Patent Application
20230422642
Embodiments of the present disclosure relate generally to radio frequency (RF) devices, and more particularly to phase-change material (PCM) RF switching devices.
The semiconductor industry has experienced rapid growth due to ongoing improvements in the integration density of a variety of electronic components (e.g., transistors, diodes, resistors, capacitors, etc.). For the most part, improvement in integration density has resulted from iterative reduction of minimum feature size, which allows more components to be integrated into a given area. There is always a need to improve the performance of semiconductor devices.
Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
The following disclosure provides many different embodiments, or examples, for implementing different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
In addition, source/drain region(s) may refer to a source or a drain, individually or collectively dependent upon the context. For example, a device may include a first source/drain region and a second source/drain region, among other components. The first source/drain region may be a source region, whereas the second source/drain region may be a drain region, or vice versa. One of ordinary skill in the art would recognize many variations, modifications, and alternatives.
Some embodiments of the disclosure are described. Additional operations can be provided before, during, and/or after the stages described in these embodiments. Some of the stages that are described can be replaced or eliminated for different embodiments. Some of the features described below can be replaced or eliminated and additional features can be added for different embodiments. Although some embodiments are discussed with operations performed in a particular order, these operations may be performed in another logical order.
A radio frequency (RF) switch or a microwave switch (sometimes also referred to as an “RF switching device” or a “microwave switching device”) is a device to route high-frequency signals through transmission paths. RF or microwave switches are used extensively in microwave test systems for signal routing between instruments and devices under test (DUT). In addition, RF switches are widely used in wireless communication.
A phase-change material (PCM) RF switch is a new type of RF switch. PCM RF switches operate based on the PCM switching mechanism. The PCM switching mechanism is a mechanism of reversible switching of a PCM between resistive states, i.e., an amorphous OFF state (i.e., a high resistance state) and a crystalline ON state (i.e., a low resistance state). The reversible switching is enabled by changing the phase of the PCM, which includes a structure that may change phase between amorphous and crystalline based on, for example, temperature change sequences via joule heating. Joule heating involves the heat that is produced during the flow of an (electric) current through, for example, a conductive material. As the PCM changes phase from crystalline to amorphous, for example, due to heating and cooling sequences controlled by, for example, applied voltage biases from the control circuitry, the resistance of the PCM changes from low to high, respectively. Accordingly, a PCM RF switch can be turned on or off by switching between the high resistance state and the low resistance state.
Joule heating is typically controlled by temperature pulses (implemented by current pulses) with the desired pulse width and the desired falling time. In the reset operation (i.e., changing from the crystalline state to the amorphous state), a high current is used to raise the temperature of the PCM above its melting temperature, with a fast cooling (i.e., a short falling time) to quench the PCM to prevent re-crystallization. In the set operation (i.e., changing from the amorphous state to the crystalline state), a medium current is used to raise the temperature of the PCM above its crystallization temperature but below its melting temperature. The pulse width is relatively long for nucleation formation, while the falling time is relatively long for crystal growth.
In some implementations, a dielectric layer, such as a silicon nitride (SiN) layer, is inserted between the PCM and a heater element to insulate the heater element and the PCM and prevent phase segregation (i.e., change in PCM composition) after multiple cycles. Therefore, the Joule heating is indirect heating because of the presence of the silicon nitride layer. Indirect heating requires more power for switching. Thus, the efficiency of thermal transmission may be compromised.
The silicon nitride layer typically has a larger area than the heater element (i.e., extending horizontally beyond the heater element), and a portion of the heat that is generated by the heater element during the write operation is dissipated laterally instead of vertically. Thus, there is lateral thermal loss, and the power consumption during the write operation increases. The efficiency of thermal distribution is compromised.
Additionally, the lateral thermal dissipation results in a portion of the PCM that is not on the heater element not being fully reset (i.e., not fully amorphous, sometimes also referred to as “soft reset”) because the temperature there rises but does not reach the melting temperature. The soft reset portion of the PCM may contribute to the parasitic resistance. Soft reset will be described in greater detail below with reference to, for example,
Lastly, the extended silicon nitride layer also results in a large parasitic capacitance. A large parasitic capacitance negatively impacts the isolation in the OFF state (i.e., the attenuation of the undesired signal in the OFF state) of the PCM RF switch.
In accordance with some aspects of the disclosure, a phase-change material (PCM) switching device is provided. The PCM switching device includes a double-layered heater element and an air gap surrounding three sides of the double-layered heater element. In one embodiment, the double-layer heater element includes a first heater element comprising a first metal element and a second heater element comprising a second metal element. The first metal element is characterized by a first coefficient of thermal expansion (CTE), and the second metal element is characterized by a second CTE larger than the first CTE. In the write operation, the second heater element deforms, and a top surface of the second heater element protrudes upwardly toward the PCM region, which comprises a PCM. As such, a heat dissipation path is created. The PCM is switched between an amorphous state and a crystalline state in response to the heat generated. The PCM switching device is switched accordingly.
First, the efficiency of thermal distribution is increased because of the presence of the air gap and the double-layered heater element. There is no conventional dielectric layer between the double-layered heater element and the PCM region. As a result, no heat that is generated by the double-layered heater element is absorbed by the conventional dielectric layer. Moreover, since only the tip and a small region near the tip of the top surface of the second heater element are in contact with the bottom surface of the PCM region, lateral thermal dissipation is suppressed. Accordingly, the intended thermal transmission in the vertical direction is more concentrated or focused, the thermal transmission efficiency is further increased. The power needed during the write operation is reduced accordingly.
Second, the off-state capacitance is reduced. Due to the presence of the air gap (characterized by a relatively low dielectric constant of about 1) instead of the silicon nitride layer made of silicon nitride (characterized by a relatively high dielectric constant of 7 to 8) in a conventional PCM RF switch, the off-state capacitance is reduced, and the figure of merit (FOM) for the PCM RF switch is increased.
Third, the parasitic resistance in the read path due to soft reset is mitigated or prevented. The on-state resistance Ron is improved accordingly.
Details of the PCM switching device and these benefits will be described below with references to
Example PCM RF Switch
In the example shown in
The first heater element 120C is disposed on the top surface of the base dielectric layer 190. In one embodiment, the base dielectric layer 190 comprises silicon dioxide. In other embodiments, the base dielectric layer 190 comprises other dielectric materials. In one implementation, the base dielectric layer 190 is an interlayer dielectric layer over a semiconductor substrate comprising, for example, silicon. In another implementation, the base dielectric layer 190 is a dielectric layer on the top surface of a semiconductor substrate comprising, for example, silicon. It should be understood that these embodiments and implementations are not intended to be limiting.
In the example shown in
In the example shown in
Likewise, in some implementations, heater pads are located at a first end and a second end of the second heater element 121C, respectively. When a voltage is applied, electric current flows between the heater pads of the second heater element 121C through the second heater element 121C. As mentioned above, the heat generated by the second heater element 121C can be controlled by the electric current. In one implementation, the heater pads of the second heater element 121C have the same shape and size in the horizontal plane (i.e., the X-Y plane).
It is advantageous that the material of the first heater element 120C and the material of the second heater element 121C are characterized by a relatively high thermal conductivity and a relatively low electrical resistivity. The relatively high thermal conductivity contributes to better thermal transmission efficiency, whereas the relatively low electrical resistivity contributes to a higher write operation efficiency.
In some embodiments, the candidate materials of the first heater element 120C and the second heater element 121C include tungsten (W), titanium (Ti), aluminum (Al), and tantalum (Ta). Using the coefficient of linear thermal expansion (CLTE) as the measurement, the CLTE of tungsten (W) is 4.5×10−6 K−1; the CLTE of titanium (Ti) is 8.6×10−6 K−1; the CLTE of aluminum (Al) is 23.1×10−6 K−1; the CLTE of tantalum (Ta) is 6.4×10−6 K−1.
As will be explained below, the CLTE of the second heater element 121C is larger than the CLTE of the first heater element 120C. Therefore, the following combinations can be employed in different embodiments. In one embodiment, the first heater element 120C comprises tungsten (W); the second heater element 121C comprises tantalum (Ta). In another embodiment, the first heater element 120C comprises tungsten (W); the second heater element 121C comprises titanium (Ti). In yet another embodiment, the first heater element 120C comprises tungsten (W); the second heater element 121C comprises aluminum (Al). In still another embodiment, the first heater element 120C comprises tantalum (Ta); the second heater element 121C comprises titanium (Ti). In one embodiment, the first heater element 120C comprises tantalum (Ta); the second heater element 121C comprises aluminum (Al). In another embodiment, the first heater element 120C comprises titanium (Ti); the second heater element 121C comprises aluminum (Al).
The RF pads 110A and 110B are disposed on the base dielectric layer 190. The RF pad 110A is disposed at one side (in the X-direction) of the first heater element 120C and the second heater element 121C with an air gap portion 160A therebetween. The RF pad 110B is disposed at another side (in the X-direction) of the first heater element 120C and the second heater element 121C with an air gap portion 160B therebetween. In other words, the RF pad 110A and the RF pad 110B are disposed on the base dielectric layer 190 at two sides of the first heater element 120C and the second heater element 121C, respectively. Although the RF pads 110A and 110B are covered by the PCM region 180 in the example shown in
The PCM region 180 is disposed on the RF pads 110A and 110B. Two ends of the PCM region 180 in the X-direction are in contact with the RF pads 110A and 110B, respectively. Specifically, a first end of the PCM region 190 in the X-direction is disposed on and electrically connected to the RF pad 110A, and a second end of the PCM region 190 in the X-direction is disposed on and electrically connected to the RF pad 110B. A central region of the PCM region 180 between the first end and the second end is above the top surface 132 of the second heater element 121C with an air gap portion 160C therebetween. The air gap 160 (between the first and second heater elements 120C and 121C and the RF pads 110A and 110B and the PCM region 180) comprises the air gap portions 160A, 160B, and 160C. The air gap 160 surrounds the first heater element 120C and the second heater element 121C from three sides (i.e., the top side and two lateral sides).
As explained above, the resistive states of the PCM region 180 can go through reversible switching between amorphous and crystalline. As the PCM region 180 changes phase between crystalline and amorphous, the PCM RF switch is turned on or turned off accordingly.
In some examples, the PCM region 180 comprises one or more layers of a binary system of Ga—Sb, In—Sb, In—Se, Sb—Te, Ge—Te, and Ge—Sb; a ternary system of Ge Sb—Te, In—Sb—Te, Ga—Se—Te, Sn—Sb—Te, In—Sb—Ge, and Ga—Sb—Te; a quaternary system of Ag—In—Sb—Te, Ge—Sn—Sb—Te, Ge—Sb—Se—Te, Te—Ge—Sb—S, Ge—Sb—Te—O, and Ge—Sb—Te—N; a chalcogenide alloy containing one or more elements from Group VI of the periodic table, a Ge—Sb—Te alloy, Ge2Sb2Te5, tungsten oxide, nickel oxide, copper oxide, or combinations thereof. In one embodiment, the PCM of the PCM region 180 comprises germanium telluride (GeTe). In one embodiment, the PCM of the PCM region 180 comprises antimony telluride (Sb2Te3). It should be understood that these materials are exemplary rather than limiting. In some implementations, the PCM region 180 is formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), pulsed laser deposition (PLD), sputtering, atomic layer deposition (ALD), or any other suitable thin film deposition processes.
