Yi Ching Ong

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Memory device structure and manufacturing method thereof
- Patent number 12,200,943
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Ting Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy harvest and storage device for semiconductor chips and metho...
- Patent number 12,057,516
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER
- Publication number 20240397728
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Ting Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC MEMORY DEVICE COMPRISING A CHIMNEY SEED STRUCTURE
- Publication number 20240381662
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Yi Chen
Information Patent Application
INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE
- Publication number 20240379656
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20240371798
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20240355949
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE
- Publication number 20240332170
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC STRUCTURE LINING CONDUCTIVE INTERCONNECT STRUCTURE
- Publication number 20240274532
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240234401
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240147731
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240136346
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hung LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPREADER CONFIGURATION FOR PHASE CHANGE MATERIAL (PCM) SWITCH AND M...
- Publication number 20240130257
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai LI
Information Patent Application
PHASE CHANGE MATERIAL (PCM) SWITCH WITH VARIABLY SPACED SPREADER LA...
- Publication number 20240114812
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai LI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND...
- Publication number 20240099167
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai LI
Information Patent Application
PASSIVE DEVICES IN BONDING LAYERS
- Publication number 20240088026
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC TUNNEL JUNCTION (FTJ) STRUCTURES
- Publication number 20240057343
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC PLATES FOR ENHANCING INDUCTANCE AND METHODS OF FORMIN...
- Publication number 20240047508
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC TUNNEL JUNCTION DEVICE
- Publication number 20240040799
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE W...
- Publication number 20230422642
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PYROELECTRIC DEVICE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230413673
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC TUNNEL JUNCTION MEMORY DEVICES WITH ENHANCED READ WINDOW
- Publication number 20230403864
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Ting HSIEH
- G11 - INFORMATION STORAGE
Information Patent Application
FERROELECTRIC TUNNEL JUNCTIONS WITH CONDUCTIVE ELECTRODES HAVING AS...
- Publication number 20230403862
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC-BASED MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230389324
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR HEAT DISPERSION IN 3D INTEGRATED CIRCUIT
- Publication number 20230378016
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ta Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20230361057
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20230352612
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN STRUCTURE FOR INCREASING PERFORMANCE OF FERROELECTRIC MEMORY DE...
- Publication number 20230345733
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device and Method of Forming The Same
- Publication number 20230299042
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Structure and Manufacturing Method Thereof
- Publication number 20230292526
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Ting Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISSIPATION IN POWER IC USING PYROELECTRIC MATERIALS
- Publication number 20230268244
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS

Yi Ching Ong

Person

Patents Grantslast 30 patents

Memory device structure and manufacturing method thereof

Energy harvest and storage device for semiconductor chips and metho...

Patents Applicationslast 30 patents

FERROELECTRIC MEMORY DEVICE WITH SEMICONDUCTOR LAYER

MEMORY DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

FERROELECTRIC MEMORY DEVICE COMPRISING A CHIMNEY SEED STRUCTURE

INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

INDUCTOR EMBEDDED IN A SUBSTRATE OF A SEMICONDUCTOR DEVICE

FERROELECTRIC STRUCTURE LINING CONDUCTIVE INTERCONNECT STRUCTURE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SPREADER CONFIGURATION FOR PHASE CHANGE MATERIAL (PCM) SWITCH AND M...

PHASE CHANGE MATERIAL (PCM) SWITCH WITH VARIABLY SPACED SPREADER LA...

PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND...

PASSIVE DEVICES IN BONDING LAYERS

FERROELECTRIC TUNNEL JUNCTION (FTJ) STRUCTURES

FERROMAGNETIC PLATES FOR ENHANCING INDUCTANCE AND METHODS OF FORMIN...

FERROELECTRIC TUNNEL JUNCTION DEVICE

PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE W...

PYROELECTRIC DEVICE FOR A SEMICONDUCTOR DEVICE

FERROELECTRIC TUNNEL JUNCTION MEMORY DEVICES WITH ENHANCED READ WINDOW

FERROELECTRIC TUNNEL JUNCTIONS WITH CONDUCTIVE ELECTRODES HAVING AS...

FERROELECTRIC-BASED MEMORY DEVICE AND METHOD OF FORMING THE SAME

TECHNIQUES FOR HEAT DISPERSION IN 3D INTEGRATED CIRCUIT

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

FIN STRUCTURE FOR INCREASING PERFORMANCE OF FERROELECTRIC MEMORY DE...

Memory Device and Method of Forming The Same

Memory Device Structure and Manufacturing Method Thereof

THERMAL DISSIPATION IN POWER IC USING PYROELECTRIC MATERIALS