Yi-hsiung Lin

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Fishkill, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Multiple layer resist scheme implementing etch recipe particular to...
- Patent number 7,352,064
- Issue date Apr 1, 2008
- International Business Machines Corporation
- Nicholas C. M. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene structure and method
- Patent number 7,091,612
- Issue date Aug 15, 2006
- Infineon Technologies AG
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning damascene structure in integrated circuit design
- Patent number 6,949,459
- Issue date Sep 27, 2005
- International Business Machines Corporation
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming fusible links
- Patent number 6,750,129
- Issue date Jun 15, 2004
- Infineon Technologies AG
- Gwo-Shii Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multiple Layer Resist Scheme Implementing Etch Recipe Particular to...
- Publication number 20060094230
- Publication date May 4, 2006
- International Business Machines Corporation
- Nicholas C.M. Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ liner formation during reactive ion etch
- Publication number 20050176237
- Publication date Aug 11, 2005
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of patterning damascene structure in integrated circuit design
- Publication number 20050101128
- Publication date May 12, 2005
- Frederick W. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene structure and method
- Publication number 20050077628
- Publication date Apr 14, 2005
- Kaushik Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING FUSIBLE LINKS
- Publication number 20040092091
- Publication date May 13, 2004
- Gwo-Shii Yang
- H01 - BASIC ELECTRIC ELEMENTS