The phase transition between the crystalline phase and the amorphous phase of the PCM region 180 is related to the interplay between the long-range order and the short-range order of the structure of the material of the PCM region 180. For example, the collapse of the long-range order generates the amorphous phase. The long-range order in the crystalline phase facilitates electrical conduction, while the amorphous phase impedes electrical conduction and results in high electrical resistance. To tune the properties of the PCM region 180 for different needs, the material of the PCM region 180 may be doped with various elements at different amounts to adjust the proportion of the short-range order and the long-range order inside the bonding structure of the material. The doped element may be any element used for semiconductor doping through the use of, for example, ion implantation or diffusion.
As shown in
Example Write Operation
As shown in
However, the coefficient of thermal expansion (CTE) of the second heater element 121C is larger than the CTE of the first heater element 120C. The CTE of a material is a property that is indicative of the extent to which a material expands upon heating. Different materials have different CTEs. Because the CTE of the second heater element 121C is larger than the CTE of the first heater element 120C, the second heater element 121C expands more than the first heater element 120C upon heating during the write operation. As a result, the second heater element 121C deforms.
In the example shown in
When the temperature of the PCM region 180 is above the melting temperature of the PCM region 180, the PCM region 180 changes from the crystalline state to the amorphous state and transforms to a high resistance state. When the temperature of the PCM region 180 is above the crystallization temperature, but below the melting temperature of the PCM region 180, the PCM region 180 changes from the amorphous state to the crystalline state and transforms into a low resistance state.
The efficiency of thermal distribution is increased because of the presence of the air gap 160 and the double-layered heater element 123C. There is no conventional dielectric layer between the double-layered heater element 123C and the PCM region 180. As a result, no heat that is generated by the double-layered heater element 123C is absorbed by the conventional dielectric layer. Moreover, since only the tip 136 and a small region near the tip of the top surface 132 of the second heater element 121C are in contact with the bottom surface 138 of the PCM region 180, lateral thermal dissipation is suppressed. Accordingly, the intended thermal transmission in the vertical direction is more concentrated or focused, the thermal transmission efficiency is further increased. The power needed during the write operation is reduced accordingly.
The off-state capacitance Coff is reduced. As shown in
Mitigating or Preventing Parasitic Resistance Related to Soft Reset
In a conventional structure, a portion of the PCM region on both sides of the overlapping area between the heater element and the PCM region is soft reset due to the lateral thermal dissipation.
In contrast, the PCM RF switch 100 shown in
Example Process Flow
The method 400 starts with operation 402. At operation 402, a base dielectric layer is provided. In one implementation, the base dielectric layer is an interlayer dielectric layer over a semiconductor substrate comprising, for example, silicon. In another implementation, the base dielectric layer is a dielectric layer on the top surface of a semiconductor substrate comprising, for example, silicon. It should be understood that these implementations are not intended to be limiting.
In the example shown in
At operation 404, a first heater element layer is formed on the base dielectric layer. The first heater element layer comprises a first metal element. The second metal element is characterized by a first CTE. In one implementation, the first heater element layer is formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), pulsed laser deposition (PLD), sputtering, atomic layer deposition (ALD), or any other suitable processes.
At operation 406, a second heater element layer is formed on the first heater element layer. The second heater element layer comprises a second metal element. The second metal element is characterized by a second CTE. The second CTE is larger than the first CTE. In one implementation, the first heater element layer is formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), pulsed laser deposition (PLD), sputtering, atomic layer deposition (ALD), or any other suitable processes.
At operation 408, the second heater element and the first heater element are patterned and etched to form the second heater element and the first heater element. In one implementation, a photoresist layer is formed on the second heater element layer and then patterned, using photolithography, and the exposed region of the second heater element layer and the first heater element layer is etched subsequently.
In the example shown in
In one embodiment, the first heater element 120C comprises tungsten (W); the second heater element 121C comprises tantalum (Ta). In another embodiment, the first heater element 120C comprises tungsten (W); the second heater element 121C comprises titanium (Ti). In yet another embodiment, the first heater element 120C comprises tungsten (W); the second heater element 121C comprises aluminum (Al). In still another embodiment, the first heater element 120C comprises tantalum (Ta); the second heater element 121C comprises titanium (Ti). In one embodiment, the first heater element 120C comprises tantalum (Ta); the second heater element 121C comprises aluminum (Al). In another embodiment, the first heater element 120C comprises titanium (Ti); the second heater element 121C comprises aluminum (Al).
