Yew Fatt Kok

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Newark, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
MULTICHIP PACKAGE STAIRCASE CAVITIES
- Publication number 20230101340
- Publication date Mar 30, 2023
- Intel Corporation
- Kaveh HOSSEINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220390694
- Publication date Dec 8, 2022
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS