BSI image sensors with wafer level stacking

Method for forming thin semiconductor-on-insulator (SOI) substrates

Image sensor device and method

Method for forming a semiconductor-on-insulator (SOI) substrate

Image sensor scheme for optical and electrical improvement

Semiconductor-on-insulator wafer having a composite insulator layer

Semiconductor wafer with low defect count and method for manufactur...

Backside illuminated photo-sensitive device with gradated buffer layer

Selective polysilicon growth for deep trench polysilicon isolation...

Image sensor having improved full well capacity and related method...

Method for forming a semiconductor-on-insulator (SOI) substrate

MIM capacitor with a symmetrical capacitor insulator structure

Epitaxial semiconductor liner for enhancing uniformity of a charged...

Conductive contact for ion through-substrate via

Apparatus and method for wafer bonding

BSI image sensor and method of forming same

Wafer bonding method and apparatus with curved surfaces

Buffer layer(s) on a stacked structure having a via

Method for forming thin semiconductor-on-insulator (SOI) substrates

Fabrication method of metal-free SOI wafer

Method of optimizing film deposition process in semiconductor fabri...

Semiconductor-on-insulator (SOI) substrate having dielectric struct...

Patents Applicationslast 30 patents

IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...

FABRICATION METHOD OF METAL-FREE SOI WAFER

DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING

CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT

SEMICONDUCTOR-ON-INSULATOR WAFER HAVING A COMPOSITE INSULATOR LAYER

METHOD FOR FORMING A SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATE

SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...

MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE

EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...

CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA

3D Integrated Circuit and Methods of Forming the Same

APPARATUS AND METHOD FOR WAFER BONDING

METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES

3D Integrated Circuit and Methods of Forming the Same

Buffer Layer(s) on a Stacked Structure Having a Via

FABRICATION METHOD OF METAL-FREE SOI WAFER

METHOD OF OPTIMIZING FILM DEPOSITION PROCESS IN SEMICONDUCTOR FABRI...

Structure and Method for Embedded Gettering in a Silicon On Insulat...

Image Sensor Device and Method

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

MIM CAPACITOR WITH A SYMMETRICAL CAPACITOR INSULATOR STRUCTURE

MULTI-LAYERED POLYSILICON AND OXYGEN-DOPED POLYSILICON DESIGN FOR R...

EPITAXIAL SEMICONDUCTOR LINER FOR ENHANCING UNIFORMITY OF A CHARGED...

IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Dual Facing BSI Image Sensors With Wafer Level Stacking