At operation 410, a first metal layer is formed. In one implementation, the first heater element layer is formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), pulsed laser deposition (PLD), sputtering, atomic layer deposition (ALD), or any other suitable processes. In the example shown in
At operation 412, the first metal layer is patterned and etched to form RF pads. In one implementation, a photoresist layer is formed on the first metal layer and then patterned, using photolithography, and the exposed region of the first metal layer is etched subsequently.
In the example shown in
At operation 414, a sacrificial region is formed. The sacrificial region surrounds the first heater element and the second heater element from the top side and two lateral sides. The sacrificial region is made of a material that is selectively removable in the subsequent sacrificial release process. In one embodiment, the sacrificial region comprises silicon nitride. In another embodiment, the sacrificial region is an organic dielectric layer (ODL). It should be understood that the sacrificial region may comprise other suitable materials in other embodiments. In some implementations, the sacrificial region is formed by forming a sacrificial layer and performing a planarization process such as a chemical-mechanical polishing (CMP) process to remove the excessive portion of the sacrificial layer.
In the example shown in
At operation 416, a PCM layer is formed. The PCM layer is formed on the top of the top surface of the base dielectric layer, the top surface of the RF pads, and the top surface of the sacrificial region. As mentioned above, the PCM layer may comprise one or more layers of a binary system of Ga—Sb, In—Sb, In—Se, Sb—Te, Ge—Te, and Ge—Sb; a ternary system of Ge—Sb—Te, In—Sb—Te, Ga—Se—Te, Sn—Sb—Te, In—Sb—Ge, and Ga—Sb—Te; a quaternary system of Ag—In—Sb—Te, Ge—Sn—Sb—Te, Ge—Sb—Se—Te, Te—Ge—Sb—S, Ge—Sb—Te—O, and Ge—Sb—Te—N; a chalcogenide alloy containing one or more elements from Group VI of the periodic table, a Ge—Sb—Te alloy, Ge2Sb2Te5, tungsten oxide, nickel oxide, copper oxide, or combinations thereof. It should be understood that these materials are exemplary rather than limiting.
In some implementations, the PCM layer is formed by chemical vapor deposition (CVD), physical vapor deposition (PVD), pulsed laser deposition (PLD), sputtering, atomic layer deposition (ALD), or any other suitable thin film deposition processes.
In the example shown in
At operation 418, the PCM layer is patterned and etched to form a PCM region. In one implementation, a photoresist layer is formed on the PCM layer formed at operation 416 and then patterned, using photolithography, and the exposed region of the PCM layer is etched subsequently.
In the example shown in
At operation 420, the sacrificial region is removed. In one implementation, the sacrificial region is removed using the sacrificial release process. As explained above, the sacrificial region is made of a material that is selectively removable in the subsequent sacrificial release process. After the sacrificial region is removed, the air gap is formed.
The sacrificial release process is a process where a structure is formed on the sacrificial region that is later removed to leave a gap between the structure and the structure or layer under the sacrificial region. In some implementations, a release aperture is fabricated using, for example, various lithography and etch techniques. The release aperture then provides access to the sacrificial region for the etchant used in the sacrificial release process. The etchant starts etching through the release aperture and etches its way into the cavity. The size of the release aperture, along with other parameters such as the temperature, determines the etch rate of the sacrificial region and can be designed accordingly. It should be understood that the above examples are not intended to be limiting. In some implementations, multiple release apertures can be used.
In the example shown in
It should be understood that additional operations may be employed in addition to operations 402 to 420. For example, an additional dielectric layer can be formed, patterned, and etched, and vias that are vertically connected to the RF pads 110A and 110B (where the RF pads 110A and 110B are not covered by the PCM region 180) are subsequently formed in the additional dielectric layer.
Example Operation of the PCM RF Switch
At operation 602, a current flowing through the first heater element 120C and the second heater element 121C is generated, and heat is generated by the first heater element 120C and the second heater element 121C as a result. In one implementation, the current is generated by applying a bias at two ends of the first heater element 120C and the second heater element 121C.
At operation 604, the second heater element 121C is deformed, in response to the heat generated by the first heater element 120C and the second heater element 121C, such that the top surface 132 of the second heater element 121C is in contact with the bottom surface 138 of the PCM region 180. As such, a heat dissipation path 139 is created.
At operation 606, the PCM of the PCM region 180 is switched between an amorphous state and a crystalline state in response to the heat generated by the first heater element 120C and the second heater element 121C and dissipated through the second heater element 121C. The amorphous state corresponds to a high resistance state. The crystalline state corresponds to a low resistance state.
At operation 608, the PCM switching device (i.e., the PCM RF switch) 100 is switched between an ON state and an OFF state in response to the amorphous state and the crystalline state of the PCM of the PCM region 180. The read path extending in the X-direction is created or cut off accordingly, which can be read from the voltage between the RF pads 110A and 110B.
In accordance with some aspects of the disclosure, a PCM switching device is provided. The PCM switching device includes: a base dielectric layer over a semiconductor substrate; a first heater element disposed on the base dielectric layer, the first heater element comprising a first metal element characterized by a first coefficient of thermal expansion (CTE); a second heater element disposed on the first heater element, the second heater element comprising a second metal element characterized by a second CTE, wherein the second CTE is larger than the first CTE; a first metal pad disposed on the base dielectric layer, wherein the first metal pad is lateral to a first side, in a first horizontal direction, of the first heater element and the second heater element with a first air gap portion therebetween; a second metal pad disposed on the base dielectric layer, wherein the second metal pad is lateral to a second side, in the first horizontal direction, of the first heater element and the second heater element with a second air gap portion therebetween; and a PCM region comprising a PCM operable to switch between an amorphous state and a crystalline state in response to heat generated by the first heater element and the second heater element, wherein the PCM region is above a top surface of the second heater element with a third air gap portion therebetween.
In accordance with some aspects of the disclosure, a method of fabricating a PCM switching device is provided. The method includes the following steps: providing a base dielectric layer; forming a first heater element on the base dielectric layer, the first heater element comprising a first metal element characterized by a first coefficient of thermal expansion (CTE); forming a second heater element on the first heater element, the second heater element comprising a second metal element characterized by a second CTE larger than the first CTE; forming a first metal pad on the base dielectric layer, wherein the first metal pad is lateral to a first side, in a first horizontal direction, of the first heater element and the second heater element with a first air gap portion therebetween; forming a second metal pad on the base dielectric layer, wherein the second metal pad is lateral to a second side, in the first horizontal direction, of the first heater element and the second heater element with a second air gap portion therebetween; and forming a PCM region on the first metal pad and the second metal pad and above a top surface of the second heater element with a third air gap portion therebetween, wherein the PCM region comprises a PCM operable to switch between an amorphous state and a crystalline state in response to heat generated by the first heater element and the second heater element.
In accordance with some aspects of the disclosure, a PCM switching device is provided. The PCM switching device includes: a base dielectric layer over a semiconductor substrate; a first heater element disposed on the base dielectric layer, the first heater element comprising a first metal element characterized by a first coefficient of thermal expansion (CTE); a second heater element disposed on the first heater element, the second heater element comprising a second metal element characterized by a second CTE, wherein the second CTE is larger than the first CTE; a first metal pad and a second metal pad disposed on the base dielectric layer at two sides of the first heater element and the second heater element, respectively; and a PCM region comprising a PCM operable to switch between an amorphous state and a crystalline state in response to heat generated by the first heater element and the second heater element, wherein the PCM region is disposed on the first metal pad and the second metal pad and above a top surface of the second heater element, and an air gap surrounds the first heater element and the second heater element from three sides.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
